Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 内存集成电路类型 | I/O 类型 | 功能数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 并行/串行 | 编程电压 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | YTEOL | Country Of Origin | |
对比 | M27V101-100N6TR | STMicroelectronics | 查询价格 | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 3.3 V | 100 ns | OTP ROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 20 µA | 15 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | M27V101-100N6TR | 2443 | 2023-08-02 06:14:02 | TSOP | 8 X 20 MM, PLASTIC, TSOP-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | 0 | |||||||||
对比 | M27C256B-15XM7 | STMicroelectronics | 查询价格 | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 150 ns | COMMON | 32000 | 32.768 k | 3-STATE | 12.75 V | 100 µA | 30 µA | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 105 °C | -40 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | M27C256B-15XM7 | 2443 | 2023-08-01 18:39:16 | not_compliant | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||
对比 | 5962-01-383-4103 | Intersil Corporation | 查询价格 | No | Obsolete | 4.096 kbit | 4 | 1KX4 | 5 V | 70 ns | OTP ROM | 1000 | 1.024 k | TTL | MILITARY | R-XDIP-T18 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 18 | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5962-01-383-4103 | 2074 | 2023-08-02 13:46:02 | DIP, DIP18,.3 | not_compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | HM1-7643B-5 | Intersil Corporation | 查询价格 | No | Obsolete | 4.096 kbit | 4 | 1KX4 | 5 V | 45 ns | OTP ROM | 1000 | 1.024 k | TTL | COMMERCIAL | R-XDIP-T18 | Not Qualified | e0 | 70 °C | 18 | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | HM1-7643B-5 | 2074 | 2023-08-01 22:55:05 | DIP, DIP18,.3 | not_compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | N82HS321CN3 | Philips Semiconductors | 查询价格 | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 25 ns | OTP ROM | 4000 | 4.096 k | 175 µA | TTL | COMMERCIAL | R-PDIP-T24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 166795790 | 2023-08-02 15:07:33 | DIP, DIP24,.3 | unknown | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | 5962-01-183-9559 | Texas Instruments | 查询价格 | No | Obsolete | 8 | 32X8 | 5 V | 40 ns | OTP ROM | 32 | 32 words | 110 µA | TTL | COMMERCIAL | R-PDIP-T16 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5962-01-183-9559 | 2477 | 2023-08-02 07:16:37 | DIP, DIP16,.3 | not_compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | AM27S20APCTB | AMD | 查询价格 | No | Obsolete | 1.024 kbit | 4 | 256X4 | 5 V | 30 ns | OTP ROM | 256 | 256 words | 130 µA | TTL | COMMERCIAL | R-PDIP-T16 | e0 | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 1653 | 2023-08-02 10:13:46 | DIP, DIP16,.3 | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||||||
对比 | UT28F256LVC-65PCC | Cobham Advanced Electronic Solutions | 查询价格 | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.3 V | 65 ns | OTP ROM | 32000 | 32.768 k | 1 mA | 50 µA | CMOS | R-XDIP-T28 | Not Qualified | e0 | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 163862848 | 2023-08-02 09:30:37 | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||||||
对比 | TBP38S03X-15FN | Texas Instruments | 查询价格 | No | Obsolete | 8 | 32X8 | 5 V | 15 ns | OTP ROM | 32 | 32 words | 125 µA | TTL | COMMERCIAL | S-PQCC-J20 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 20 | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | TBP38S03X-15FN | 2477 | 2023-08-02 05:15:34 | QCCJ, LDCC20,.4SQ | not_compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | 5962-01-266-0869 | Texas Instruments | 查询价格 | No | Obsolete | 8.192 kbit | 4 | 2KX4 | 85 ns | OTP ROM | 2000 | 2.048 k | 175 µA | TTL | MILITARY | R-XDIP-T18 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | 38535Q/M;38534H;883B | NOT SPECIFIED | 18 | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5962-01-266-0869 | 2477 | 2023-08-01 23:40:42 | DIP, DIP18,.3 | not_compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||
