| XC3S700AN-4FGG400I功能数量 |
1
|
| XC3S700AN-4FGG400I端子数量 |
400
|
| XC3S700AN-4FGG400I最大工作温度 |
100 Cel
|
| XC3S700AN-4FGG400I最小工作温度 |
-40 Cel
|
| XC3S700AN-4FGG400I最大供电/工作电压 |
1.26 V
|
| XC3S700AN-4FGG400I最小供电/工作电压 |
1.14 V
|
| XC3S700AN-4FGG400I额定供电电压 |
1.2 V
|
| XC3S700AN-4FGG400I加工封装描述 |
ROHS COMPLIANT, FBGA-400
|
| XC3S700AN-4FGG400I状态 |
ACTIVE
|
| XC3S700AN-4FGG400I工艺 |
CMOS
|
| XC3S700AN-4FGG400I包装形状 |
SQUARE
|
| XC3S700AN-4FGG400I包装尺寸 |
GRID 阵列
|
| XC3S700AN-4FGG400I表面贴装 |
Yes
|
| XC3S700AN-4FGG400I端子形式 |
BALL
|
| XC3S700AN-4FGG400I端子间距 |
1 mm
|
| XC3S700AN-4FGG400I端子涂层 |
NOT SPECIFIED
|
| XC3S700AN-4FGG400I端子位置 |
BOTTOM
|
| XC3S700AN-4FGG400I包装材料 |
塑料/环氧树脂
|
| XC3S700AN-4FGG400I温度等级 |
INDUSTRIAL
|
| XC3S700AN-4FGG400I组织 |
1472 CLBS, 700000 门
|
| XC3S700AN-4FGG400I最大FCLK时钟频率 |
667 MHz
|
| XC3S700AN-4FGG400I可配置逻辑模块数量 |
1472
|
| XC3S700AN-4FGG400I可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|
| XC3S700AN-4FGG400I等效门电路数量 |
700000
|
| XC3S700AN-4FGG400I一个CLB模块最大延时 |
4.88 ns
|
