Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 (Vsup) | 传播延迟(tpd) | Prop。Delay @ Nom-Sup | 功能数量 | 输入次数 | 输出次数 | 表面贴装 | 封装代码 | 负载电容(CL) | 输出特性 | 系列 | 逻辑集成电路类型 | 技术 | 其他特性 | 最大I(ol) | 输出极性 | 最大电源电流(ICC) | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 总剂量 | 端子数量 | 封装主体材料 | 封装等效代码 | 封装形状 | 封装形式 | 包装方法 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 宽度 | 长度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | HTS代码 | YTEOL | Source Content uid | Country Of Origin | ECCN代码 | 交付时间 | |
对比 | 5962G9655101VCA | Cobham Semiconductor Solutions | 查询价格 | Transferred | 5 V | 16 ns | 2 | 4 | 1 | NO | DIP | ACT | MULTIPLEXER | CMOS | TRUE | 5.5 V | 4.5 V | MILITARY | R-CDIP-T16 | Not Qualified | 125 °C | -55 °C | MIL-PRF-38535 Class V | 500k Rad(Si) V | 16 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | 224146751 | 2024-03-01 18:35:42 | DIP | DIP, | 16 | unknown | 8542.39.00.01 | |||||||||||||||||||||||
对比 | ZX54HCTLS158J | Radiation Semiconductor Corp | 查询价格 | No | Obsolete | 5 V | 4 | 2 | NO | DIP | MULTIPLEXER | CMOS | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 16 | CERAMIC | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 166795817 | 2023-08-02 09:35:18 | DIP, DIP16,.3 | unknown | 8542.39.00.01 | 0 | ||||||||||||||||||||||||||||||
对比 | DM8309J | Texas Instruments | 查询价格 | No | Obsolete | 5 V | 40 ns | 2 | 4 | NO | DIP | MULTIPLEXER | TTL | 16 mA | 44 mA | COMMERCIAL | R-XDIP-T16 | Not Qualified | e0 | 70 °C | 16 | CERAMIC | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 2477 | 2023-08-01 19:21:52 | DIP, DIP16,.3 | unknown | 8542.39.00.01 | 0 | DM8309J | |||||||||||||||||||||||||||
对比 | 54F157A/BEAJC | Motorola Mobility LLC | 查询价格 | No | No | Obsolete | 5 V | 9 ns | 13 ns | 4 | 2 | 1 | NO | DIP | F/FAST | MULTIPLEXER | TTL | 20 mA | TRUE | 23 mA | 5.5 V | 4.5 V | MILITARY | R-GDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC, GLASS-SEALED | DIP16,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.19 mm | 7.62 mm | 19.3 mm | 2141108 | 2023-08-02 07:45:59 | DIP | DIP, DIP16,.3 | 16 | unknown | 8542.39.00.01 | 0 | ||||||||||||||
对比 | 74ACT257SCQR | Fairchild Semiconductor Corporation | 查询价格 | No | Obsolete | 5 V | 11.5 ns | 8.5 ns | 4 | 2 | 1 | YES | SOP | 50 pF | 3-STATE | ACT | MULTIPLEXER | CMOS | 24 mA | TRUE | 5.5 V | 4.5 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 9.9 mm | 1978 | 2023-08-01 19:37:26 | SOIC | SOP, SOP16,.25 | 16 | unknown | 8542.39.00.01 | 0 | 74ACT257SCQR | ||||||||||||||
对比 | 74AC157SCQR | Fairchild Semiconductor Corporation | 查询价格 | No | Obsolete | 12 ns | 9 ns | 4 | 2 | 1 | YES | SOP | 50 pF | AC | MULTIPLEXER | CMOS | 12 mA | TRUE | 6 V | 2 V | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 3.9 mm | 9.9 mm | 1978 | 2023-08-02 10:30:22 | SOIC | SOP, SOP16,.25 | 16 | unknown | 8542.39.00.01 | 0 | 74AC157SCQR | ||||||||||||||||
