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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 输入特性 | 输出特性 | 位数 | 接口集成电路类型 | 技术 | 最大延迟 | 功能数量 | 输出锁存器或寄存器 | 输出极性 | 最大压摆率 | 最大供电电压 | 最小供电电压 | 表面贴装 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 长度 | 座面最大高度 | 宽度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 制造商包装代码 | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | 交付时间 | YTEOL | Date Of Intro | |
对比 | MC100EPT22DG | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | TTL/CMOS TO PECL TRANSLATOR | ECL | 700 ps | 2 | NONE | COMPLEMENTARY | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MC100EPT22DG | 2260 | 2024-03-02 22:51:35 | SOIC-8 Narrow Body | SOIC-8 | 8 | 751-07 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 5.61 | |||||||
对比 | MC14504BDG | onsemi | 查询价格 | Yes | Active | 5 V | STANDARD | 1 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 6 mA | 18 V | 3 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -55 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | MC14504BDG | 2260 | 2024-03-02 22:26:46 | SOIC 16 LEAD | SOIC-16 | 16 | 751B-05 | compliant | Mainland China | EAR99 | 8542.39.00.01 | [object Object] | 5.11 | 1994-01-01 | ||||
对比 | MC14504BDR2G | onsemi | 查询价格 | Yes | Active | 5 V | STANDARD | 1 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 6 mA | 18 V | 3 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -55 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | MC14504BDR2G | 2260 | 2024-03-02 22:42:58 | SOIC 16 LEAD | SOIC-16 | 16 | 751B-05 | compliant | Mainland China | EAR99 | 8542.39.00.01 | [object Object] | 5.11 | 1994-01-01 | ||||
对比 | MC100LVELT23DR2G | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | PECL TO TTL TRANSLATOR | ECL | 2.5 ns | 2 | NONE | TRUE | 3.8 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MC100LVELT23DR2G | 2260 | 2024-03-02 22:52:56 | SOIC-8 Narrow Body | SOIC-8 | 8 | 751-07 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 4.6 | |||||||
对比 | MC100LVELT22DR2G | onsemi | 查询价格 | Yes | Active | 3.3 V | OPEN-EMITTER | 1 | TTL/CMOS TO PECL TRANSLATOR | ECL | 600 ps | 2 | NONE | COMPLEMENTARY | 3.8 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MC100LVELT22DR2G | 2260 | 2024-03-02 23:17:09 | SOIC-8 Narrow Body | SOIC-8 | 8 | 751-07 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 5.61 | ||||||
对比 | MC14504BDTR2G | onsemi | 查询价格 | Yes | Active | 5 V | STANDARD | 1 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 6 mA | 18 V | 3 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | MC14504BDTR2G | 2260 | 2024-03-02 22:39:10 | TSSOP-16 | TSSOP-16 | 16 | 948F-01 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 5.11 | 1994-01-01 | ||||
对比 | MC14504BDTG | onsemi | 查询价格 | Yes | Active | 5 V | STANDARD | 1 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 6 mA | 18 V | 3 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | MC14504BDTG | 2260 | 2024-03-02 23:14:42 | TSSOP-16 | TSSOP-16 | 16 | 948F-01 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 5.11 | 1994-01-01 | ||||
对比 | CD4504BM | Texas Instruments | 查询价格 | Yes | Yes | Active | 10 V | STANDARD | PUSH-PULL | 6 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 18 µA | 18 V | 5 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | CD4504BM | 2477 | 2024-04-21 00:01:12 | SOIC | GREEN, PLASTIC, MS-012AC, SOIC-16 | 16 | compliant | Mexico | EAR99 | 8542.39.00.01 | 15 | |||||
对比 | CD4504BM96 | Texas Instruments | 查询价格 | Yes | Yes | Active | 10 V | STANDARD | PUSH-PULL | 6 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 18 µA | 18 V | 5 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 9.9 mm | 1.75 mm | 3.9 mm | CD4504BM96 | 2477 | 2024-04-21 00:01:12 | SOIC | GREEN, PLASTIC, MS-012AC, SOIC-16 | 16 | compliant | Mexico | EAR99 | 8542.39.00.01 | 15 | |||||
