Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 电源电压1-Nom | 区段数 | 输出特性 | 位数 | 显示模式 | 接口集成电路类型 | 技术 | 其他特性 | 信道数量 | 功能数量 | 输出锁存器或寄存器 | 最大压摆率 | 最大供电电压 | 最小供电电压 | 电源电压1-最大 | 电源电压1-分钟 | 表面贴装 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 长度 | 座面最大高度 | 宽度 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | HTS代码 | YTEOL | Source Content uid | 零件包装代码 | 针数 | Country Of Origin | ECCN代码 | 制造商包装代码 | Date Of Intro | |
对比 | HD61105FP | Hitachi Ltd | 查询价格 | Obsolete | 2141059 | 2022-02-06 01:19:08 | , | unknown | 8542.39.00.01 | 0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | PCA9519PW | NXP Semiconductors | 查询价格 | Yes | Active | INTERFACE CIRCUIT | 1 | YES | INDUSTRIAL | R-PDSO-G20 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 6.5 mm | 1.1 mm | 4.4 mm | 2245 | 2023-03-10 17:49:38 | TSSOP, | compliant | 8542.39.00.01 | PCA9519PW | TSSOP | 20 | |||||||||||||||||||||||||
对比 | MAX253MJA | Maxim Integrated Products | 查询价格 | No | No | Transferred | 5 V | INTERFACE CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | NO | MILITARY | R-GDIP-T8 | Not Qualified | e0 | 1 | 125 °C | -55 °C | MIL-STD-883 | 8 | CERAMIC, GLASS-SEALED | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | 2164 | 2023-08-02 01:56:32 | DIP, DIP8,.3 | not_compliant | 8542.39.00.01 | 9 | DIP | 8 | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | |||||||||||||||||||
对比 | CPC5002GS | IXYS Corporation | 查询价格 | Yes | Obsolete | 1 | 250 | 30 | 2085 | 2023-08-05 18:58:20 | compliant | 8542.39.00.01 | 0 | |||||||||||||||||||||||||||||||||||||||||||||||||
对比 | SN74AUP1T97YZPR | Texas Instruments | 查询价格 | Yes | Yes | Active | 2.5 V | PUSH-PULL | 1 | INTERFACE CIRCUIT | 1 | 1 | 900 nA | 3.6 V | 2.3 V | YES | INDUSTRIAL | R-XBGA-B6 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.4 mm | 500 µm | 900 µm | 2477 | 2024-04-21 00:01:12 | DSBGA-6 | compliant | 8542.39.00.01 | 15 | SN74AUP1T97YZPR | BGA | 6 | Mainland China | EAR99 | ||||||||||||||
对比 | MAX14436CAWE+ | Analog Devices Inc | 查询价格 | Active | 1.8 V | DIGITAL ISOLATOR | BICMOS | 1 | 5.5 V | 1.71 V | YES | R-PDSO-G16 | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Matte Tin (Sn) - annealed | GULL WING | 1.27 mm | DUAL | 10.3 mm | 2.65 mm | 7.5 mm | 1742 | 2024-04-02 15:57:25 | 10 | MAX14436CAWE+ | 16-SOIC_W-300_MIL | 16 | Japan, Mainland China, Malaysia, Philipp... more | 16-SOIC_W-300_MIL | 2017-09-01 | |||||||||||||||||||||||
对比 | RAE09103G | Cantec Electronic Co Ltd | 查询价格 | Contact Manufacturer | 216508197 | 2022-01-28 07:14:12 | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | RBA07101F | Cantec Electronic Co Ltd | 查询价格 | Contact Manufacturer | 216508197 | 2022-02-07 23:28:59 | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | RBE04103J | Cantec Electronic Co Ltd | 查询价格 | Contact Manufacturer | 216508197 | 2022-01-30 01:09:56 | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | ZD3202LEU/TR | ASIX Electronics Corporation | 查询价格 | Contact Manufacturer | 3 | 4317551 | 2023-12-01 18:57:33 | , | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | MAX3002EBP+ | Maxim Integrated Products | 查询价格 | Yes | Transferred | INTERFACE CIRCUIT | BICMOS | 1 | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | R-PBGA-B20 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 20 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 2.54 mm | 670 µm | 2.03 mm | 2164 | 2023-02-04 21:00:56 | VFBGA, | compliant | 8542.39.00.01 | 9 | Japan, Mainland China, Malaysia, Philipp... more | EAR99 | |||||||||||||||||||||
