随身查
扫码添加小程序
手机随时查器件
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 外部数据总线宽度 | 最大时钟频率 | 输出数据总线宽度 | 表面贴装 | 标称供电电压 | uPs/uCs/外围集成电路类型 | 技术 | 其他特性 | 边界扫描 | 低功率模式 | 最大压摆率 | 最大供电电压 | 最小供电电压 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 宽度 | 长度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | YTEOL | 制造商包装代码 | |
| 对比 | IDT73200L15P | Integrated Device Technology Inc | 查询价格 | No | Obsolete | 16 | 66.67 MHz | 16 | NO | 5 V | DSP PERIPHERAL, PIPELINE REGISTER | CMOS | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | NO | NO | 13.5 mA | 5.25 V | 4.75 V | COMMERCIAL | R-PDIP-T48 | Not Qualified | e0 | 70 °C | 48 | PLASTIC/EPOXY | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn85Pb15) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 15.24 mm | 61.849 mm | IDT73200L15P | 2068 | 2024-04-02 16:04:03 | DIP | 0.600 INCH, PLASTIC, DIP-48 | 48 | not_compliant | 3A991.A.2 | 8542.39.00.01 | 0 | |||||||||
| 对比 | L64280GM-25 | LSI Corporation | 查询价格 | No | Obsolete | NO | 5 V | DSP PERIPHERAL, FFT PROCESSOR | COMMERCIAL | S-XPGA-P144 | Not Qualified | e0 | 70 °C | 144 | CERAMIC | PGA | PGA144,15X15 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | PIN/PEG | 2.54 mm | PERPENDICULAR | 2145 | 2024-04-02 18:49:36 | unknown | 8542.39.00.01 | 0 | |||||||||||||||||||||||||||
| 对比 | 7216L90CC | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | NO | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | MILITARY | R-XDIP-T64 | Not Qualified | e0 | 125 °C | -55 °C | 64 | CERAMIC | DIP | DIP64,.9 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7216L90CC | 2068 | 2023-08-01 22:54:43 | not_compliant | 3A001.A.2.C | 8542.39.00.01 | 0 | ||||||||||||||||||||||
| 对比 | IDT7243L85CB | Integrated Device Technology Inc | 查询价格 | No | Obsolete | NO | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | CMOS | MILITARY | R-XDIP-T64 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 64 | CERAMIC | DIP | DIP64,.9 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | IDT7243L85CB | 2068 | 2023-08-02 04:36:41 | not_compliant | 3A001.A.2.C | 8542.39.00.01 | 0 | |||||||||||||||||||||||
| 对比 | PDSP16540A0GC | Microsemi Corporation | 查询价格 | Obsolete | 32 | 40 MHz | 32 | YES | 5 V | DSP PERIPHERAL, FFT PROCESSOR | CMOS | NO | NO | 5.5 V | 4.5 V | COMMERCIAL | S-CPGA-P132 | Not Qualified | e0 | 70 °C | 132 | CERAMIC, METAL-SEALED COFIRED | QFP | SQUARE | FLATPACK | TIN LEAD | GULL WING | QUAD | 2192 | 2022-06-02 10:09:34 | QFP | QFP, | 132 | unknown | 3A991.A.2 | 8542.39.00.01 | 0 | ||||||||||||||||||
| 对比 | IDT7213L70XLB | Integrated Device Technology Inc | 查询价格 | No | Obsolete | YES | DSP PERIPHERAL, MULTIPLIER | CMOS | MILITARY | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | CERAMIC | QCCN | LCC(UNSPEC) | CHIP CARRIER | Tin/Lead (Sn/Pb) | NO LEAD | QUAD | IDT7213L70XLB | 2068 | 2023-08-02 04:33:15 | unknown | 3A001.A.2.C | 8542.39.00.01 | 0 | |||||||||||||||||||||||||||
| 对比 | LF43168GC22 | LOGIC Devices Inc | 查询价格 | No | Obsolete | 10 | 45.45 MHz | 28 | NO | 5 V | DSP PERIPHERAL, DIGITAL FILTER | CMOS | 2 X 10 BIT DATA INPUT BUS; ICC SPECIFIED @ 20MHZ | NO | NO | 300 mA | 5.25 V | 4.75 V | COMMERCIAL | S-CPGA-P84 | Not Qualified | e0 | 3 | 70 °C | 225 | 84 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA84M,11X11 | SQUARE | GRID ARRAY | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.445 mm | 29.464 mm | 29.464 mm | 4317306 | 2023-08-02 13:36:10 | PGA | PGA, PGA84M,11X11 | 84 | unknown | 3A991.A.2 | 8542.39.00.01 | 0 | ||||||||
| 对比 | PDSP16112AA0GG | Dynex Semiconductor | 查询价格 | No | Transferred | YES | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | MILITARY | S-XQFP-G120 | Not Qualified | e0 | 125 °C | -55 °C | 120 | CERAMIC | QFP | QFP120,1.2SQ,32 | SQUARE | FLATPACK | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 1623916 | 2023-08-01 21:24:28 | QFP, QFP120,1.2SQ,32 | unknown | 3A001.A.2.C | 8542.39.00.01 | ||||||||||||||||||||||||
| 对比 | TDC1009L1F | TRW Inc | 查询价格 | No | Transferred | YES | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | BIPOLAR | MILITARY | S-XQFP-F68 | Not Qualified | e0 | 125 °C | -55 °C | 68 | CERAMIC | QFF | QFL68,.95SQ | SQUARE | FLATPACK | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | QUAD | 4317459 | 2023-08-02 01:41:04 | QFF, QFL68,.95SQ | unknown | 3A001.A.2.C | 8542.39.00.01 | |||||||||||||||||||||||||