对比 | CD40257BDMSR | Intersil Corporation | 查询价格 | No | Obsolete | 5 V | 405 ns | 513 ns | 4 | 2 | 1 | NO | DIP | 50 pF | 3-STATE | MULTIPLEXER | CMOS | 360 µA | TRUE | MILITARY | R-CDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 Class V | 100k Rad(Si) V | 16 | CERAMIC, METAL-SEALED COFIRED | DIP16,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 7.62 mm | 2074 | 2023-08-02 07:50:27 | DIP | DIP, DIP16,.3 | 16 | not_compliant | 8542.39.00.01 | 0 | CD40257BDMSR | ||||||||||||||||
对比 | MC10H164M | Rochester Electronics LLC | 查询价格 | Active | 2.5 ns | 1 | 8 | 1 | YES | SOP | OPEN-EMITTER | 10H | MULTIPLEXER | ECL | TRUE | COMMERCIAL EXTENDED | R-PDSO-G16 | COMMERCIAL | 75 °C | 16 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | NOT SPECIFIED | GULL WING | 1.27 mm | DUAL | 2.05 mm | 5.275 mm | 10.2 mm | 2178096 | 2016-06-20 18:00:17 | SOIC | SOP, | 16 | unknown | |||||||||||||||||||||||||||
对比 | 54F253FMQB | National Semiconductor Corporation | 查询价格 | No | Obsolete | 5 V | 15 ns | 9 ns | 2 | 4 | 1 | YES | QFF | 50 pF | 3-STATE | F/FAST | MULTIPLEXER | TTL | 20 mA | TRUE | 23 mA | 5.5 V | 4.5 V | MILITARY | R-GDFP-F16 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC, GLASS-SEALED | FL16,.3 | RECTANGULAR | FLATPACK | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 2.032 mm | 6.604 mm | 9.6645 mm | 2216 | 2023-08-05 19:21:39 | CERAMIC, FP-16 | unknown | 0 | ||||||||||||||||
对比 | SY89543LMG | Microchip Technology Inc | 查询价格 | Yes | Active | 3.3 V | 510 ps | 2 | 2 | 1 | YES | HVQCCN | 89543 | MULTIPLEXER | COMPLEMENTARY | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e4 | 2 | 85 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TUBE | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 900 µm | 5 mm | 5 mm | 2188 | 2024-04-20 08:27:16 | 5 X 5 MM, LEAD FREE, MLF-32 | compliant | 8542.39.00.01 | 24.61 | SY89543LMG | Malaysia | 5A991.B.1 | [object Object] | |||||||||||||||
对比 | 74FCT157DTQ8 | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | 5 V | 3.9 ns | 4 | 2 | YES | SSOP | 50 pF | MULTIPLEXER | CMOS | 48 mA | INDUSTRIAL | R-PDSO-G16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 240 | 20 | 16 | PLASTIC/EPOXY | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | TR | Tin/Lead (Sn85Pb15) | GULL WING | 635 µm | DUAL | 2068 | 2023-08-02 01:18:47 | SSOP, SSOP16,.25 | not_compliant | 8542.39.00.01 | 0 | 74FCT157DTQ8 | |||||||||||||||||||||
对比 | SN74LS253JT | AMD | 查询价格 | No | Obsolete | 5 V | 2 | 4 | NO | DIP | 3-STATE | MULTIPLEXER | TTL | COMMERCIAL | R-XDIP-T16 | Not Qualified | e0 | 70 °C | 16 | CERAMIC | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 1653 | 2023-08-02 10:52:43 | DIP, DIP16,.3 | unknown | 8542.39.00.01 | 0 | ||||||||||||||||||||||||||||||
对比 | 5962-01-369-4975 | Intersil Corporation | 查询价格 | No | Transferred | 5 V | 16.9 ns | 1 | 8 | NO | DIP | 50 pF | MULTIPLEXER | CMOS | 24 mA | MILITARY | R-XDIP-T16 | Not Qualified | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC | DIP16,.3 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 2074 | 2023-08-02 05:58:14 | DIP, DIP16,.3 | not_compliant | 8542.39.00.01 | 5962-01-369-4975 | ||||||||||||||||||||||||||||