对比 | PCF2104CU/7 | Philips Semiconductors | 查询价格 | Transferred | 60 | SEGMENT | CMOS | 500 µA | INDUSTRIAL | Not Qualified | 85 °C | -40 °C | DIE OR CHIP | 166795790 | 2023-08-02 10:42:47 | , DIE OR CHIP | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||||||||
对比 | ADUM1250ARZ-RL7 | Analog Devices Inc | 查询价格 | No | Yes | Active | 3.3 V | DIGITAL ISOLATOR | CMOS | 1 | 5.5 V | 3 V | YES | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Matte Tin (Sn) - annealed | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | 1742 | 2024-04-02 15:53:45 | ROHS COMPLIANT, MS-012AA, SOIC-8 | compliant | 8542.39.00.01 | 8.5 | ADUM1250ARZ-RL7 | SOIC | 8 | Malaysia | EAR99 | R-8 | |||||||||||||||
对比 | IL611A-1ETR7 | NVE Corporation | 查询价格 | Yes | Active | 3.3 V | INTERFACE CIRCUIT | 2 | 5.5 V | 3 V | YES | INDUSTRIAL | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | 2244 | 2023-07-10 21:29:51 | MSOP-8 | compliant | 8542.39.00.01 | MSOP | 8 | ||||||||||||||||||||||||||
对比 | TXB0108GXYR | Texas Instruments | 查询价格 | Obsolete | 1.5 V | OPEN-DRAIN | 8 | VOLTAGE LEVEL TRANSLATOR | 1 | LATCH | 5 µA | 3.6 V | 1.2 V | YES | INDUSTRIAL | R-PBGA-B20 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | VFBGA | BGA20,4X5,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 3 mm | 610 µm | 2.5 mm | 2477 | 2023-08-02 08:25:09 | VFBGA, BGA20,4X5,20 | unknown | 8542.39.00.01 | 0 | TXB0108GXYR | BGA | 20 | EAR99 | |||||||||||||||||||||
对比 | SY88053ALMGTR | Microchip Technology Inc | 查询价格 | Yes | Yes | Obsolete | 3.3 V | INTERFACE CIRCUIT | 1 | 3.6 V | 3 V | YES | INDUSTRIAL | S-XQCC-N16 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3 mm | 900 µm | 3 mm | 2188 | 2022-10-04 03:25:10 | HVQCCN, | compliant | 8542.39.00.01 | 0 | SY88053ALMGTR | DFN | 16 | MLF | ||||||||||||||||||||||
对比 | AD260BND-0 | Analog Devices Inc | 查询价格 | No | No | Obsolete | 5 V | 5 V | INTERFACE CIRCUIT | 1 | 5.75 V | 4 V | 5.75 V | 4 V | NO | OTHER | R-PQIP-T22 | Not Qualified | 85 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 22 | PLASTIC/EPOXY | QIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | QUAD | 1742 | 2022-09-02 01:26:16 | DIP-22 | unknown | 8542.39.00.01 | 0 | AD260BND-0 | QIP | 22 | N-22-1 | |||||||||||||||||||||||
对比 | ST2329IQTR | STMicroelectronics | 查询价格 | Yes | Yes | Obsolete | 2 V | 2 V | INTERFACE CIRCUIT | 1 | 3.6 V | 1.65 V | 5.5 V | 1.8 V | YES | INDUSTRIAL | R-XQCC-N10 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | UNSPECIFIED | VQCCN | LCC10,.06X.07,16 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | NO LEAD | 400 µm | QUAD | 1.8 mm | 550 µm | 1.4 mm | 2443 | 2023-08-01 19:45:17 | VQCCN, LCC10,.06X.07,16 | compliant | 8542.39.00.01 | 0 | ST2329IQTR | QFN | 10 | ||||||||||||||||
对比 | ADUM142E1WBRWZ | Analog Devices Inc | 查询价格 | No | Yes | Active | 1.8 V | DIGITAL ISOLATOR | CMOS | IT ALSO OPERATES AT 2.5, 3.3, 5 V | 4 | 5.5 V | 1.7 V | YES | AUTOMOTIVE | R-PDSO-G16 | e4 | 3 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 10.3 mm | 2.65 mm | 7.5 mm | 1742 | 2024-04-02 15:54:32 | SOIC-16 | compliant | 8543.70.98.60 | 8.5 | ADUM142E1WBRWZ | 16 | Taiwan | EAR99 | RW-16 | 2017-09-25 | ||||||||||||||
对比 | MAX3374EEBL-T | Rochester Electronics LLC | 查询价格 | No | Active | 3.3 V | 3.3 V | INTERFACE CIRCUIT | BICMOS | USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION | 2 | 5.5 V | 1.2 V | 5.5 V | 1.65 V | YES | INDUSTRIAL | S-PBGA-B9 | COMMERCIAL | 1 | 85 °C | -40 °C | 240 | 20 | 9 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | NOT SPECIFIED | BALL | 500 µm | BOTTOM | 1.52 mm | 670 µm | 1.52 mm | 2178096 | 2016-06-20 18:00:17 | 1.50 X 1.50 MM, UCSP-9 | unknown | BGA | 9 |