| X1226S8T1功能数量 |
1
|
| X1226S8T1端子数量 |
8
|
| X1226S8T1最大工作温度 |
70 Cel
|
| X1226S8T1最小工作温度 |
0.0 Cel
|
| X1226S8T1最大供电/工作电压 |
5.5 V
|
| X1226S8T1最小供电/工作电压 |
2.7 V
|
| X1226S8T1额定供电电压 |
5 V
|
| X1226S8T1加工封装描述 |
0.150 INCH, SOIC-8
|
| X1226S8T1状态 |
DISCONTINUED
|
| X1226S8T1工艺 |
CMOS
|
| X1226S8T1包装形状 |
矩形的
|
| X1226S8T1包装尺寸 |
SMALL OUTLINE
|
| X1226S8T1表面贴装 |
Yes
|
| X1226S8T1端子形式 |
GULL WING
|
| X1226S8T1端子间距 |
1.27 mm
|
| X1226S8T1端子涂层 |
锡 铅
|
| X1226S8T1端子位置 |
双
|
| X1226S8T1包装材料 |
塑料/环氧树脂
|
| X1226S8T1温度等级 |
COMMERCIAL
|
| X1226S8T1最大FCLK时钟频率 |
0.0320 MHz
|
| X1226S8T1信息存取方法 |
I2C
|
| X1226S8T1微处理器类型 |
实时时钟
|
| X1226S8T1计时器数量 |
1
|