对比 | 74153FC | Texas Instruments | 查询价格 | No | Obsolete | 5 V | 2 | 4 | YES | DFP | MULTIPLEXER | TTL | COMMERCIAL | R-XDFP-F16 | Not Qualified | e0 | 70 °C | 16 | CERAMIC | FL16,.3 | RECTANGULAR | FLATPACK | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 2477 | 2023-08-02 00:33:00 | DFP, FL16,.3 | unknown | 8542.39.00.01 | 0 | 74153FC | ||||||||||||||||||||||||||||||
对比 | GD74HCT258J | Goldstar Electron Co Ltd | 查询价格 | Obsolete | 5 V | 46 ns | 4 | 2 | 1 | NO | DIP | 50 pF | 3-STATE | HCT | MULTIPLEXER | CMOS | INVERTED | 5.5 V | 4.5 V | INDUSTRIAL | R-CDIP-T16 | Not Qualified | 85 °C | -40 °C | 16 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | 293710898 | 2024-03-02 22:41:49 | , | unknown | 0 | ||||||||||||||||||||||||||||
对比 | QS74FCT2151THB | Quality Semiconductor Inc | 查询价格 | Obsolete | 5 V | 9 ns | 1 | 8 | 1 | YES | SERIES-RESISTOR | FCT | MULTIPLEXER | CMOS | COMPLEMENTARY | 5.25 V | 4.75 V | INDUSTRIAL | R-CDSO-G20 | Not Qualified | 85 °C | -40 °C | 20 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | GULL WING | DUAL | 293710924 | 2023-07-17 22:04:50 | , | unknown | 0 | ||||||||||||||||||||||||||||||
对比 | M38510/33906B2A | e2v technologies | 查询价格 | Active | 5 V | 7 ns | 7 ns | 4 | 2 | 1 | YES | QCCN | 3-STATE | F/FAST | MULTIPLEXER | TTL | 20 mA | TRUE | 23 mA | 5.5 V | 4.5 V | MILITARY | S-CQCC-N20 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 20 | CERAMIC, METAL-SEALED COFIRED | LCC20,.35SQ | SQUARE | CHIP CARRIER | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1937079 | 2023-08-02 13:42:37 | QLCC | QCCN, LCC20,.35SQ | 20 | compliant | 8542.39.00.01 | 4.9 | USA | EAR99 | ||||||||||||||||
对比 | HD74HC151P | Hitachi Ltd | 查询价格 | Yes | Transferred | 4.5 V | 220 ns | 44 ns | 1 | 8 | 1 | NO | DIP | 50 pF | HC/UH | MULTIPLEXER | CMOS | 4 mA | COMPLEMENTARY | 6 V | 2 V | INDUSTRIAL | R-PDIP-T16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | DIP16,.3 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 5.06 mm | 7.62 mm | 19.2 mm | 2141059 | 2023-08-01 18:53:47 | DIP | DIP, DIP16,.3 | 16 | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | 10H574/BFAJC | Motorola Mobility LLC | 查询价格 | Obsolete | 3.6 ns | 3.6 ns | 2 | 4 | 1 | YES | DFP | OPEN-EMITTER | 10H | MULTIPLEXER | ECL | TRUE | 80 mA | MILITARY | R-GDFP-F16 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC, GLASS-SEALED | FL16,.3 | RECTANGULAR | FLATPACK | TIN LEAD | FLAT | 1.27 mm | DUAL | 2.15 mm | 6.415 mm | 9.65 mm | 2141108 | 2023-08-02 10:21:12 | DFP | DFP, FL16,.3 | 16 | unknown | 8542.39.00.01 | 0 | |||||||||||||||||||
对比 | M74HC354B1N | STMicroelectronics | 查询价格 | No | Obsolete | 5 V | 71 ns | 74 ns | 1 | 8 | 1 | NO | DIP | 50 pF | 3-STATE | HC/UH | MULTIPLEXER | CMOS | TRANSPARENT ADDRESS/DATA LATCHES; 3 ENABLE INPUTS | 6 mA | COMPLEMENTARY | 6 V | 2 V | INDUSTRIAL | R-PDIP-T20 | Not Qualified | e0 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | DIP20,.3 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 3.93 mm | 7.62 mm | 2443 | 2023-08-02 15:03:02 | DIP | DIP, DIP20,.3 | 20 | not_compliant | 8542.39.00.01 | 0 | M74HC354B1N |