XC5VLX50-1FFG676I功能数量 |
1
|
XC5VLX50-1FFG676I端子数量 |
676
|
XC5VLX50-1FFG676I最大供电/工作电压 |
1.05 V
|
XC5VLX50-1FFG676I最小供电/工作电压 |
0.9500 V
|
XC5VLX50-1FFG676I额定供电电压 |
1 V
|
XC5VLX50-1FFG676I加工封装描述 |
27 × 27 MM, 铅 FREE, FBGA-676
|
XC5VLX50-1FFG676I无铅 |
Yes
|
XC5VLX50-1FFG676I欧盟RoHS规范 |
Yes
|
XC5VLX50-1FFG676I状态 |
ACTIVE
|
XC5VLX50-1FFG676I工艺 |
CMOS
|
XC5VLX50-1FFG676I包装形状 |
SQUARE
|
XC5VLX50-1FFG676I包装尺寸 |
GRID 阵列
|
XC5VLX50-1FFG676I表面贴装 |
Yes
|
XC5VLX50-1FFG676I端子形式 |
BALL
|
XC5VLX50-1FFG676I端子间距 |
1 mm
|
XC5VLX50-1FFG676I端子涂层 |
锡 银 铜
|
XC5VLX50-1FFG676I端子位置 |
BOTTOM
|
XC5VLX50-1FFG676I包装材料 |
塑料/环氧树脂
|
XC5VLX50-1FFG676I组织 |
3600 CLBS
|
XC5VLX50-1FFG676I最大FCLK时钟频率 |
1098 MHz
|
XC5VLX50-1FFG676I可配置逻辑模块数量 |
3600
|
XC5VLX50-1FFG676I可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|