| XC6VSX475T-L1FFG1156I功能数量 |
1
|
| XC6VSX475T-L1FFG1156I端子数量 |
1156
|
| XC6VSX475T-L1FFG1156I最大工作温度 |
100 Cel
|
| XC6VSX475T-L1FFG1156I最小工作温度 |
-40 Cel
|
| XC6VSX475T-L1FFG1156I最大供电/工作电压 |
0.9300 V
|
| XC6VSX475T-L1FFG1156I最小供电/工作电压 |
0.8700 V
|
| XC6VSX475T-L1FFG1156I额定供电电压 |
0.9000 V
|
| XC6VSX475T-L1FFG1156I加工封装描述 |
35 × 35 MM, 铅 FREE, FBGA-1156
|
| XC6VSX475T-L1FFG1156I无铅 |
Yes
|
| XC6VSX475T-L1FFG1156I欧盟RoHS规范 |
Yes
|
| XC6VSX475T-L1FFG1156I状态 |
ACTIVE
|
| XC6VSX475T-L1FFG1156I工艺 |
CMOS
|
| XC6VSX475T-L1FFG1156I包装形状 |
SQUARE
|
| XC6VSX475T-L1FFG1156I包装尺寸 |
GRID 阵列
|
| XC6VSX475T-L1FFG1156I表面贴装 |
Yes
|
| XC6VSX475T-L1FFG1156I端子形式 |
BALL
|
| XC6VSX475T-L1FFG1156I端子间距 |
1 mm
|
| XC6VSX475T-L1FFG1156I端子涂层 |
锡 银 铜
|
| XC6VSX475T-L1FFG1156I端子位置 |
BOTTOM
|
| XC6VSX475T-L1FFG1156I包装材料 |
塑料/环氧树脂
|
| XC6VSX475T-L1FFG1156I温度等级 |
INDUSTRIAL
|
| XC6VSX475T-L1FFG1156I最大FCLK时钟频率 |
1098 MHz
|
| XC6VSX475T-L1FFG1156I可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|
| XC6VSX475T-L1FFG1156I一个CLB模块最大延时 |
5.87 ns
|
