参数名称 | 参数值 |
---|---|
Source Content uid | ISL2111ABZ |
Brand Name | Renesas |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
生命周期 | Active |
Objectid | 8321699774 |
零件包装代码 | SOICN |
包装说明 | SOIC-8 |
针数 | 8 |
制造商包装代码 | M8.15 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
HTS代码 | 8542.39.00.01 |
Factory Lead Time | 26 weeks 1 day |
风险等级 | 1.1 |
Samacsys Description | The ISL2110, ISL2111 are 100V, high frequency, half-bridge N-Channel power MOSFET driver ICs. They are based on the popular HIP2100, HIP2101 half-bridge drivers, but offer several performance improvements. Peak output pull-up/pull-down current has been increased to 3A/4A, which significantly reduces switching power losses and eliminates the need for external totem-pole buffers in many applications. Also, the low end of the VDD operational supply range has been extended to 8VDC. The ISL2110 has additional in |
Samacsys Manufacturer | Renesas Electronics |
Samacsys Modified On | 2023-10-24 19:30:29 |
YTEOL | 7.75 |
高边驱动器 | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.9 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | PUSH-PULL |
标称输出峰值电流 | 4 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
座面最大高度 | 1.75 mm |
最大压摆率 | 5.5 mA |
最大供电电压 | 14 V |
最小供电电压 | 8 V |
标称供电电压 | 12 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
断开时间 | 0.06 µs |
接通时间 | 0.06 µs |
宽度 | 3.9 mm |