Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 最大时钟频率 (fCLK) | 刷新周期 | 访问模式 | 内存集成电路类型 | 其他特性 | 备用内存宽度 | I/O 类型 | 交错的突发长度 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 反向引出线 | 自我刷新 | 连续突发长度 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | YTEOL | Source Content uid | |
对比 | HMTA8GL7AHR4A-H9 | SK Hynix Inc | 查询价格 | Yes | Obsolete | 618.4753 Gbit | 72 | 8GX72 | 1.35 V | MULTI BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH; WD-MAX | 1 | 1 | 8000000000 | 8.5899 G | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | OTHER | R-XDMA-N240 | 85 °C | 240 | UNSPECIFIED | DIMM | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | 30.48 mm | 133.35 mm | 4.7 mm | 4307513 | 2022-06-04 00:19:22 | DIMM | DIMM, | 240 | compliant | EAR99 | 8542.32.00.36 | 0 | ||||||||||||||||||||||
对比 | MT18D51236M-6 | Micron Technology Inc | 查询价格 | No | No | Obsolete | 18.8744 Mbit | 36 | 512KX36 | 5 V | 60 ns | 512 | FAST PAGE | FAST PAGE DRAM MODULE | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | COMMON | 1 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | 18 mA | 828 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XSMA-N72 | Not Qualified | 1 | 70 °C | 72 | UNSPECIFIED | SIMM | SSIM72 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.27 mm | SINGLE | 25.654 mm | 2190 | 2023-08-02 13:00:38 | SIMM | SIMM-72 | 72 | unknown | EAR99 | 8542.32.00.02 | 0 | |||||||||||||||
对比 | NN514405BLRR-45 | United Microelectronics Corporation | 查询价格 | No | Obsolete | 4.1943 Mbit | 4 | 1MX4 | 5 V | 45 ns | 1024 | FAST PAGE WITH EDO | EDO DRAM | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | COMMON | 1 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | YES | YES | 150 µA | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G20 | Not Qualified | e0 | 70 °C | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20/26,.36 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 635 µm | DUAL | 4317463 | 2023-08-02 01:16:54 | TSSOP, TSSOP20/26,.36 | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||||||
对比 | MT4LC16M1A1DJ-7TR | Micron Technology Inc | 查询价格 | Obsolete | 16.7772 Mbit | 1 | 16MX1 | 3.3 V | 70 ns | 4096 | FAST PAGE | FAST PAGE DRAM | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | 1 | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-J24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | SOJ | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | J BEND | 1.27 mm | DUAL | 3.68 mm | 18.44 mm | 10.21 mm | 2190 | 2022-10-03 19:24:29 | SOJ | SOJ, | 24 | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||||||||
对比 | STI3616100H3-70TS | Simple Tech Inc | 查询价格 | Obsolete | 603.9798 Mbit | 36 | 16MX36 | 5 V | 70 ns | 4096 | FAST PAGE | FAST PAGE DRAM MODULE | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 18 | 1 | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XSMA-N72 | Not Qualified | 70 °C | 72 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | SINGLE | 293710935 | 2022-06-01 20:45:29 | SIMM-72 | unknown | 0 | ||||||||||||||||||||||||||||
对比 | KM44C4103BK-L6 | Samsung Semiconductor | 查询价格 | No | Obsolete | 16.7772 Mbit | 4 | 4MX4 | 5 V | 60 ns | 2048 | FAST PAGE | FAST PAGE DRAM | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | COMMON | 1 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 3-STATE | YES | 300 µA | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-J28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | SOJ | SOJ28,.44 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | J BEND | 1.27 mm | DUAL | 3.76 mm | 18.42 mm | 7.62 mm | 2372 | 2023-08-02 00:26:29 | SOJ | SOJ, SOJ28,.44 | 28 | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||
