逻辑,触发器/锁存器 - 参数搜索 - datasheet5电子元器件查询网

								Most Relevant											Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
对比	制造商型号	制造商	综合价格	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压 (Vsup)	传播延迟（tpd）	Prop。Delay @ Nom-Sup	功能数量	位数	表面贴装	封装代码	最大频率@ Nom-Sup	触发器类型	输出特性	系列	逻辑集成电路类型	技术	最小 fmax	最大I（ol）	输出极性	电源	最大供电电压 (Vsup)	最小供电电压 (Vsup)	温度等级	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装等效代码	封装形状	封装形式	包装方法	端子面层	端子形式	端子节距	端子位置	座面最大高度	宽度	长度	Source Content uid	Modified On	Objectid	零件包装代码	包装说明	针数	制造商包装代码	是否符合REACH标准	HTS代码	ECCN代码	Samacsys Manufacturer
对比	SSTUG32865ET/G,518	NXP Semiconductors	查询价格			Yes	Obsolete	1.8 V	1.4 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP		550 MHz		TRUE		2 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified		2	70 °C		260	40	160	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.15 mm	9 mm	13 mm	SSTUG32865ET/G,518	2022-02-09 02:09:57	1670848264	BGA	TFBGA,	160	SOT802-2	unknown	8542.39.00.01
对比	SSTUB32872AHMLFT	Integrated Device Technology Inc	查询价格		Yes	Yes	Obsolete	1.8 V	3 ns		1	28	YES	TFBGA		POSITIVE EDGE		32872	D FLIP-FLOP		410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B96	Not Qualified	e1	3	70 °C		260	NOT SPECIFIED	96	PLASTIC/EPOXY	BGA96,6X16,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH		Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.2 mm	5 mm	11.5 mm	SSTUB32872AHMLFT	2022-02-09 09:34:44	1732813526	CABGA	TFBGA, BGA96,6X16,25	96	AFG96	compliant	8542.39.00.01
对比	SSTUB32865ET/G	NXP Semiconductors	查询价格			Yes	Obsolete	1.8 V	1.5 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	32865	D FLIP-FLOP	CMOS	450 MHz		COMPLEMENTARY	1.8 V	2 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified		2	70 °C		260	40	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.15 mm	9 mm	13 mm	SSTUB32865ET/G	2022-01-29 17:16:46	1619082150	BGA	TFBGA, BGA160,12X18,25	160	SOT-802-2	unknown	8542.39.00.01
对比	SSTUA32S865ET/G	NXP Semiconductors	查询价格			Yes	Obsolete	1.8 V	1.8 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP	CMOS	450 MHz		TRUE	1.8 V	2 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified		2	70 °C		260	40	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.2 mm	9 mm	13 mm	SSTUA32S865ET/G	2022-05-02 20:01:27	2088095178	BGA	TFBGA, BGA160,12X18,25	160	SOT-802-1	unknown	8542.39.00.01
对比	SSTUM32865ET/G,518	NXP Semiconductors	查询价格			Yes	Obsolete	1.8 V	1.4 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP		450 MHz		TRUE		2 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified		2	70 °C		260	40	160	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.15 mm	9 mm	13 mm	SSTUM32865ET/G,518	2022-02-07 00:59:55	1670848282	BGA	TFBGA,	160	SOT802-2	unknown	8542.39.00.01
对比	ICSSSTUAF32868AHLFT	Integrated Device Technology Inc	查询价格		Yes	Yes	Obsolete	1.8 V	3 ns		1	28	YES	LFBGA		POSITIVE EDGE		32868	D FLIP-FLOP		410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B176	Not Qualified	e1	3	70 °C		260	30	176	PLASTIC/EPOXY	BGA176,8X22,25	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH		Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.55 mm	6 mm	15 mm	ICSSSTUAF32868AHLFT	2022-01-29 11:25:41	1659954412	BGA	LFBGA, BGA176,8X22,25	176		compliant	8542.39.00.01
