| XC6VSX315T-1FFG1156C功能数量 |
1
|
| XC6VSX315T-1FFG1156C端子数量 |
1156
|
| XC6VSX315T-1FFG1156C最大工作温度 |
85 Cel
|
| XC6VSX315T-1FFG1156C最小工作温度 |
0.0 Cel
|
| XC6VSX315T-1FFG1156C最大供电/工作电压 |
1.05 V
|
| XC6VSX315T-1FFG1156C最小供电/工作电压 |
0.9500 V
|
| XC6VSX315T-1FFG1156C额定供电电压 |
1 V
|
| XC6VSX315T-1FFG1156C加工封装描述 |
35 × 35 MM, 铅 FREE, FBGA-1156
|
| XC6VSX315T-1FFG1156C无铅 |
Yes
|
| XC6VSX315T-1FFG1156C欧盟RoHS规范 |
Yes
|
| XC6VSX315T-1FFG1156C状态 |
ACTIVE
|
| XC6VSX315T-1FFG1156C工艺 |
CMOS
|
| XC6VSX315T-1FFG1156C包装形状 |
SQUARE
|
| XC6VSX315T-1FFG1156C包装尺寸 |
GRID 阵列
|
| XC6VSX315T-1FFG1156C表面贴装 |
Yes
|
| XC6VSX315T-1FFG1156C端子形式 |
BALL
|
| XC6VSX315T-1FFG1156C端子间距 |
1 mm
|
| XC6VSX315T-1FFG1156C端子涂层 |
锡 银 铜
|
| XC6VSX315T-1FFG1156C端子位置 |
BOTTOM
|
| XC6VSX315T-1FFG1156C包装材料 |
塑料/环氧树脂
|
| XC6VSX315T-1FFG1156C温度等级 |
其他
|
| XC6VSX315T-1FFG1156C最大FCLK时钟频率 |
1098 MHz
|
| XC6VSX315T-1FFG1156C可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|
| XC6VSX315T-1FFG1156C一个CLB模块最大延时 |
5.08 ns
|
