| XC3S1400AN-4FGG484C功能数量 |
1
|
| XC3S1400AN-4FGG484C端子数量 |
484
|
| XC3S1400AN-4FGG484C最大工作温度 |
85 Cel
|
| XC3S1400AN-4FGG484C最小工作温度 |
0.0 Cel
|
| XC3S1400AN-4FGG484C最大供电/工作电压 |
1.26 V
|
| XC3S1400AN-4FGG484C最小供电/工作电压 |
1.14 V
|
| XC3S1400AN-4FGG484C额定供电电压 |
1.2 V
|
| XC3S1400AN-4FGG484C加工封装描述 |
ROHS COMPLIANT, FBGA-484
|
| XC3S1400AN-4FGG484C状态 |
EOL/LIFEBUY
|
| XC3S1400AN-4FGG484C工艺 |
CMOS
|
| XC3S1400AN-4FGG484C包装形状 |
SQUARE
|
| XC3S1400AN-4FGG484C包装尺寸 |
GRID 阵列
|
| XC3S1400AN-4FGG484C表面贴装 |
Yes
|
| XC3S1400AN-4FGG484C端子形式 |
BALL
|
| XC3S1400AN-4FGG484C端子间距 |
1 mm
|
| XC3S1400AN-4FGG484C端子涂层 |
NOT SPECIFIED
|
| XC3S1400AN-4FGG484C端子位置 |
BOTTOM
|
| XC3S1400AN-4FGG484C包装材料 |
塑料/环氧树脂
|
| XC3S1400AN-4FGG484C温度等级 |
其他
|
| XC3S1400AN-4FGG484C组织 |
2816 CLBS, 1400000 门
|
| XC3S1400AN-4FGG484C最大FCLK时钟频率 |
667 MHz
|
| XC3S1400AN-4FGG484C可配置逻辑模块数量 |
2816
|
| XC3S1400AN-4FGG484C可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|
| XC3S1400AN-4FGG484C等效门电路数量 |
1.40E6
|
| XC3S1400AN-4FGG484C一个CLB模块最大延时 |
4.88 ns
|
