PROMs_PROMs型号_PROMs参数-datasheet5电子元器件查询网

								Most Relevant						Technical																	Compliance			Operating Conditions				Physical											Other
对比	制造商型号	制造商	综合价格	风险等级	是否无铅	是否Rohs认证	生命周期	内存密度	内存宽度	组织	标称供电电压 (Vsup)	电源	最长访问时间	内存集成电路类型	备用内存宽度	命令用户界面	数据轮询	功能数量	字数代码	字数	工作模式	输出特性	页面大小	并行/串行	就绪/忙碌	最大待机电流	最大压摆率	技术	温度等级	切换位	JESD-30 代码	认证状态	JESD-609代码	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	mfrid	Modified On	包装说明	是否符合REACH标准	ECCN代码	HTS代码	YTEOL	Source Content uid
对比	MB7127EZ-W	FUJITSU Semiconductor Limited	查询价格				Obsolete	8.192 kbit	4	2KX4			55 ns	OTP ROM					2000	2.048 k								TTL	MILITARY		R-XDIP-T18	Not Qualified	e0	125 °C	-55 °C			18	CERAMIC	DIP	DIP18,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-02 08:12:23	DIP, DIP18,.3	unknown	EAR99	8542.32.00.71	0
对比	MB7138ECF	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	8	2KX8	5 V		55 ns	OTP ROM					2000	2.048 k							180 µA	TTL	COMMERCIAL		R-XDFP-F24	Not Qualified	e0	70 °C				24	CERAMIC	DFP	FL24,.4	RECTANGULAR	FLATPACK	YES	Tin/Lead (Sn/Pb)	FLAT	1.27 mm	DUAL	4317229	2023-08-02 02:01:41	DFP, FL24,.4	unknown	EAR99	8542.32.00.71	0
对比	MB838200BL-20PFTR	FUJITSU Semiconductor Limited	查询价格				Contact Manufacturer	8.3886 Mbit	16	512KX16	3 V		200 ns	MASK ROM	8			1	512000	524.288 k	ASYNCHRONOUS			PARALLEL		10 µA	25 µA	CMOS	COMMERCIAL		R-PDSO-G48	Not Qualified	e0	70 °C				48	PLASTIC/EPOXY	TSSOP	TSSOP48,.71,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	DUAL	4317229	2024-04-02 15:35:26	TSSOP, TSSOP48,.71,20	unknown	EAR99	8542.32.00.71
对比	M28C17-A30WKA6T	STMicroelectronics	查询价格		Yes	Yes	Contact Manufacturer	16.384 kbit	8	2KX8		3/3.3 V	300 ns	EEPROM		NO	YES		2000	2.048 k			32 words	PARALLEL	YES	20 µA	15 µA	CMOS	INDUSTRIAL	NO	R-PQCC-J32	Not Qualified	e3	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	32	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn)	J BEND	1.27 mm	QUAD	2443	2023-10-04 15:57:20	QCCJ, LDCC32,.5X.6	compliant				M28C17-A30WKA6T
对比	MB7132LM	FUJITSU Semiconductor Limited	查询价格				Obsolete	8.192 kbit	8	1KX8	5 V		70 ns	OTP ROM					1000	1.024 k							60 µA	TTL	COMMERCIAL		R-PDIP-T24	Not Qualified	e0	70 °C				24	PLASTIC/EPOXY	DIP	DIP24,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-01 19:25:53	DIP, DIP24,.6	unknown	EAR99	8542.32.00.71	0
对比	MB7131HZ-SK	FUJITSU Semiconductor Limited	查询价格				Obsolete	8.192 kbit	8	1KX8			45 ns	OTP ROM					1000	1.024 k							175 µA	TTL	COMMERCIAL		R-XDIP-T24	Not Qualified	e0	70 °C				24	CERAMIC	DIP	DIP24,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-01 20:26:55	DIP, DIP24,.3	unknown	EAR99	8542.32.00.71	0
对比	MB7133ECV	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	4	4KX4			55 ns	OTP ROM					4000	4.096 k							170 µA	TTL	COMMERCIAL		S-XQCC-N28	Not Qualified	e0	70 °C				28	CERAMIC	QCCN	LCC28,.45SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	NO LEAD	1.27 mm	QUAD	4317229	2023-08-02 03:22:48	QCCN, LCC28,.45SQ	unknown	EAR99	8542.32.00.71	0
对比	MB7127HP	FUJITSU Semiconductor Limited	查询价格				Obsolete	8.192 kbit	4	2KX4			45 ns	OTP ROM					2000	2.048 k								TTL	COMMERCIAL		R-PDIP-T18	Not Qualified	e0	70 °C				18	PLASTIC/EPOXY	DIP	DIP18,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-02 04:05:33	DIP, DIP18,.3	unknown	EAR99	8542.32.00.71	0
对比	MB7152EM	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	4	4KX4	5 V		55 ns	OTP ROM					4000	4.096 k							170 µA	TTL	COMMERCIAL		R-PDIP-T20	Not Qualified	e0	70 °C				20	PLASTIC/EPOXY	DIP	DIP20,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-02 03:33:46	DIP, DIP20,.3	unknown	EAR99	8542.32.00.71	0
对比	MB7132LZ	FUJITSU Semiconductor Limited	查询价格				Obsolete	8.192 kbit	8	1KX8	5 V		70 ns	OTP ROM					1000	1.024 k							60 µA	TTL	COMMERCIAL		R-XDIP-T24	Not Qualified	e0	70 °C				24	CERAMIC	DIP	DIP24,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-02 13:30:35	DIP, DIP24,.6	unknown	EAR99	8542.32.00.71	0
