October 17, 2025 – MediaTek officially launched its flagship automotive-grade cockpit chip, the Dimensity Cockpit S1 Ultra, manufactured using TSMC’s 3nm process. It will first debut in the Deepal L06 smart coupe.
Source: MediaTek Official WeChat
Core Performance Parameters
- CPU: Armv9 all-big-core architecture, computing power of 280K DMIPS
- GPU: Hardware-level ray tracing, graphics performance of 4000 GFLOPS
- NPU: On-device generative AI computing power of 53 TOPS, supports 13-billion-parameter large models
- Multimedia: Supports up to 10 simultaneous displays, 8K30fps or 4K120fps encoding/decoding, integrated MiraVision display enhancement technology
AI and Functional Features
- Supports generative AI applications like Stable Diffusion, enabling 3D voice assistants, multi-screen interaction, and driver alertness monitoring
- Integrates 5G T-BOX, dual-band Wi-Fi, Bluetooth, GNSS, and flagship HDR ISP, supporting AI noise reduction, 360° surround view, dashcam, and cabin monitoring
- Runs multimodal large models on-device for improved response speed and security
Market Performance
The Dimensity Cockpit S1 Ultra dominates the AnTuTu 2025 Car Edition performance chart with a high score of 1,637,481, surpassing the Snapdragon 8295 models. Its computing power and process technology (on par with Apple’s A19) ensure smooth performance and support for complex OTA upgrades over the next five years.
Source: ANTUTU
MediaTek stated that the Deepal L06 is positioned as a “long-range magnetorheological laser smart coupe” and will be one of the first vehicles equipped with the Dimensity Cockpit S1 Ultra chip.