对比 | SM564028074NWBF | SMART Modular Technology Inc | 查询价格 | Obsolete | 134.2177 Mbit | 64 | 2MX64 | 3.3 V | SYNCHRONOUS DRAM MODULE | 1 | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | CMOS | R-XDMA-N144 | Not Qualified | 144 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | 2564871 | 2022-06-01 20:36:05 | DIMM | DIMM-144 | 144 | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||||||||||||||||||||||||
对比 | SM572084094E5S7 | SMART Modular Technology Inc | 查询价格 | Obsolete | 603.9798 Mbit | 72 | 8MX72 | 3.3 V | 70 ns | FAST PAGE WITH EDO | EDO DRAM MODULE | 1 | 1 | 8000000 | 8.3886 M | CMOS | R-XDMA-168 | Not Qualified | 168 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | 2564871 | 2022-06-01 20:37:32 | DIMM | DIMM-168 | 168 | unknown | EAR99 | 8542.32.00.32 | 0 | |||||||||||||||||||||||||||||||||
对比 | SM572168078E63C | SMART Modular Technology Inc | 查询价格 | Obsolete | 1.208 Gbit | 72 | 16MX72 | 3.3 V | SYNCHRONOUS DRAM MODULE | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | CMOS | R-XDMA-N168 | Not Qualified | 168 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | 2564871 | 2022-06-01 20:46:19 | DIMM | DIMM-168 | 168 | unknown | EAR99 | 8542.32.00.36 | 0 | ||||||||||||||||||||||||||||||||||
对比 | ESA2UN3214-70JG-S | FUJITSU Semiconductor Limited | 查询价格 | Obsolete | 67.1089 Mbit | 32 | 2MX32 | 5 V | 70 ns | FAST PAGE WITH EDO | EDO DRAM MODULE | 1 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XSMA-N72 | Not Qualified | 70 °C | 72 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | SINGLE | 4317229 | 2022-06-01 20:34:28 | , | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||||||||||||||||||||
对比 | UPD4516161AG5-A12L-9NF | Renesas Electronics Corporation | 查询价格 | No | Obsolete | 16.7772 Mbit | 16 | 1MX16 | 3.3 V | 8 ns | DUAL BANK PAGE BURST | SYNCHRONOUS DRAM | 1 | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3.6 V | 3 V | MOS | COMMERCIAL | R-PDSO-G50 | Not Qualified | 70 °C | 50 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 20.86 mm | 10.16 mm | 2354 | 2022-06-01 20:44:54 | TSOP2 | 50 | unknown | EAR99 | 8542.32.00.02 | 0 | UPD4516161AG5-A12L-9NF | ||||||||||||||||||||||
对比 | MC-4516CD64S-A10 | NEC Electronics Group | 查询价格 | Obsolete | 1.0737 Gbit | 64 | 16MX64 | 3.3 V | 6 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM MODULE | AUTO/SELF REFRESH | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 3.6 V | 3 V | MOS | COMMERCIAL | R-XDMA-N144 | Not Qualified | 70 °C | 144 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | 2219 | 2022-06-01 20:36:05 | MODULE | , | 144 | unknown | EAR99 | 8542.32.00.32 | 0 | ||||||||||||||||||||||||||
对比 | K4T1G164QD-ZCE7 | Samsung Semiconductor | 查询价格 | Yes | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | 400 ps | 400 MHz | 8192 | DDR2 DRAM | COMMON | 4,8 | 64000000 | 67.1089 M | 3-STATE | 4,8 | 15 mA | 280 µA | CMOS | R-PBGA-B84 | Not Qualified | 3 | 260 | 84 | PLASTIC/EPOXY | FBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 2372 | 2023-08-05 19:25:34 | unknown | EAR99 | 8542.32.00.32 | 0 | ||||||||||||||||||||||||
