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| 参数名称 | 参数值 |
|---|---|
| Source Content uid | CD40174BKMSR |
| Brand Name | Renesas |
| 是否无铅 |  不含铅 |
| 生命周期 | End Of Life |
| Objectid | 4003030817 |
| 零件包装代码 | CFP |
| 包装说明 | DFP, |
| 针数 | 16 |
| 制造商包装代码 | K16.A |
| Reach Compliance Code | compliant |
| HTS代码 | 8542.39.00.01 |
| 风险等级 | 6.96 |
| Samacsys Description | The CD40174BMS consists of six identical D-Type flip-flops having independent data inputs. The clock and clear inputs are common to all six units. Data is transferred to the Q outputs on the positive-going transition of the clock pulse. All six flip-flops are simultaneously reset by a low level on the CLEAR input. The CD40174BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E and Ceramic Flatpack H6W. |
| Samacsys Manufacturer | Renesas Electronics |
| Samacsys Modified On | 2023-10-24 19:30:29 |
| YTEOL | 0.47 |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-CDFP-F16 |
| JESD-609代码 | e3 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 405 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 2.92 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 6.73 mm |
| 最小 fmax | 3.5 MHz |
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