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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否Rohs认证 | 生命周期 | 总线兼容性 | 外部数据总线宽度 | 地址总线宽度 | 最大时钟频率 | 表面贴装 | 标称供电电压 | uPs/uCs/外围集成电路类型 | 技术 | 桶式移位器 | 边界扫描 | 最大压摆率 | 最大供电电压 | 最小供电电压 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 宽度 | 长度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | Source Content uid | |
对比 | 5962-8854702QX | Rochester Electronics LLC | 查询价格 | Active | 16 | 20 | 8 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | NMOS | NO | 5.25 V | 4.75 V | MILITARY | R-CDIP-T40 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-PRF-38535 | NOT SPECIFIED | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | 2178096 | 2024-04-02 15:37:12 | DIP | DIP, | 40 | unknown | 3A001.A.2.C | 8542.31.00.01 | ||||||||||||||
对比 | 5962-8854701QX | Rochester Electronics LLC | 查询价格 | Active | 16 | 20 | 5 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | NMOS | NO | 5.25 V | 4.75 V | MILITARY | R-CDIP-T40 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-PRF-38535 | NOT SPECIFIED | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | 2178096 | 2024-04-02 15:42:32 | DIP | DIP, | 40 | unknown | 3A001.A.2.C | 8542.31.00.01 | ||||||||||||||
对比 | 5962-8854701QA | Rochester Electronics LLC | 查询价格 | Active | 16 | 20 | 5 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | NMOS | NO | 600 mA | 5.25 V | 4.75 V | MILITARY | R-CDIP-T40 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 2178096 | 2024-03-02 23:11:02 | DIP | DIP, DIP40,.6 | 40 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||
对比 | 5962-8854702QA | Rochester Electronics LLC | 查询价格 | Active | 16 | 20 | 8 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | NMOS | NO | 600 mA | 5.25 V | 4.75 V | MILITARY | R-CDIP-T40 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 2178096 | 2024-03-02 22:11:13 | DIP | DIP, DIP40,.6 | 40 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||
对比 | MC68882RC20 | NXP Semiconductors | 查询价格 | Active | MC68882 | 32 | 5 | 20 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | HCMOS | NO | 5.25 V | 4.75 V | COMMERCIAL | S-CPGA-P68 | 70 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | PIN/PEG | 2.54 mm | PERPENDICULAR | 2.66 mm | 26.92 mm | 26.92 mm | 2245 | 2022-06-02 10:12:20 | PGA, | unknown | 8542.31.00.01 | MC68882RC20 | ||||||||||||||||
对比 | MD8087-2/BQA | Rochester Electronics LLC | 查询价格 | No | Active | 16 | 20 | 8 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | NMOS | NO | 5.25 V | 4.75 V | MILITARY | 125 °C | -55 °C | NOT SPECIFIED | MIL-PRF-38535 Class Q | NOT SPECIFIED | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | IN-LINE | THROUGH-HOLE | DUAL | 2178096 | 2023-08-05 19:33:35 | CERAMIC, DIP2-40 | unknown | 3A001.A.2.C | 8542.31.00.01 | ||||||||||||||||||
对比 | MC68882FN16 | NXP Semiconductors | 查询价格 | Active | MC68882 | 32 | 5 | 16.67 MHz | YES | 5 V | MATH PROCESSOR, COPROCESSOR | HCMOS | YES | NO | 5.25 V | 4.75 V | COMMERCIAL | S-PQCC-J68 | Not Qualified | 70 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | J BEND | 1.27 mm | QUAD | 4.57 mm | 24.205 mm | 24.205 mm | 2245 | 2023-08-01 23:45:48 | PLASTIC, LCC-68 | compliant | 8542.31.00.01 | MC68882FN16 | |||||||||||||
对比 | MD8087-2/B | Rochester Electronics LLC | 查询价格 | No | Active | 8086; 8088; 80186; 80188 | 16 | 20 | 8 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | HMOS | NO | NO | 475 mA | 5.25 V | 4.75 V | COMMERCIAL | R-CDIP-T40 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | 2178096 | 2023-08-05 19:24:08 | DIP | DIP-40 | 40 | unknown | 8542.31.00.01 | ||||||||||||||
对比 | MC8087-2/B | Rochester Electronics LLC | 查询价格 | No | Active | 8086; 8088; 80186; 80188 | 16 | 20 | 8 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | HMOS | NO | NO | 475 mA | 5.25 V | 4.75 V | COMMERCIAL | R-CDIP-T40 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 40 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | 2178096 | 2023-08-05 19:31:24 | DIP | DIP-40 | 40 | unknown | 8542.31.00.01 | ||||||||||||||
