Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 最大时钟频率 (fCLK) | 周期时间 | 内存集成电路类型 | 其他特性 | 功能数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 可输出 | 并行/串行 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | ECCN代码 | HTS代码 | YTEOL | Source Content uid | 零件包装代码 | 针数 | 制造商包装代码 | Date Of Intro | |
对比 | 5962-01-213-4590 | AMD | 查询价格 | No | Obsolete | 4 | 64X4 | 5 V | 1.2 MHz | OTHER FIFO | 64 | 64 words | ASYNCHRONOUS | MOS | COMMERCIAL | R-XDIP-T16 | Not Qualified | 70 °C | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 1653 | 2023-08-01 23:41:30 | DIP, DIP16,.3 | compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||||||||
对比 | 72142S80C | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | 36.864 kbit | 9 | 4KX9 | 5 V | 80 ns | 10 MHz | OTHER FIFO | 4000 | 4.096 k | ASYNCHRONOUS | 8 mA | 140 µA | CMOS | COMMERCIAL | R-XDIP-T28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 2068 | 2023-08-02 07:00:43 | not_compliant | EAR99 | 8542.32.00.71 | 0 | 72142S80C | |||||||||||||||||||||||
对比 | MN4774S-04 | Panasonic Electronic Components | 查询价格 | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 5 V | 30 ns | 40 ns | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | R-PDSO-G28 | Not Qualified | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.52 mm | 17.81 mm | 8.4 mm | 2274 | 2022-06-01 20:45:04 | 0.425 INCH, PLASTIC, SOP-28 | unknown | EAR99 | 8542.32.00.71 | 0 | SOIC | 28 | ||||||||||||||||||||||||
对比 | CLTI-67201V-65 | Matra MHS | 查询价格 | Obsolete | 4.608 kbit | 9 | 512X9 | 3.3 V | 65 ns | 80 ns | OTHER FIFO | RETRANSMIT; 2V DATA RETENTION | 1 | 512 | 512 words | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | 116152012 | 2024-04-02 18:19:09 | , | unknown | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | IL3P-67202L-65 | Matra MHS | 查询价格 | Obsolete | 9.216 kbit | 9 | 1KX9 | 3.3 V | 65 ns | 80 ns | OTHER FIFO | RETRANSMIT; 2V DATA RETENTION | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 70 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 116152012 | 2024-04-02 18:13:02 | , | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||||
对比 | AL0-67202AL-20 | Temic Semiconductors | 查询价格 | Transferred | 9.216 kbit | 9 | 1KX9 | 3.3 V | 20 ns | 30 ns | BI-DIRECTIONAL FIFO | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | CMOS | AUTOMOTIVE | X-XUUC-N28 | Not Qualified | 125 °C | -40 °C | 28 | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | YES | NO LEAD | UPPER | 293710942 | 2024-04-02 15:17:21 | unknown | ||||||||||||||||||||||||||||||
对比 | AM1P-67202AV-55SHXXX:D | Temic Semiconductors | 查询价格 | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 55 ns | 70 ns | 1 | 1000 | 1.024 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | AUTOMOTIVE | R-GDIP-T28 | Not Qualified | 125 °C | -40 °C | 28 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 293710942 | 2023-04-01 19:46:06 | unknown | ||||||||||||||||||||||||||||||
对比 | SL4J-67201EV-55MH | Matra MHS | 查询价格 | Obsolete | 4.608 kbit | 9 | 512X9 | 3.3 V | 55 ns | 70 ns | OTHER FIFO | RETRANSMIT; 2V DATA RETENTION | 1 | 512 | 512 words | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 70 µA | 3.6 V | 3 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | 116152012 | 2024-04-02 18:13:15 | , | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||||
对比 | IDT7200L20JB | Integrated Device Technology Inc | 查询价格 | No | No | Transferred | 2.304 kbit | 9 | 256X9 | 5 V | 20 ns | 33.3 MHz | 30 ns | OTHER FIFO | RETRANSMIT | 1 | 256 | 256 words | ASYNCHRONOUS | NO | PARALLEL | 15 mA | 100 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-PQCC-J32 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 225 | MIL-STD-883 Class B | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | 2068 | 2023-08-01 19:53:59 | QCCJ, LDCC32,.5X.6 | not_compliant | EAR99 | 8542.32.00.71 | IDT7200L20JB | QFJ | 32 | ||||||
对比 | CY7C4285-35ASI | Rochester Electronics LLC | 查询价格 | Active | 1.1796 Mbit | 18 | 64KX18 | 5 V | 20 ns | 35 ns | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G64 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 2178096 | 2024-04-02 15:46:19 | LFQFP, | unknown | EAR99 | 8542.32.00.71 | 4.65 | |||||||||||||||||||||