对比	ICSSSTUB32872AHMT	Integrated Device Technology Inc	查询价格		No	No	Transferred	1.8 V	3 ns		1	28	YES	TFBGA		POSITIVE EDGE		32872	D FLIP-FLOP		410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B96	Not Qualified	e0		70 °C		225	30	96	PLASTIC/EPOXY	BGA96,6X16,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH		TIN LEAD	BALL	650 µm	BOTTOM	1.2 mm	5 mm	11.5 mm	ICSSSTUB32872AHMT	2022-02-05 22:42:48	1659954417	BGA	TFBGA, BGA96,6X16,25	96		compliant	8542.39.00.01
对比	ICSSSTUA32S865AH-T	Integrated Device Technology Inc	查询价格		No	No	Obsolete	1.8 V	1.9 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP	CMOS	410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified	e0		70 °C		NOT SPECIFIED	NOT SPECIFIED	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH		Tin/Lead (Sn/Pb)	BALL	650 µm	BOTTOM	1.2 mm	9 mm	13 mm	ICSSSTUA32S865AH-T	2022-01-29 23:54:43	2147238810	BGA	TFBGA, BGA160,12X18,25	160		not_compliant	8542.39.00.01
对比	74SSTUBF32865ABKG8	Renesas Electronics Corporation	查询价格		Yes		Obsolete	1.8 V	3 ns		1	28	YES	LFBGA		POSITIVE EDGE	OPEN-DRAIN	32865	D FLIP-FLOP	CMOS	410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified	e1	3	70 °C		260	30	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	TR	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.3 mm	9 mm	13 mm	74SSTUBF32865ABKG8	2022-05-17 04:02:05	4035283426	CABGA	LFBGA, BGA160,12X18,25	160	IDTDUMMY00	compliant	8542.39.00.01	EAR99	Renesas Electronics
对比	74SSTUB32865AZJBR	Texas Instruments	查询价格			Yes	Obsolete	1.8 V	3 ns	1.1 ns	1	28	YES	TFBGA	410 MHz	POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP	TTL	410 MHz	12 mA	TRUE	1.8 V	1.9 V	1.7 V	INDUSTRIAL	R-PBGA-B160	Not Qualified	e1	3	85 °C	-40 °C	260	NOT SPECIFIED	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	TR	Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.2 mm	9 mm	13 mm	74SSTUB32865AZJBR	2022-03-25 17:30:28	1684815527	BGA	TFBGA, BGA160,12X18,25	160		compliant	8542.39.00.01		Texas Instruments
对比	SSTUG32865ET/S,518	NXP Semiconductors	查询价格			Yes	Obsolete	1.8 V	1.4 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP		550 MHz		TRUE		2 V	1.7 V	OTHER	R-PBGA-B160	Not Qualified		2	85 °C		260	40	160	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.15 mm	9 mm	13 mm	SSTUG32865ET/S,518	2022-01-29 19:25:46	1670848265	BGA	TFBGA,	160	SOT802-2	unknown	8542.39.00.01
对比	SSTU32865ET,551	NXP Semiconductors	查询价格				Obsolete	1.8 V	2.15 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP		270 MHz		TRUE		1.9 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified			70 °C				160	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.2 mm	9 mm	13 mm	SSTU32865ET,551	2022-01-28 21:43:01	1670848242	BGA	TFBGA,	160	SOT802-1	unknown	8542.39.00.01
对比	74SSTUBF32868ABKG8	Integrated Device Technology Inc	查询价格		Yes	Yes	Obsolete	1.8 V	3 ns		1	28	YES	FBGA		POSITIVE EDGE	OPEN-DRAIN	32868	D FLIP-FLOP	TTL	410 MHz		TRUE	1.8/2.5 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B176	Not Qualified	e1	3	70 °C		260	NOT SPECIFIED	176	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, FINE PITCH		Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM		6 mm	15 mm	74SSTUBF32868ABKG8	2022-02-06 20:09:54	2037919730	CABGA	FBGA,	176	BKG176	compliant	8542.39.00.01
