| XC2C256-7TQ144I功能数量 |
1
|
| XC2C256-7TQ144I端子数量 |
144
|
| XC2C256-7TQ144I最大工作温度 |
85 Cel
|
| XC2C256-7TQ144I最小工作温度 |
-40 Cel
|
| XC2C256-7TQ144I最大供电/工作电压 |
1.9 V
|
| XC2C256-7TQ144I最小供电/工作电压 |
1.7 V
|
| XC2C256-7TQ144I额定供电电压 |
1.8 V
|
| XC2C256-7TQ144I输入输出总线数量 |
118
|
| XC2C256-7TQ144I加工封装描述 |
20 × 20 MM, 0.50 MM PITCH, TQFP-144
|
| XC2C256-7TQ144I状态 |
ACTIVE
|
| XC2C256-7TQ144I工艺 |
CMOS
|
| XC2C256-7TQ144I包装形状 |
SQUARE
|
| XC2C256-7TQ144I包装尺寸 |
FLATPACK, 低 PROFILE, FINE PITCH
|
| XC2C256-7TQ144I表面贴装 |
Yes
|
| XC2C256-7TQ144I端子形式 |
GULL WING
|
| XC2C256-7TQ144I端子间距 |
0.5000 mm
|
| XC2C256-7TQ144I端子涂层 |
锡 铅
|
| XC2C256-7TQ144I端子位置 |
四
|
| XC2C256-7TQ144I包装材料 |
塑料/环氧树脂
|
| XC2C256-7TQ144I温度等级 |
INDUSTRIAL
|
| XC2C256-7TQ144I组织 |
0 DEDICATED INPUTS, 118 I/O
|
| XC2C256-7TQ144I输出功能 |
MACROCELL
|
| XC2C256-7TQ144I可编程逻辑类型 |
闪存可编程逻辑器件
|
| XC2C256-7TQ144I传播延迟TPD |
7.5 ns
|
| XC2C256-7TQ144I专用输入数量 |
0.0
|