对比 | TS68882DESC02XA | Thales Group | 查询价格 | Transferred | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | SQUARE | GRID ARRAY | PIN/PEG | PERPENDICULAR | 4317451 | 2022-01-27 23:49:30 | PGA | , | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | ||||||||||||||||||||||
对比 | TS68882MF8B/Y16 | Atmel Corporation | 查询价格 | Transferred | YES | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CQFP-G68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | QFP | SQUARE | FLATPACK | GULL WING | 1.27 mm | QUAD | 3.43 mm | 24.13 mm | 24.13 mm | 1773 | 2022-01-29 03:36:09 | QFP | QFP, | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||||||||
对比 | TS68882MF8B/Y20 | Atmel Corporation | 查询价格 | Transferred | YES | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CQFP-G68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | QFP | SQUARE | FLATPACK | GULL WING | 1.27 mm | QUAD | 3.43 mm | 24.13 mm | 24.13 mm | 1773 | 2022-01-28 08:09:02 | QFP | QFP, | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||||||||
对比 | TS68882MR8B/Y16 | Atmel Corporation | 查询价格 | Transferred | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.184 mm | 26.92 mm | 26.92 mm | 1773 | 2022-01-29 19:23:29 | PGA | PGA, | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||||||||
对比 | TS68882MR8B/Y25 | Atmel Corporation | 查询价格 | Transferred | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.184 mm | 26.92 mm | 26.92 mm | 1773 | 2022-02-08 01:53:18 | PGA | PGA, | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||||||||
对比 | TS68882MR8B/Y20 | Atmel Corporation | 查询价格 | Transferred | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.184 mm | 26.92 mm | 26.92 mm | 1773 | 2022-02-07 11:44:04 | PGA | PGA, | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||||||||
对比 | TS68882MF8B/Y25 | Atmel Corporation | 查询价格 | Transferred | YES | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | 5.5 V | 4.5 V | MILITARY | S-CQFP-G68 | Not Qualified | 125 °C | -55 °C | 68 | CERAMIC, METAL-SEALED COFIRED | QFP | SQUARE | FLATPACK | GULL WING | 1.27 mm | QUAD | 3.43 mm | 24.13 mm | 24.13 mm | 1773 | 2022-01-29 20:07:30 | QFP | QFP, | 68 | unknown | 3A001.A.2.C | 8542.31.00.01 | |||||||||||||||||
对比 | 5962-8946302XC | e2v technologies | 查询价格 | No | Active | 32 | 5 | 20 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | YES | NO | 150 mA | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Qualified | e4 | 125 °C | -55 °C | MIL-STD-883 Class B; MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA68,10X10 | SQUARE | GRID ARRAY | Gold (Au) | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.184 mm | 26.92 mm | 26.92 mm | 1937079 | 2023-08-02 01:29:52 | PGA | PGA, PGA68,10X10 | 68 | compliant | 3A001.A.2.C | 8542.31.00.01 | ||||||
对比 | 5962-8946302XA | e2v technologies | 查询价格 | No | Active | 32 | 5 | 20 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | YES | NO | 150 mA | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B; MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA68,10X10 | SQUARE | GRID ARRAY | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.184 mm | 26.92 mm | 26.92 mm | 1937079 | 2023-08-02 03:10:29 | PGA | PGA, PGA68,10X10 | 68 | compliant | 3A001.A.2.C | 8542.31.00.01 | ||||||
对比 | 5962-8946305YX | e2v technologies | 查询价格 | Active | 32 | 5 | 50 MHz | YES | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | YES | NO | 5.5 V | 4.5 V | MILITARY | S-CQFP-G68 | Not Qualified | 125 °C | -55 °C | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | QFP | QFP68,1.1SQ,50 | SQUARE | FLATPACK | GULL WING | 1.27 mm | QUAD | 3.43 mm | 24.13 mm | 24.13 mm | 1937079 | 2024-03-02 22:42:58 | QFP | CERAMIC, QFP-68 | 68 | compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||
对比 | 5962-8946305XA | e2v technologies | 查询价格 | Active | 32 | 5 | 50 MHz | NO | 5 V | MATH PROCESSOR, COPROCESSOR | CMOS | YES | NO | 5.5 V | 4.5 V | MILITARY | S-CPGA-P68 | Not Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA68,10X10 | SQUARE | GRID ARRAY | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.82 mm | 26.92 mm | 26.92 mm | 1937079 | 2024-03-02 23:07:26 | PGA | PGA, | 68 | compliant | 3A991.A.2 | 8542.31.00.01 |