| 对比 | LF2250MM25 | LOGIC Devices Inc | 查询价格 | No | Obsolete | YES | 5 V | GRAPHICS PROCESSOR | CMOS | MILITARY | S-XQFP-G120 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 225 | 120 | CERAMIC | QFP | QFP120,1.2SQ,32 | SQUARE | FLATPACK | TIN LEAD | GULL WING | 800 µm | QUAD | 4317306 | 2023-08-02 04:03:56 | QFP, QFP120,1.2SQ,32 | unknown | 3A001.A.2.C | 8542.39.00.01 | 0 | |||||||||||||||||||||
| 对比 | AM29524/BXC | AMD | 查询价格 | No | Obsolete | NO | 5 V | DSP PERIPHERAL, PIPELINE REGISTER | ECL | MILITARY | R-XDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC | DIP | DIP28,.4 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 1653 | 2023-08-02 01:02:39 | DIP, DIP28,.4 | unknown | 3A001.A.2.C | 8542.39.00.01 | 0 | ||||||||||||||||||||||
| 对比 | ADSP-1016ASD | Analog Devices Inc | 查询价格 | No | Obsolete | 16 | 32 | NO | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | NO | NO | 55 mA | 5.5 V | 4.5 V | MILITARY | R-CDIP-T64 | Not Qualified | e0 | 125 °C | -55 °C | 64 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP64,.9 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.29 mm | 22.86 mm | 81.28 mm | ADSP-1016ASD | 1742 | 2023-08-02 12:18:06 | DIP | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64 | 64 | unknown | 3A001.A.2.C | 8542.39.00.01 | 0 | ||||||||||
| 对比 | PDSP16116MCAC1R | Zarlink Semiconductor Inc | 查询价格 | No | Transferred | 16 | 10 MHz | 16 | NO | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | NO | NO | 5.5 V | 4.5 V | MILITARY | S-CPGA-P144 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 144 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | TIN LEAD | PIN/PEG | PERPENDICULAR | 2576 | 2022-01-28 22:53:05 | PGA, | compliant | 3A001.A.2.C | 8542.39.00.01 | ||||||||||||||||||
| 对比 | 54LS261W | Raytheon Semiconductor | 查询价格 | No | Obsolete | YES | DSP PERIPHERAL, MULTIPLIER | TTL | MILITARY | R-XDFP-F16 | Not Qualified | e0 | 125 °C | -55 °C | 16 | CERAMIC | DFP | FL16,.3 | RECTANGULAR | FLATPACK | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 293710926 | 2023-08-02 05:08:00 | unknown | 3A001.A.2.C | 8542.39.00.01 | 0 | |||||||||||||||||||||||||
| 对比 | 7217L45G | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | NO | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | COMMERCIAL | S-XPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 260 | 68 | CERAMIC | PGA | PGA68,11X11 | SQUARE | GRID ARRAY | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 7217L45G | 2068 | 2023-08-02 04:00:12 | PGA | 68 | not_compliant | 8542.39.00.01 | 0 | GD68 | |||||||||||||||||||
| 对比 | AM25S05DC-B | AMD | 查询价格 | No | Obsolete | NO | DSP PERIPHERAL, MULTIPLIER | TTL | COMMERCIAL | R-XDIP-T24 | e0 | 70 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 1653 | 2023-08-02 01:10:17 | DIP, DIP24,.6 | unknown | 8542.39.00.01 | 0 | |||||||||||||||||||||||||||
| 对比 | ADSP-1008AKN | Rochester Electronics LLC | 查询价格 | No | No | Active | 8 | 19 | NO | 5 V | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | CMOS | NO | NO | 5.25 V | 4.75 V | COMMERCIAL | R-PDIP-T48 | COMMERCIAL | e0 | NOT SPECIFIED | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 15.24 mm | 2178096 | 2016-06-20 18:00:17 | DIP | DIP, | 48 | unknown | ||||||||||||||
| 对比 | ADSP-1012ATN | Analog Devices Inc | 查询价格 | No | Obsolete | 12 | 24 | NO | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | NO | NO | 5.5 V | 4.5 V | MILITARY | R-PDIP-T64 | Not Qualified | e0 | 125 °C | -55 °C | 64 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 6.35 mm | 22.86 mm | ADSP-1012ATN | 1742 | 2022-02-06 07:42:59 | DIP | PLASTIC, DIP-64 | 64 | compliant | 3A001.A.2.C | 8542.39.00.01 | 0 | |||||||||||||
| 对比 | QS29FCT520CTQ | Rochester Electronics LLC | 查询价格 | No | No | Active | 8 | 8 | YES | 5 V | DSP PERIPHERAL, PIPELINE REGISTER | CMOS | MULTIPLEXED OUTPUTS | NO | NO | 5.25 V | 4.75 V | COMMERCIAL | R-PDSO-G24 | COMMERCIAL | e0 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | DUAL | 2178096 | 2016-06-20 18:00:17 | SOIC | 24 | unknown | |||||||||||||||||||
| 对比 | IDT7217L20L | Integrated Device Technology Inc | 查询价格 | No | No | Obsolete | YES | 5 V | DSP PERIPHERAL, MULTIPLIER | CMOS | COMMERCIAL | S-XQCC-N68 | Not Qualified | e0 | 70 °C | 68 | CERAMIC | QCCN | LCC68,.95SQ | SQUARE | CHIP CARRIER | TIN LEAD | NO LEAD | 1.27 mm | QUAD | IDT7217L20L | 2068 | 2023-08-02 05:37:29 | not_compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||||||
登录 
苏公网安备 32059002001873号