对比 | IBM11D8360BB-60 | IBM | 查询价格 | Obsolete | 301.9899 Mbit | 36 | 8MX36 | 5 V | 60 ns | 2048 | FAST PAGE | FAST PAGE DRAM MODULE | RAS ONLY/CAS BEFORE RAS REFRESH | 18 | 1 | 1 | 8000000 | 8.3886 M | ASYNCHRONOUS | 3-STATE | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XSMA-N72 | Not Qualified | 70 °C | 72 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | SINGLE | 2050 | 2022-06-01 20:38:56 | SIMM | , | 72 | unknown | EAR99 | 8542.32.00.28 | 0 | ||||||||||||||||||||||||
对比 | GMM7361000DSG-60 | LG Semicon Co Ltd | 查询价格 | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 5 V | 60 ns | 1024 | FAST PAGE | FAST PAGE DRAM MODULE | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 18 | COMMON | 1 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | 12 mA | 1.24 mA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XSMA-N72 | Not Qualified | 70 °C | 72 | UNSPECIFIED | SIMM | SSIM72 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.27 mm | SINGLE | 25.4 mm | 293710903 | 2023-08-01 20:28:46 | SIMM-72 | unknown | 0 | |||||||||||||||||||||
对比 | AEPDD4X1M5-10N | Advanced Electronic Packaging | 查询价格 | Obsolete | 20.9715 Mbit | 20 | 1MX20 | 5 V | 100 ns | 2048 | NIBBLE | DRAM MODULE | CONFIGURABLE AS 4M X 5 | 10 | 1 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | MIXMOS | R-XDIP-T72 | Not Qualified | 72 | UNSPECIFIED | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 227497184 | 2022-06-01 20:34:51 | , | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||||||||||||||||||||
对比 | STI84000-80TH | Simple Tech Inc | 查询价格 | Obsolete | 33.5544 Mbit | 8 | 4MX8 | 5 V | 80 ns | 1024 | FAST PAGE | FAST PAGE DRAM MODULE | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 1 | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 3-STATE | 5.5 V | 4.5 V | MOS | COMMERCIAL | R-XSMA-N30 | Not Qualified | 70 °C | 30 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | SINGLE | 293710935 | 2022-06-01 20:32:41 | SIMM-30 | unknown | 0 | |||||||||||||||||||||||||||||
对比 | HYM5V36123ASLTX-70 | SK Hynix Inc | 查询价格 | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 3.3 V | 70 ns | 1024 | FAST PAGE | FAST PAGE DRAM MODULE | SELF REFRESH | 1 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-XDMA-N72 | Not Qualified | 70 °C | 72 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | 4307513 | 2022-06-01 20:46:14 | DIMM | , | 72 | unknown | EAR99 | 8542.32.00.02 | 0 | ||||||||||||||||||||||||
对比 | HY51V17804BSLT-70 | SK Hynix Inc | 查询价格 | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3.3 V | 70 ns | 2048 | FAST PAGE WITH EDO | EDO DRAM | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | COMMON | 1 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | YES | 200 µA | 100 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | TSOP2 | TSOP28,.34 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 1.2 mm | 18.41 mm | 7.62 mm | 4307513 | 2023-08-02 05:17:06 | TSOP | TSOP2, TSOP28,.34 | 28 | compliant | EAR99 | 8542.32.00.02 | 0 | ||||||||||||
对比 | K4F660411B-TC45 | Samsung Semiconductor | 查询价格 | No | Obsolete | 67.1089 Mbit | 4 | 16MX4 | 5 V | 45 ns | 8192 | FAST PAGE | FAST PAGE DRAM | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | COMMON | 1 | 1 | 16000000 | 16.7772 M | ASYNCHRONOUS | 3-STATE | NO | 1 mA | 100 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | TSOP2 | TSOP32,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 1.2 mm | 20.95 mm | 10.16 mm | 2372 | 2023-08-01 18:43:40 | TSOP2 | TSOP2, TSOP32,.46 | 32 | unknown | EAR99 | 8542.32.00.02 | 0 |