| XC5VLX30T-1FF665C功能数量 |
1
|
| XC5VLX30T-1FF665C端子数量 |
665
|
| XC5VLX30T-1FF665C最大工作温度 |
85 Cel
|
| XC5VLX30T-1FF665C最小工作温度 |
0.0 Cel
|
| XC5VLX30T-1FF665C最大供电/工作电压 |
1.05 V
|
| XC5VLX30T-1FF665C最小供电/工作电压 |
0.9500 V
|
| XC5VLX30T-1FF665C额定供电电压 |
1 V
|
| XC5VLX30T-1FF665C加工封装描述 |
27 × 27 MM, FBGA-665
|
| XC5VLX30T-1FF665C状态 |
ACTIVE
|
| XC5VLX30T-1FF665C工艺 |
CMOS
|
| XC5VLX30T-1FF665C包装形状 |
SQUARE
|
| XC5VLX30T-1FF665C包装尺寸 |
GRID 阵列
|
| XC5VLX30T-1FF665C表面贴装 |
Yes
|
| XC5VLX30T-1FF665C端子形式 |
BALL
|
| XC5VLX30T-1FF665C端子间距 |
1 mm
|
| XC5VLX30T-1FF665C端子涂层 |
锡 铅
|
| XC5VLX30T-1FF665C端子位置 |
BOTTOM
|
| XC5VLX30T-1FF665C包装材料 |
塑料/环氧树脂
|
| XC5VLX30T-1FF665C温度等级 |
其他
|
| XC5VLX30T-1FF665C组织 |
2400 CLBS
|
| XC5VLX30T-1FF665C最大FCLK时钟频率 |
1098 MHz
|
| XC5VLX30T-1FF665C可配置逻辑模块数量 |
2400
|
| XC5VLX30T-1FF665C可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|