对比 | AT27C513R-25JC | Microchip Technology Inc | 查询价格 | No | Active | 524.288 kbit | 8 | 64KX8 | 5 V | 250 ns | OTP ROM | COMMON | 64000 | 65.536 k | 3-STATE | 100 µA | 20 µA | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 2 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | AT27C513R-25JC | 2188 | 2023-08-30 01:21:54 | unknown | EAR99 | 8542.32.00.71 | 3.75 | Thailand | |||||||||||||||||||
对比 | 93451DM | Fairchild Semiconductor Corporation | 查询价格 | No | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | OTP ROM | 1000 | 1.024 k | TTL | MILITARY | R-XDIP-T24 | Not Qualified | e0 | 2A | 125 °C | -55 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 93451DM | 1978 | 2023-08-02 08:31:51 | DIP, DIP24,.6 | compliant | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||
对比 | AM27S23A/B2A | Rochester Electronics LLC | 查询价格 | Active | 2.048 kbit | 8 | 256X8 | 5 V | 40 ns | OTP ROM | 1 | 256 | 256 words | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | BIPOLAR | MILITARY | S-CQCC-N20 | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 20 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 8.89 mm | 8.89 mm | 2178096 | 2023-08-30 02:08:41 | QCCN, | unknown | EAR99 | 8542.32.00.71 | 3.55 | |||||||||||||||||||
对比 | AM27S21DCB-G | Rochester Electronics LLC | 查询价格 | Active | OTP ROM | NOT SPECIFIED | NOT SPECIFIED | 2178096 | 2023-08-30 01:08:51 | , | unknown | EAR99 | 8542.32.00.71 | 4.62 | ||||||||||||||||||||||||||||||||||||||||||||||||
对比 | SN74S475N | Texas Instruments | 查询价格 | No | Obsolete | 4.096 kbit | 8 | 512X8 | 75 ns | OTP ROM | 512 | 512 words | 155 µA | TTL | COMMERCIAL | R-PDIP-T24 | Not Qualified | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | SN74S475N | 2477 | 2023-08-01 20:33:34 | DIP, DIP24,.6 | not_compliant | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||||
对比 | 5330-1J | Monolithic Memories (RETIRED) | 查询价格 | No | Obsolete | 8 | 32X8 | 5 V | 60 ns | OTP ROM | 32 | 32 words | 125 µA | TTL | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 293710911 | 2023-08-02 05:51:48 | DIP, DIP16,.3 | unknown | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||||||
对比 | AM27C040-120PC | Spansion | 查询价格 | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 5 V | 120 ns | OTP ROM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T32 | Not Qualified | 70 °C | 32 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.715 mm | 42.03 mm | 15.24 mm | 2419 | 2022-06-01 20:45:04 | DIP | DIP, | 32 | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||
对比 | NM27LV210FE200 | Texas Instruments | 查询价格 | No | No | Obsolete | 1.0486 Mbit | 16 | 64KX16 | 3.3 V | 200 ns | OTP ROM | COMMON | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 20 µA | 20 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G44 | Not Qualified | e0 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 10 mm | 10 mm | NM27LV210FE200 | 2477 | 2023-08-01 22:05:05 | QFP | LQFP, QFP44,.47SQ,32 | 44 | unknown | EAR99 | 8542.32.00.71 | 0 | ||||||||
对比 | TMS27PC010A-12FME4 | Texas Instruments | 查询价格 | Yes | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 120 ns | OTP ROM | COMMON | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 100 µA | 30 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | TMS27PC010A-12FME4 | 2477 | 2023-08-02 13:36:07 | QCCJ, LDCC32,.5X.6 | compliant | EAR99 | 8542.32.00.71 | 0 | |||||||||||
对比 | AT27LV020-15JIT/R | Atmel Corporation | 查询价格 | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 5 V | 150 ns | OTP ROM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5.5 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | 1773 | 2022-06-01 20:37:32 | QFJ | QCCJ, | 32 | unknown | EAR99 | 8542.32.00.71 | 0 |