Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 数据速率 | 其他特性 | 传真率 | 负电源额定电压 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | 交付时间 | YTEOL | |
对比 | ST7538QTR | STMicroelectronics | 查询价格 | Yes | Not Recommended | 5 V | BCDMOS | 4 Mbps | 1 | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538QTR | 2443 | 2024-09-06 22:07:30 | QFP | 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-44 | 44 | compliant | Malaysia | EAR99 | 8542.39.00.01 | [object Object] | 3 | |||||||
对比 | ST7540 | STMicroelectronics | 查询价格 | Yes | Active | 5 V | BCDMOS | 4 Mbps | 1 | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540 | 2443 | 2024-06-01 00:23:56 | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | EAR99 | 8542.39.00.01 | [object Object] | |||||||||
对比 | ST7540TR | STMicroelectronics | 查询价格 | Yes | Active | 5 V | BCDMOS | 4 Mbps | 1 | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | ST7540TR | 2443 | 2024-05-31 23:04:02 | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | EAR99 | 8542.39.00.01 | [object Object] | |||||||||
对比 | ST7538Q | STMicroelectronics | 查询价格 | Yes | Not Recommended | 5 V | BCDMOS | 4 Mbps | 1 | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538Q | 2443 | 2024-09-06 19:44:24 | QFP | 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-44 | 44 | compliant | Malaysia | EAR99 | 8542.39.00.01 | [object Object] | 3 | |||||||
对比 | ST7538P | STMicroelectronics | 查询价格 | Yes | Obsolete | 5 V | BCDMOS | 4 Mbps | HALF DUPLEX | 1 | INDUSTRIAL | MODEM | S-PQFP-G44 | e4 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | NICKEL PALLADIUM GOLD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST7538P | 2443 | 2023-08-02 05:14:44 | QFP | 10 X 10 MM, 1.40 MM HEIGHT, TQFP-44 | 44 | compliant | 8542.39.00.01 | 0 | ||||||||||||
对比 | ST70136B | STMicroelectronics | 查询价格 | Yes | Yes | Obsolete | BICMOS | 1 | COMMERCIAL | MODEM-SUPPORT CIRCUIT | S-PBGA-B64 | e1 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | LFBGA | BGA64,8X8,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 8 mm | 8 mm | 1.7 mm | ST70136B | 2443 | 2023-08-02 08:43:25 | BGA | LFBGA, BGA64,8X8,32 | 64 | compliant | 8542.39.00.01 | 0 | |||||||||||||||
对比 | R96EFX | Conexant Systems Inc | 查询价格 | No | Obsolete | 5 V | BICMOS | 2 Mbps | HALF DUPLEX | 9.6 kbps | -5 V | 1 | 155 µA | COMMERCIAL | MODEM-DATA/FAX | S-PQCC-J68 | e0 | Not Qualified | 70 °C | 68 | PLASTIC/EPOXY | QCCJ | QUIP64A,.7/.9 | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 24.13 mm | 24.13 mm | 4.39 mm | 1872 | 2023-08-01 19:14:03 | LCC | QCCJ, QUIP64A,.7/.9 | 68 | unknown | 8542.39.00.01 | 0 | |||||||||||
对比 | ST70136G | STMicroelectronics | 查询价格 | Yes | Yes | Obsolete | BICMOS | 1 | COMMERCIAL | MODEM-SUPPORT CIRCUIT | S-PQFP-G64 | e4 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.6 mm | ST70136G | 2443 | 2023-08-01 22:56:01 | QFP | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-64 | 64 | compliant | 8542.39.00.01 | 0 | |||||||||||||||
对比 | R96MFX | Conexant Systems Inc | 查询价格 | No | Obsolete | 5 V | BICMOS | 2 Mbps | HALF DUPLEX | 9.6 kbps | -5 V | 1 | 155 µA | COMMERCIAL | MODEM-DATA/FAX | S-PQCC-J68 | e0 | Not Qualified | 70 °C | 68 | PLASTIC/EPOXY | QCCJ | QUIP64A,.7/.9 | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 24.13 mm | 24.13 mm | 4.39 mm | 1872 | 2023-08-05 19:27:08 | LCC | PLASTIC, LCC-68 | 68 | unknown | 8542.39.00.01 | 0 | |||||||||||
对比 | NE5080N | Philips Semiconductors | 查询价格 | No | Transferred | 5 V | BIPOLAR | 100 mA | COMMERCIAL | MODEM-MODULATOR | R-PDIP-T16 | e0 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 166795790 | 2023-08-07 14:32:03 | DIP, DIP16,.3 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
