Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | ||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 模拟输入通道数量 | 最大线性误差 (EL) | 位数 | 表面贴装 | 转换器类型 | 其他特性 | 输入位码 | 功能数量 | 最大稳定时间 | 最大压摆率 | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 制造商包装代码 | 是否符合REACH标准 | HTS代码 | 交付时间 | ECCN代码 | YTEOL | Country Of Origin | |
对比 | TW8809-NA2-CR | Renesas Electronics Corporation | 查询价格 | Yes | Active | e3 | 3 | Matte Tin (Sn) - annealed | TW8809-NA2-CR | 2354 | 2024-04-15 18:02:39 | QFN | , | 56 | L56.8X8H | compliant | 8542.39.00.01 | [object Object] | |||||||||||||||||||||||||||||||||||
对比 | SP390A-R3 | Black Box Corporation | 查询价格 | Active | 1798 | 2022-10-04 03:20:50 | compliant | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||||
对比 | LTC2634IUD-HZ12#PBF | Analog Devices Inc | 查询价格 | No | Yes | Active | 5 V | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | LTC2634IUD-HZ12#PBF | 1742 | 2024-04-02 16:06:32 | 16 | 05-08-1691 | compliant | 8542.39.00.01 | EAR99 | 8.5 | ||||||||||
对比 | AD5342BRUZ-REEL7 | Analog Devices Inc | 查询价格 | No | Yes | Active | 0.39 % | 12 | YES | D/A CONVERTER | BINARY | 2 | 10 µs | 450 µA | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 635 µm | DUAL | AD5342BRUZ-REEL7 | 1742 | 2024-04-02 16:03:37 | 28 | RU-28 | compliant | 8542.39.00.01 | EAR99 | 8.5 | Philippines | |||||||||
对比 | 750-404/000-003 | WAGO Innovative Connections | 查询价格 | Yes | Active | 5 V | 1 | 32 | NO | CONVERTER | FREQUENCY COUNTER | 1 | COMMERCIAL | R-XXMA-X | 55 °C | UNSPECIFIED | XMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | UNSPECIFIED | UNSPECIFIED | 2540 | PACKAGE | not_compliant | |||||||||||||||||||||||||||||
对比 | MAX5815BAUD+ | Maxim Integrated Products | 查询价格 | Yes | Transferred | 0.024 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 1.4 mA | BICMOS | AUTOMOTIVE | R-PDSO-G14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 2164 | 2023-08-05 19:22:54 | compliant | 8542.39.00.01 | 9 | Japan, Mainland China, Malaysia, Philipp... more | |||||||||||||||
对比 | LTC2634IUD-HZ12#PBF | Linear Technology | 查询价格 | Yes | Transferred | 5 V | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LTC2634IUD-HZ12#PBF | 2136 | 2023-08-18 14:25:48 | QFN | 16 | UD | compliant | |||||||||||||
对比 | DAC081C081CISD/NOPB | National Semiconductor Corporation | 查询价格 | Yes | Transferred | 3.1 % | 8 | YES | D/A CONVERTER | BINARY | 1 | 4.5 µs | CMOS | AUTOMOTIVE | R-PDSO-N6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 6 | PLASTIC/EPOXY | SON | SOLCC6,.1,25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | NO LEAD | 635 µm | DUAL | 2216 | 2023-08-02 10:58:31 | unknown | ||||||||||||||||||
对比 | DAC121S101QCMK/NOPB | National Semiconductor Corporation | 查询价格 | Yes | Transferred | 0.19 % | 12 | YES | D/A CONVERTER | BINARY | 1 | 10 µs | 312 µA | CMOS | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 40 | 6 | PLASTIC/EPOXY | TSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | MATTE TIN | GULL WING | 950 µm | DUAL | 2216 | 2023-08-01 18:28:17 | compliant | ||||||||||||||||
对比 | DAC121C081CIMK/NOPB | National Semiconductor Corporation | 查询价格 | Yes | Transferred | 0.19 % | 12 | YES | D/A CONVERTER | BINARY | 1 | 8.5 µs | CMOS | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 40 | 6 | PLASTIC/EPOXY | TSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | NICKEL PALLADIUM GOLD | GULL WING | 950 µm | DUAL | 2216 | compliant | |||||||||||||||||||
对比 | LTC2634HMSE-LMX12#PBF | Linear Technology | 查询价格 | Yes | Transferred | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | AUTOMOTIVE | R-PDSO-G10 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LTC2634HMSE-LMX12#PBF | 2136 | 2023-08-18 14:25:46 | MSOP | 10 | MSE | compliant | ||||||||||||||
对比 | LTC2634IMSE-LZ10#PBF | Linear Technology | 查询价格 | Yes | Transferred | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LTC2634IMSE-LZ10#PBF | 2136 | 2023-08-18 14:25:48 | MSOP | 10 | MSE | compliant | ||||||||||||||
对比 | LTC2634CUD-HMI10#PBF | Linear Technology | 查询价格 | Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LTC2634CUD-HMI10#PBF | 2136 | 2023-08-18 14:25:46 | QFN | 16 | UD | compliant | ||||||||||||||
对比 | LTC2634IUD-LMX10#PBF | Linear Technology | 查询价格 | Yes | Transferred | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LTC2634IUD-LMX10#PBF | 2136 | 2023-08-18 14:25:48 | QFN | 16 | UD | compliant | ||||||||||||||
对比 | LTC2634IUD-HZ10#PBF | Linear Technology | 查询价格 | Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LTC2634IUD-HZ10#PBF | 2136 | 2023-08-18 14:25:49 | QFN | 16 | UD | compliant | |||||||||||||
对比 | LTC2634IMSE-LMI8#PBF | Linear Technology | 查询价格 | Yes | Transferred | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LTC2634IMSE-LMI8#PBF | 2136 | 2023-08-18 14:25:48 | MSOP | 10 | MSE | compliant | ||||||||||||||
对比 | LTC2634IMSE-HZ12#PBF | Linear Technology | 查询价格 | Yes | Transferred | 5 V | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LTC2634IMSE-HZ12#PBF | 2136 | 2023-08-18 14:25:48 | MSOP | 10 | MSE | compliant | |||||||||||||
对比 | LTC2634IMSE-HZ10#PBF | Linear Technology | 查询价格 | Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LTC2634IMSE-HZ10#PBF | 2136 | 2023-08-18 14:25:48 | MSOP | 10 | MSE | compliant | |||||||||||||
对比 | LTC2634CMSE-LMI10#PBF | Linear Technology | 查询价格 | Yes | Transferred | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LTC2634CMSE-LMI10#PBF | 2136 | 2023-08-18 14:25:48 | MSOP | 10 | MSE | compliant | |||||||||||||||
对比 | LTC2634CUD-HMX12#PBF | Linear Technology | 查询价格 | Yes | Transferred | 5 V | 0.06 % | 12 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LTC2634CUD-HMX12#PBF | 2136 | 2023-08-18 14:25:48 | QFN | 16 | UD | compliant |