对比 | IDT72T55258L6-7BBI | Integrated Device Technology Inc | 查询价格 | No | Obsolete | 2.6214 Mbit | 40 | 64KX40 | 2.5 V | 3.8 ns | 200 MHz | 6.7 ns | OTHER FIFO | 1 | 64000 | 65.536 k | SYNCHRONOUS | YES | PARALLEL | 330 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn63Pb37) | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | 2068 | 2023-08-02 14:12:09 | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | not_compliant | EAR99 | 8542.32.00.71 | 0 | IDT72T55258L6-7BBI | BGA | 324 | |||||||||
对比 | 72021S80CB | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 80 ns | 10 MHz | OTHER FIFO | 1000 | 1.024 k | ASYNCHRONOUS | 9 mA | 100 µA | CMOS | MILITARY | R-XDIP-T32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 2068 | 2023-08-02 10:39:56 | not_compliant | EAR99 | 8542.32.00.71 | 0 | 72021S80CB | |||||||||||||||||||||
对比 | 72V801L10TFG | Integrated Device Technology Inc | 查询价格 | Yes | Yes | Obsolete | 2.304 kbit | 9 | 256X9 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | BI-DIRECTIONAL FIFO | 1 | 256 | 256 words | SYNCHRONOUS | YES | PARALLEL | 10 mA | 40 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 2068 | 2023-08-01 23:16:19 | LFQFP, QFP64,.47SQ,20 | compliant | EAR99 | 8542.32.00.71 | 0 | 72V801L10TFG | QFP | 64 | ||||||||
对比 | 7208L25J8 | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 28.5 MHz | 35 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | 2068 | 2023-08-02 04:15:00 | PLASTIC, LCC-32 | not_compliant | EAR99 | 8542.32.00.71 | 0 | 7208L25J8 | PLCC | 32 | PL32 | ||||||
对比 | IMDP-67201AV-55SHXXX:D | Atmel Corporation | 查询价格 | Obsolete | 4.608 kbit | 9 | 512X9 | 5 V | 55 ns | 70 ns | OTHER FIFO | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 100 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDFP-F28 | Not Qualified | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | FLATPACK | YES | FLAT | DUAL | 1773 | 2024-04-02 15:44:55 | , | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||||||
对比 | 72V3662L15PF8 | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | 147.456 kbit | 36 | 4KX36 | 3.3 V | 10 ns | 66.7 MHz | 15 ns | BI-DIRECTIONAL FIFO | MAIL BOX BYPASS REGISTER | 1 | 4000 | 4.096 k | SYNCHRONOUS | YES | PARALLEL | 1 mA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G120 | Not Qualified | e0 | 4 | 70 °C | 240 | 30 | 120 | PLASTIC/EPOXY | LFQFP | QFP120,.63SQ,16 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 400 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 2068 | 2023-08-02 03:39:27 | TQFP-120 | not_compliant | EAR99 | 8542.32.00.71 | 0 | 72V3662L15PF8 | TQFP | 120 | PN120 | |||||||
对比 | IDT7271L50TP | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | 9 | 512X9 | 5 V | 50 ns | 15.4 MHz | BI-DIRECTIONAL FIFO | 512 | 512 words | ASYNCHRONOUS | 8 mA | 120 µA | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | DIP | DIP32,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 2068 | 2023-08-02 11:36:57 | not_compliant | EAR99 | 8542.32.00.71 | 0 | IDT7271L50TP | ||||||||||||||||||||||||
对比 | 7204L35TPG8 | Integrated Device Technology Inc | 查询价格 | Yes | Transferred | 2068 | 2022-02-28 16:33:47 | , | unknown | EAR99 | 8542.32.00.71 | 7204L35TPG8 | 2019-12-19 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
对比 | 7207L50PB | Integrated Device Technology Inc | 查询价格 | No | No | Transferred | 294.912 kbit | 9 | 32KX9 | 5 V | 50 ns | 65 ns | 1 | 32000 | 32.768 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-PDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | 2068 | 2022-01-28 01:57:46 | DIP, | compliant | EAR99 | 8542.32.00.71 | 7207L50PB | DIP | 28 | |||||||||||||||||||
对比 | 7202S65LB | Integrated Device Technology Inc | 查询价格 | No | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 65 ns | 80 ns | OTHER FIFO | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 140 µA | CMOS | MILITARY | R-XQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 2068 | 2024-04-02 15:58:31 | unknown | EAR99 | 8542.32.00.71 | 0 | 7202S65LB |