对比 | MC100EPT20DR2G | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | TTL/CMOS TO PECL TRANSLATOR | ECL | 450 ps | 1 | NONE | COMPLEMENTARY | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MC100EPT20DR2G | 2260 | 2024-03-02 22:50:21 | SOIC-8 Narrow Body | SOIC-8 | 8 | 751-07 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 5.84 | |||||||
对比 | MC100EL91DWR2G | onsemi | 查询价格 | Yes | Active | 5 V | 1 | PECL TO ECL TRANSLATOR | ECL | 810 ps | 3 | NONE | COMPLEMENTARY | 5.5 V | 4.75 V | YES | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 12.8 mm | 2.65 mm | 7.5 mm | MC100EL91DWR2G | 2260 | 2024-03-02 22:42:58 | SOIC-20 WB | SOP-20 | 20 | 751D-05 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 4.87 | |||||||
对比 | CD4504BPWR | Texas Instruments | 查询价格 | Yes | Yes | Active | 10 V | STANDARD | PUSH-PULL | 6 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 18 µA | 18 V | 5 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | CD4504BPWR | 2477 | 2024-04-21 00:01:12 | TSSOP | GREEN, PLASTIC, TSSOP-16 | 16 | compliant | Malaysia | EAR99 | 8542.39.00.01 | 15 | |||||
对比 | CD4504BPW | Texas Instruments | 查询价格 | Yes | Yes | Active | 10 V | STANDARD | PUSH-PULL | 6 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 18 µA | 18 V | 5 V | YES | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | CD4504BPW | 2477 | 2024-04-21 00:01:12 | TSSOP | GREEN, PLASTIC, TSSOP-16 | 16 | compliant | Malaysia | EAR99 | 8542.39.00.01 | 15 | |||||
对比 | MC100EPT23DTG | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | PECL TO TTL TRANSLATOR | ECL | 1.8 ns | 2 | NONE | TRUE | 3.6 V | 3 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MC100EPT23DTG | 2260 | 2024-03-02 22:19:10 | TSSOP 8 3.0x3.0x0.95 mm | TSSOP-8 | 8 | 948R-02 | compliant | Malaysia | EAR99 | 8542.39.00.01 | [object Object] | 4.6 | |||||||
对比 | MC100EPT21DR2G | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | PECL TO TTL TRANSLATOR | ECL | 2.25 ns | 1 | NONE | TRUE | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MC100EPT21DR2G | 2260 | 2024-03-02 23:14:33 | SOIC-8 Narrow Body | SOIC-8 | 8 | 751-07 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 4.6 | |||||||
对比 | MC100EPT26DG | onsemi | 查询价格 | Yes | Active | 3.3 V | DIFFERENTIAL | 1 | PECL TO TTL TRANSLATOR | ECL | 2.2 ns | 1 | NONE | TRUE | 40 mA | 3.6 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MC100EPT26DG | 2260 | 2024-03-02 22:56:36 | SOIC-8 Narrow Body | SOIC-8 | 8 | 751-07 | compliant | Philippines | EAR99 | 8542.39.00.01 | [object Object] | 4.6 | |||||
对比 | SY100EPT21LKG | Microchip Technology Inc | 查询价格 | Yes | Active | 3.3 V | 1 | PECL TO TTL TRANSLATOR | ECL | 2.5 ns | 1 | NONE | TRUE | 20 mA | 3.6 V | 3 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | SY100EPT21LKG | 2188 | 2024-04-20 08:27:16 | MSOP-8 | compliant | Thailand | EAR99 | 8542.39.00.01 | [object Object] | 24.61 | |||||||||
对比 | MC100EPT23DTR2G | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | PECL TO TTL TRANSLATOR | ECL | 1.8 ns | 2 | NONE | TRUE | 3.6 V | 3 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MC100EPT23DTR2G | 2260 | 2024-03-02 22:35:29 | TSSOP 8 3.0x3.0x0.95 mm | TSSOP-8 | 8 | 948R-02 | compliant | Malaysia | EAR99 | 8542.39.00.01 | [object Object] | 4.6 | |||||||
对比 | CD4504BE | Texas Instruments | 查询价格 | Yes | Yes | Active | 10 V | STANDARD | PUSH-PULL | 6 | TTL/CMOS TO CMOS TRANSLATOR | CMOS | 550 ns | 6 | NONE | TRUE | 18 µA | 18 V | 5 V | NO | MILITARY | R-PDIP-T16 | Not Qualified | e4 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 19.305 mm | 5.08 mm | 7.62 mm | CD4504BE | 2477 | 2024-04-21 00:01:12 | DIP | ROHS COMPLIANT, PLASTIC, DIP-16 | 16 | compliant | Malaysia, Mexico | EAR99 | 8542.39.00.01 | 15 | ||||||
对比 | MC100EPT21DTR2G | onsemi | 查询价格 | Yes | Active | 3.3 V | 1 | PECL TO TTL TRANSLATOR | ECL | 2.25 ns | 1 | NONE | TRUE | 3.6 V | 3 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MC100EPT21DTR2G | 2260 | 2024-03-02 23:14:33 | TSSOP 8 3.0x3.0x0.95 mm | TSSOP-8 | 8 | 948R-02 | compliant | Malaysia | EAR99 | 8542.39.00.01 | [object Object] | 4.6 |