对比	ICSSSTUB32872AHLFT	Integrated Device Technology Inc	查询价格		Yes	Yes	Obsolete	1.8 V	3 ns		1	28	YES	LFBGA		POSITIVE EDGE		32872	D FLIP-FLOP		410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B96	Not Qualified	e3		70 °C		260	30	96	PLASTIC/EPOXY	BGA96,6X16,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH		Matte Tin (Sn)	BALL	800 µm	BOTTOM	1.4 mm	5.5 mm	13.5 mm	ICSSSTUB32872AHLFT	2022-02-07 21:16:54	1657400571	BGA	LFBGA, BGA96,6X16,32	96		compliant	8542.39.00.01
对比	SSTUG32868ET/S,518	NXP Semiconductors	查询价格				Obsolete	1.8 V	1.5 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	32868	D FLIP-FLOP	CMOS	450 MHz		COMPLEMENTARY		2 V	1.7 V	OTHER	R-PBGA-B176	Not Qualified		2	85 °C		260	40	176	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.15 mm	6 mm	15 mm	SSTUG32868ET/S,518	2022-01-29 12:35:20	1670848269	BGA	6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176	176	SOT932-1	unknown	8542.39.00.01
对比	74SSTUBH32865ABKG8	Integrated Device Technology Inc	查询价格		Yes	Yes	Obsolete	1.8 V	1.6 ns		1	28	YES	LFBGA		POSITIVE EDGE		SSTU	D FLIP-FLOP	CMOS	410 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified	e1	3	70 °C		260	30	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH		Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.3 mm	9 mm	13 mm	74SSTUBH32865ABKG8	2022-02-08 12:20:45	1732813502	CABGA	LFBGA, BGA160,12X18,25	160	BKG160	unknown	8542.39.00.01
对比	IDT74SSTU32865BKG	Integrated Device Technology Inc	查询价格			Yes	Obsolete	1.8 V	2.15 ns		1	28	YES	LFBGA		POSITIVE EDGE		SSTU	D FLIP-FLOP	TTL	270 MHz		TRUE	1.8 V	1.9 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified	e1	3	70 °C		260	30	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH		Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.3 mm	9 mm	13 mm	IDT74SSTU32865BKG	2022-01-27 06:50:54	2091417554	BGA	LFBGA, BGA160,12X18,25	160		unknown	8542.39.00.01
对比	SSTUA32S865ET	NXP Semiconductors	查询价格			No	Obsolete	1.8 V	1.8 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	SSTU	D FLIP-FLOP	CMOS	450 MHz		TRUE	1.8 V	2 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified	e0		70 °C		NOT SPECIFIED	NOT SPECIFIED	160	PLASTIC/EPOXY	BGA160,12X18,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH		Tin/Lead (Sn/Pb)	BALL	650 µm	BOTTOM	1.2 mm	9 mm	13 mm	SSTUA32S865ET	2022-02-07 22:28:41	2088095179	BGA	TFBGA, BGA160,12X18,25	160	SOT-802-1	unknown	8542.39.00.01
对比	IDT74SSTUBF32865ABKG8	Integrated Device Technology Inc	查询价格		Yes	Yes	Transferred	1.8 V	1.5 ns		1	28	YES	LFBGA		POSITIVE EDGE		SSTU	D FLIP-FLOP		410 MHz		TRUE		1.9 V	1.7 V	COMMERCIAL	R-PBGA-B160	Not Qualified	e1	3	70 °C		260	30	160	PLASTIC/EPOXY		RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH		Tin/Silver/Copper (Sn/Ag/Cu)	BALL	650 µm	BOTTOM	1.3 mm	9 mm	13 mm	IDT74SSTUBF32865ABKG8	2022-02-07 00:45:22	1669403990	BGA	LFBGA-160	160		compliant	8542.39.00.01	EAR99
对比	SSTUM32868ET/S	NXP Semiconductors	查询价格			Yes	Obsolete	1.8 V	1.5 ns		1	28	YES	TFBGA		POSITIVE EDGE	OPEN-DRAIN	32868	D FLIP-FLOP	CMOS	450 MHz		COMPLEMENTARY	1.8 V	2 V	1.7 V	COMMERCIAL EXTENDED	R-PBGA-B176	Not Qualified		2	85 °C		260	40	176	PLASTIC/EPOXY	BGA176,8X22,25	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			BALL	650 µm	BOTTOM	1.15 mm	6 mm	15 mm	SSTUM32868ET/S	2022-01-28 18:18:22	1619082155	BGA	TFBGA, BGA176,8X22,25	176	SOT-932-1	unknown	8542.39.00.01

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