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| 参数名称 | 参数值 |
|---|---|
| Source Content uid | ISL12020MIRZ-T7A |
| Brand Name | Renesas |
| 是否无铅 |  不含铅 |
| 生命周期 | Active |
| Objectid | 4003035086 |
| 零件包装代码 | DFN |
| 包装说明 | SON, |
| 针数 | 20 |
| 制造商包装代码 | L20.5.5X4.0 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| HTS代码 | 8542.39.00.01 |
| Factory Lead Time | 26 weeks 1 day |
| 风险等级 | 0.54 |
| Samacsys Description | Low Power RTC with Battery Backed SRAM, Integrated ±5ppm Temperature Compensation and Auto Daylight Saving ISL12020M The ISL12020M device is a low power Real Time Clock (RTC) with an embedded temperature sensor and crystal. Device functions include oscillator compensation, clock/calendar, power fail and low battery monitors, brownout indicator, one-time, periodic or polled alarms, intelligent battery backup switching, Battery Reseal™ function and 128 bytes of battery-backed user SRAM. The device is offered |
| Samacsys Manufacturer | Renesas Electronics |
| Samacsys Modified On | 2023-10-24 19:30:29 |
| YTEOL | 6.2 |
| 最大时钟频率 | 0.032 MHz |
| 外部数据总线宽度 | |
| 信息访问方法 | SERIAL(I2C) |
| 中断能力 | Y |
| JESD-30 代码 | R-PDSO-N20 |
| JESD-609代码 | e3 |
| 长度 | 5.5 mm |
| 湿度敏感等级 | 1 |
| 端子数量 | 20 |
| 计时器数量 | |
| 片上数据RAM宽度 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HLSON |
| 封装等效代码 | SOLCC20,.16,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| RAM（字数） | 128000 |
| 座面最大高度 | 1.3 mm |
| 最大压摆率 | 0.5 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 最短时间 | SECONDS |
| 处于峰值回流温度下的最长时间 | 30 |
| 易失性 | YES |
| 宽度 | 4 mm |
| uPs/uCs/外围集成电路类型 | TIMER, REAL TIME CLOCK |
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