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| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||
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| 对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 电源 | 最长访问时间 | 内存集成电路类型 | 备用内存宽度 | 命令用户界面 | 数据轮询 | 功能数量 | 字数代码 | 字数 | 工作模式 | 页面大小 | 并行/串行 | 就绪/忙碌 | 最大待机电流 | 最大压摆率 | 技术 | 温度等级 | 切换位 | JESD-30 代码 | 认证状态 | JESD-609代码 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | Source Content uid | ECCN代码 | HTS代码 | YTEOL | |
| 对比 | 24LC16T-I/SL | Rochester Electronics LLC | 查询价格 | Active | 2178096 | 2019-06-09 18:51:55 | , | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||
| 对比 | M28C17-A25WKA6T | STMicroelectronics | 查询价格 | Yes | Yes | Contact Manufacturer | 16.384 kbit | 8 | 2KX8 | 3/3.3 V | 250 ns | EEPROM | NO | YES | 2000 | 2.048 k | 32 words | PARALLEL | YES | 20 µA | 15 µA | CMOS | INDUSTRIAL | NO | R-PQCC-J32 | Not Qualified | e3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 2443 | 2023-10-04 16:04:16 | QCCJ, LDCC32,.5X.6 | compliant | M28C17-A25WKA6T | |||||||||
| 对比 | M28C17-A30WKA6T | STMicroelectronics | 查询价格 | Yes | Yes | Contact Manufacturer | 16.384 kbit | 8 | 2KX8 | 3/3.3 V | 300 ns | EEPROM | NO | YES | 2000 | 2.048 k | 32 words | PARALLEL | YES | 20 µA | 15 µA | CMOS | INDUSTRIAL | NO | R-PQCC-J32 | Not Qualified | e3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 2443 | 2023-10-04 15:57:20 | QCCJ, LDCC32,.5X.6 | compliant | M28C17-A30WKA6T | |||||||||
| 对比 | M28C16-A30WNS6T | STMicroelectronics | 查询价格 | No | No | Contact Manufacturer | 16.384 kbit | 8 | 2KX8 | 3/3.3 V | 300 ns | EEPROM | NO | YES | 2000 | 2.048 k | 32 words | PARALLEL | YES | 20 µA | 15 µA | CMOS | INDUSTRIAL | YES | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 550 µm | DUAL | 2443 | 2023-10-04 15:57:45 | TSSOP, TSSOP28,.53,22 | compliant | M28C16-A30WNS6T | |||||||||
| 对比 | MB838200BL-20PFTR | FUJITSU Semiconductor Limited | 查询价格 | Contact Manufacturer | 8.3886 Mbit | 16 | 512KX16 | 3 V | 200 ns | MASK ROM | 8 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 10 µA | 25 µA | CMOS | COMMERCIAL | R-PDSO-G48 | Not Qualified | e0 | 70 °C | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | DUAL | 4317229 | 2024-04-02 15:35:26 | TSSOP, TSSOP48,.71,20 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||
| 对比 | MB838200B-12PF | FUJITSU Semiconductor Limited | 查询价格 | Contact Manufacturer | 8.3886 Mbit | 16 | 512KX16 | 5 V | 120 ns | MASK ROM | 8 | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 10 µA | 50 µA | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | e0 | 70 °C | 44 | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 4317229 | 2024-04-02 15:46:56 | SOP, SOP44,.63 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||
| 对比 | M28C17-A25WNS6 | STMicroelectronics | 查询价格 | No | No | Contact Manufacturer | 16.384 kbit | 8 | 2KX8 | 3/3.3 V | 250 ns | EEPROM | NO | YES | 2000 | 2.048 k | 32 words | PARALLEL | YES | 20 µA | 15 µA | CMOS | INDUSTRIAL | NO | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 550 µm | DUAL | 2443 | 2023-10-04 15:57:41 | TSSOP, TSSOP28,.53,22 | compliant | M28C17-A25WNS6 | |||||||||
| 对比 | MB7132LZ | FUJITSU Semiconductor Limited | 查询价格 | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 70 ns | OTP ROM | 1000 | 1.024 k | 60 µA | TTL | COMMERCIAL | R-XDIP-T24 | Not Qualified | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4317229 | 2023-08-02 13:30:35 | DIP, DIP24,.6 | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||
| 对比 | MB7133ECV | FUJITSU Semiconductor Limited | 查询价格 | Obsolete | 16.384 kbit | 4 | 4KX4 | 55 ns | OTP ROM | 4000 | 4.096 k | 170 µA | TTL | COMMERCIAL | S-XQCC-N28 | Not Qualified | e0 | 70 °C | 28 | CERAMIC | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 4317229 | 2023-08-02 03:22:48 | QCCN, LCC28,.45SQ | unknown | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||
| 对比 | MB7137HZ | FUJITSU Semiconductor Limited | 查询价格 | Obsolete | 16.384 kbit | 8 | 2KX8 | 45 ns | OTP ROM | 2000 | 2.048 k | TTL | COMMERCIAL | R-XDIP-T24 | Not Qualified | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 4317229 | 2023-08-01 20:31:16 | DIP, DIP24,.6 | unknown | EAR99 | 8542.32.00.71 | 0 | |||||||||||||||||||||
| 对比 | MB7111EF | FUJITSU Semiconductor Limited | 查询价格 | Obsolete | 8 | 32X8 | 5 V | 35 ns | OTP ROM | 32 | 32 words | 100 µA | TTL | COMMERCIAL | R-PDSO-G16 | Not Qualified | e0 | 70 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | 4317229 | 2023-08-01 18:33:54 | SOP, SOP16,.4 | unknown | EAR99 | 8542.32.00.71 | 0 | ||||||||||||||||||||
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