Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 内存集成电路类型 | 备用内存宽度 | I/O 类型 | 功能数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 | 编程电压 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | YTEOL | Source Content uid | |
对比 | MBM27C256-25 | FUJITSU Limited | 查询价格 | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CQCC-N32 | Not Qualified | 70 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | RECTANGULAR | CHIP CARRIER, WINDOW | YES | NO LEAD | 1.27 mm | QUAD | 3.3 mm | 13.97 mm | 11.43 mm | 2000 | 2024-04-02 15:23:30 | QFJ | WQCCN, | 32 | unknown | EAR99 | 8542.32.00.61 | 0 | |||||||||||||||||
对比 | DPV128X16A-20I | Twilight Technology Inc | 查询价格 | No | No | Contact Manufacturer | 2.0972 Mbit | 8 | 256KX8 | 5 V | 200 ns | UVPROM MODULE | 16 | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 200 µA | 100 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-XQMA-P40 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 40 | UNSPECIFIED | PGA | PGA40,6X10MOD | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | PIN/PEG | 2.54 mm | QUAD | 4317460 | 2023-08-02 02:27:16 | PGA, PGA40,6X10MOD | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||
对比 | 5962-8766104XX | QP Semiconductor | 查询价格 | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 170 ns | UVPROM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 2328 | 2024-03-01 18:26:28 | DIP | DIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||||||||||||
对比 | M27C4002-15XJ1X | STMicroelectronics | 查询价格 | Yes | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 5 V | 150 ns | UVPROM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 70 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | S-CQCC-J44 | Not Qualified | e3 | 70 °C | 44 | CERAMIC, METAL-SEALED COFIRED | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.83 mm | 16.51 mm | 16.51 mm | 2443 | 2023-08-01 21:49:05 | LCC | WINDOWED, CERAMIC, LCC-44 | 44 | compliant | EAR99 | 8542.32.00.61 | 0 | M27C4002-15XJ1X | ||||||||||
对比 | 5662-860632YC | e2v technologies | 查询价格 | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 1937079 | 2023-09-04 17:42:47 | QFJ | CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | 3.75 | |||||||||||||||||||||
对比 | AM27C256-200DC | Spansion | 查询价格 | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-CDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | 2419 | 2024-04-02 19:18:39 | DIP | DIP-28 | 28 | unknown | EAR99 | 8542.32.00.61 | 0 | ||||||||||||||||||
对比 | AM27C400-95DI | AMD | 查询价格 | No | No | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 90 ns | UVPROM | 16 | COMMON | 1 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 40 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-GDIP-T40 | Not Qualified | e0 | 85 °C | -40 °C | 40 | CERAMIC, GLASS-SEALED | WDIP | DIP40,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 52.2605 mm | 15.24 mm | 1653 | 2023-08-02 14:37:11 | DIP | WDIP, DIP40,.6 | 40 | unknown | EAR99 | 8542.32.00.61 | 0 | ||||||||
对比 | AM2764A-1LE | AMD | 查询价格 | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | OTP ROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 5.25 V | 4.75 V | NMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | 1653 | 2024-04-02 18:20:57 | QFJ | QCCN, LCC32,.45X.55 | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | 0 | ||||||||||
对比 | M27C1001-25XF6X | STMicroelectronics | 查询价格 | Yes | Yes | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-GDIP-T32 | Not Qualified | e3 | 85 °C | -40 °C | 32 | CERAMIC, GLASS-SEALED | WDIP | DIP32,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.97 mm | 41.885 mm | 15.24 mm | 2443 | 2023-08-02 13:38:28 | DIP | FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | 32 | compliant | EAR99 | 8542.32.00.61 | 0 | M27C1001-25XF6X | ||||||||
对比 | M27C1001-90L3 | STMicroelectronics | 查询价格 | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 90 ns | UVPROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -40 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.28 mm | 13.97 mm | 11.43 mm | 2443 | 2023-08-02 01:11:04 | QFJ | CERAMIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.61 | 0 | M27C1001-90L3 | |||||||||
对比 | AM27C64-155DCB | AMD | 查询价格 | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | 70 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | 1653 | 2023-08-02 12:08:15 | DIP | WDIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | 0 | ||||||||||||
对比 | MX27C8000DC-15 | Macronix International Co Ltd | 查询价格 | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 60 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T32 | Not Qualified | 70 °C | 32 | CERAMIC, GLASS-SEALED | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.7912 mm | 41.91 mm | 15.24 mm | 4307504 | 2023-08-02 10:16:28 | DIP | DIP, DIP32,.6 | 32 | unknown | EAR99 | 8542.32.00.61 | 0 | ||||||||||||||
对比 | WS57C51C-70T | Waferscale Integration Inc | 查询价格 | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 70 ns | UVPROM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 107 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-GDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 293710952 | 2023-08-01 19:13:33 | CERDIP-28 | unknown | ||||||||||||||||||||
对比 | 5962-8513501YX | Intel Corporation | 查询价格 | Obsolete | UVPROM | Not Qualified | 2071 | 2024-03-02 21:58:04 | unknown | EAR99 | 8542.32.00.61 | 0 | ||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | AM27C64-255DCB | Rochester Electronics LLC | 查询价格 | Contact Manufacturer | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-CDIP-T28 | e0 | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | 2178096 | 2024-04-02 15:36:44 | DIP, | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||||||||||||
对比 | AT27HC256-70KI | Atmel Corporation | 查询价格 | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 70 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | 12.5 V | 45 mA | 90 µA | CMOS | INDUSTRIAL | R-XQCC-J32 | Not Qualified | e0 | 2 | 85 °C | -40 °C | 225 | 32 | CERAMIC | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 1773 | 2024-04-02 18:22:24 | QCCJ, LDCC32,.5X.6 | unknown | EAR99 | 8542.32.00.61 | 0 | |||||||||||||||
对比 | WS57C210M-90R | Waferscale Integration Inc | 查询价格 | No | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 5 V | 90 ns | UVPROM | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 mA | 200 µA | CMOS | COMMERCIAL | R-XDIP-T40 | Not Qualified | e0 | 70 °C | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 293710952 | 2024-04-02 16:03:28 | unknown | EAR99 | 8542.32.00.61 | 0 | ||||||||||||||||||||
对比 | MBM27C512-25CV | FUJITSU Semiconductor Limited | 查询价格 | No | Obsolete | 524.288 kbit | 8 | 64KX8 | 5 V | 250 ns | UVPROM CARD | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 µA | CMOS | COMMERCIAL | R-XQCC-N32 | Not Qualified | e0 | 70 °C | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 4317229 | 2024-04-02 15:53:05 | QCCN, LCC32,.45X.55 | unknown | EAR99 | 8542.32.00.61 | 0 | |||||||||||||||||||
对比 | M27C256B-20XF1 | STMicroelectronics | 查询价格 | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 200 µA | 30 µA | 5.25 V | 4.75 V | CMOS | COMMERCIAL | R-CDIP-T28 | Not Qualified | e3 | 70 °C | 28 | CERAMIC, METAL-SEALED COFIRED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 36.92 mm | 15.24 mm | 2443 | 2023-08-05 19:32:41 | DIP | 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.61 | 0 | M27C256B-20XF1 | |||||||||
对比 | QD27210-200V10 | Intel Corporation | 查询价格 | No | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 5 V | 200 ns | UVPROM | COMMON | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 200 µA | MOS | COMMERCIAL | R-XDIP-T40 | e0 | 70 °C | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 2071 | 2024-04-02 17:48:54 | DIP, DIP40,.6 | unknown | EAR99 | 8542.32.00.61 | 0 |