| XC7VX485T-1FFG1761C功能数量 |
1
|
| XC7VX485T-1FFG1761C端子数量 |
1761
|
| XC7VX485T-1FFG1761C加工封装描述 |
铅 FREE, FBGA-1767
|
| XC7VX485T-1FFG1761C无铅 |
Yes
|
| XC7VX485T-1FFG1761C欧盟RoHS规范 |
Yes
|
| XC7VX485T-1FFG1761C状态 |
ACTIVE
|
| XC7VX485T-1FFG1761C包装形状 |
SQUARE
|
| XC7VX485T-1FFG1761C包装尺寸 |
GRID 阵列
|
| XC7VX485T-1FFG1761C表面贴装 |
Yes
|
| XC7VX485T-1FFG1761C端子形式 |
BALL
|
| XC7VX485T-1FFG1761C端子间距 |
1 mm
|
| XC7VX485T-1FFG1761C端子涂层 |
锡 银 铜
|
| XC7VX485T-1FFG1761C端子位置 |
BOTTOM
|
| XC7VX485T-1FFG1761C包装材料 |
塑料/环氧树脂
|
| XC7VX485T-1FFG1761C组织 |
75900 CLBS
|
| XC7VX485T-1FFG1761C可配置逻辑模块数量 |
75900
|
| XC7VX485T-1FFG1761C可编程逻辑类型 |
FIELD PROGRAMMABLE GATE 阵列
|