对比 | EF7910PL | STMicroelectronics | 查询价格 | No | Obsolete | 5 V | BIPOLAR | 1 Mbps | HALF DUPLEX; FULL DUPLEX | -5 V | 1 | 125 mA | COMMERCIAL | MODEM | R-PDIP-T28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 5.08 mm | EF7910PL | 2443 | 2023-08-05 19:30:30 | DIP | PLASTIC, DIP-28 | 28 | not_compliant | 8542.39.00.01 | 0 | ||||||||||||
对比 | EF7910JLD | STMicroelectronics | 查询价格 | No | Obsolete | 5 V | BIPOLAR | -5 V | 150 mA | COMMERCIAL | MODEM | R-XDIP-T28 | e0 | Not Qualified | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | EF7910JLD | 2443 | 2023-08-07 14:19:04 | not_compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||
对比 | MC68194FJ | Motorola Semiconductor Products | 查询价格 | No | Transferred | 5 V | BIPOLAR | 10 Gbps | 1 | 270 mA | COMMERCIAL | MODEM | S-GQCC-J52 | e0 | Not Qualified | 70 °C | 52 | CERAMIC, GLASS-SEALED | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 18.935 mm | 18.935 mm | 5.08 mm | 207895312 | 2023-08-02 12:38:39 | QCCJ, LDCC52,.8SQ | unknown | 8542.39.00.01 | |||||||||||||||||
对比 | MC68194FN | Freescale Semiconductor | 查询价格 | No | Obsolete | 5 V | BIPOLAR | COMMERCIAL | MODEM | S-PQCC-J52 | e0 | Not Qualified | 70 °C | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | MC68194FN | 1999 | 2023-08-07 14:29:38 | QCCJ, LDCC52,.8SQ | unknown | 8542.39.00.01 | 0 | |||||||||||||||||||||
对比 | MC68194FJ | Motorola Mobility LLC | 查询价格 | Transferred | 5 V | BIPOLAR | 10 Gbps | 1 | 270 mA | COMMERCIAL | MODEM | S-GQCC-J52 | e0 | Not Qualified | 70 °C | 52 | CERAMIC, GLASS-SEALED | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 18.935 mm | 18.935 mm | 5.08 mm | 2141108 | 2023-08-02 12:38:39 | QFN | QCCJ, LDCC52,.8SQ | 52 | unknown | 8542.39.00.01 | ||||||||||||||||
对比 | MC68194FJR2 | onsemi | 查询价格 | No | Obsolete | 5 V | BIPOLAR | 10 Gbps | 1 | 270 µA | COMMERCIAL | MODEM | S-CQCC-J52 | e0 | Not Qualified | 70 °C | 52 | CERAMIC, METAL-SEALED COFIRED | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 18.935 mm | 18.935 mm | 5.08 mm | MC68194FJR2 | 2260 | 2023-08-02 14:15:07 | QFN | CERQUAD-52 | 52 | not_compliant | 8542.39.00.01 | 0 | |||||||||||||
对比 | RC2211AM | Raytheon Semiconductor | 查询价格 | No | Obsolete | 12 V | BIPOLAR | 1 | 11 µA | COMMERCIAL | MODEM-DEMODULATOR | R-PDSO-G14 | e0 | Not Qualified | 70 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 293710926 | 2023-08-01 19:23:32 | PLASTIC, SOIC-14 | unknown | 0 | |||||||||||||||||||||
对比 | EF7910J | STMicroelectronics | 查询价格 | Obsolete | 5 V | BIPOLAR | -5 V | 125 mA | COMMERCIAL | MODEM | R-XDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | EF7910J | 2443 | 2023-08-07 14:31:53 | compliant | 8542.39.00.01 | 0 | |||||||||||||||||||||||
对比 | F2212DC | Fairchild Semiconductor Corporation | 查询价格 | No | No | Obsolete | BIPOLAR | COMMERCIAL | MODEM | R-XDIP-T28 | e0 | Not Qualified | 2A | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | F2212DC | 1978 | 2023-08-01 22:58:22 | DIP, DIP28,.6 | compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||
对比 | Z0221524ASCR4508 | Zilog Inc | 查询价格 | No | Obsolete | 5 V | BIPOLAR | 2 Mbps | DATA RATE MIN:75BPS | 1 | COMMERCIAL | MODEM | S-PQFP-G44 | e0 | Not Qualified | 70 °C | 225 | 30 | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,40 | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.6 mm | 2581 | 2023-08-01 20:27:55 | QFP | LQFP, QFP44,.47SQ,40 | 44 | unknown | 8542.39.00.01 | 0 |