对比	M28C17-A25WKA6T	STMicroelectronics	查询价格		Yes	Yes	Contact Manufacturer	16.384 kbit	8	2KX8		3/3.3 V	250 ns	EEPROM		NO	YES		2000	2.048 k			32 words	PARALLEL	YES	20 µA	15 µA	CMOS	INDUSTRIAL	NO	R-PQCC-J32	Not Qualified	e3	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	32	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	YES	Matte Tin (Sn)	J BEND	1.27 mm	QUAD	2443	2023-10-04 16:04:16	QCCJ, LDCC32,.5X.6	compliant				M28C17-A25WKA6T
对比	MB7152EP	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	4	4KX4	5 V		55 ns	OTP ROM					4000	4.096 k							170 µA	TTL	COMMERCIAL		R-PDIP-T20	Not Qualified	e0	70 °C				20	PLASTIC/EPOXY	DIP	DIP20,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-02 14:16:24	DIP, DIP20,.3	unknown	EAR99	8542.32.00.71	0
对比	M28C17-A25WNS6	STMicroelectronics	查询价格		No	No	Contact Manufacturer	16.384 kbit	8	2KX8		3/3.3 V	250 ns	EEPROM		NO	YES		2000	2.048 k			32 words	PARALLEL	YES	20 µA	15 µA	CMOS	INDUSTRIAL	NO	R-PDSO-G28	Not Qualified	e0	85 °C	-40 °C	NOT SPECIFIED	NOT SPECIFIED	28	PLASTIC/EPOXY	TSSOP	TSSOP28,.53,22	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	Tin/Lead (Sn/Pb)	GULL WING	550 µm	DUAL	2443	2023-10-04 15:57:41	TSSOP, TSSOP28,.53,22	compliant				M28C17-A25WNS6
对比	MB7138HC	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	8	2KX8	5 V		45 ns	OTP ROM					2000	2.048 k								TTL	COMMERCIAL		R-XDIP-T24	Not Qualified	e0	70 °C				24	CERAMIC	DIP	DIP24,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-01 21:51:37	DIP, DIP24,.6	unknown	EAR99	8542.32.00.71	0
对比	MCM2708L	Motorola Mobility LLC	查询价格		No	No	Obsolete	8.192 kbit	8	1KX8			450 ns						1000	1.024 k		3-STATE						MOS	COMMERCIAL		R-XDIP-T24	Not Qualified	e0	70 °C				24	CERAMIC	DIP	DIP24,.6	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	2141108	2023-08-02 01:07:13	DIP, DIP24,.6	unknown	EAR99	8542.32.00.71	0
对比	MB838200-20PFTR	FUJITSU Semiconductor Limited	查询价格				Obsolete	8.3886 Mbit	16	512KX16	5 V		200 ns	MASK ROM	8			1	512000	524.288 k	ASYNCHRONOUS			PARALLEL		50 µA	50 µA	CMOS	COMMERCIAL		R-PDSO-G48	Not Qualified	e0	70 °C				48	PLASTIC/EPOXY	TSSOP	TSSOP48,.71,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	DUAL	4317229	2024-04-02 15:44:58	TSSOP, TSSOP48,.71,20	unknown	EAR99	8542.32.00.71	0
对比	MB7137HC	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	8	2KX8			45 ns	OTP ROM					2000	2.048 k								TTL	COMMERCIAL		R-XDIP-T24	Not Qualified	e0	70 °C				24	CERAMIC	DIP	DIP24,.6	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-01 19:41:21	DIP, DIP24,.6	unknown	EAR99	8542.32.00.71	0
对比	MB838200B-12PFTN	FUJITSU Semiconductor Limited	查询价格				Contact Manufacturer	8.3886 Mbit	16	512KX16	5 V		120 ns	MASK ROM	8			1	512000	524.288 k	ASYNCHRONOUS			PARALLEL		10 µA	50 µA	CMOS	COMMERCIAL		R-PDSO-G48	Not Qualified	e0	70 °C				48	PLASTIC/EPOXY	TSSOP	TSSOP48,.71,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	Tin/Lead (Sn/Pb)	GULL WING	500 µm	DUAL	4317229	2024-04-02 15:39:39	TSSOP, TSSOP48,.71,20	unknown	EAR99	8542.32.00.71
对比	MB7141EV-W	FUJITSU Semiconductor Limited	查询价格				Contact Manufacturer	32.768 kbit	8	4KX8			65 ns	OTP ROM					4000	4.096 k								TTL	MILITARY		S-XQCC-N28	Not Qualified	e0	125 °C	-55 °C			28	CERAMIC	QCCN	LCC28,.45SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	NO LEAD	1.27 mm	QUAD	4317229	2023-08-01 22:43:51	QCCN, LCC28,.45SQ	unknown	EAR99	8542.32.00.71
对比	MB7138HM-SK	FUJITSU Semiconductor Limited	查询价格				Obsolete	16.384 kbit	8	2KX8	5 V		45 ns	OTP ROM					2000	2.048 k							180 µA	TTL	COMMERCIAL		R-PDIP-T24	Not Qualified	e0	70 °C				24	PLASTIC/EPOXY	DIP	DIP24,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	4317229	2023-08-02 11:01:54	DIP, DIP24,.3	unknown	EAR99	8542.32.00.71	0

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