Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 位大小 | 速度 | ROM(单词) | RAM(字节) | RAM(字数) | CPU系列 | 总线兼容性 | 外部数据总线宽度 | 地址总线宽度 | 最大时钟频率 | I/O 线路数量 | 表面贴装 | 标称供电电压 | uPs/uCs/外围集成电路类型 | 技术 | 其他特性 | 边界扫描 | 串行 I/O 数 | ROM可编程性 | 最大压摆率 | 最大供电电压 | 最小供电电压 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 宽度 | 长度 | mfrid | Modified On | 是否符合REACH标准 | 交付时间 | YTEOL | Source Content uid | 包装说明 | Country Of Origin | ECCN代码 | HTS代码 | Date Of Intro | |
对比 | CY8C4245PVI-482 | Infineon Technologies AG | 查询价格 | Yes | Active | 4000 | I2C; IDE; IRDA; LIN; SPI; UART | 24 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 13.8 mA | 5.5 V | 1.8 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e4 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 2 mm | 7.8 mm | 10.2 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 9.22 | ||||||||||||||||||||
对比 | MIMX8MM6CVTKZAA | NXP Semiconductors | 查询价格 | Yes | Active | 288K | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | 16 | YES | 950 mV | SoC | CMOS | 24MHZ NOM CRYSTAL FREQ AVAILABLE | YES | 1 V | 900 mV | INDUSTRIAL | S-PBGA-B486 | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 486 | PLASTIC/EPOXY | LFBGA | BGA486,27X27,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 500 µm | BOTTOM | 1.25 mm | 14 mm | 14 mm | 2245 | 2024-04-20 08:59:40 | compliant | [object Object] | 9.98 | MIMX8MM6CVTKZAA | FCBGA-486 | Mainland China, South Korea | 5A992.C | 8542.31.00.01 | 2019-02-21 | |||||||||||||||
对比 | MCIMX6Q5EYM10ADR | NXP Semiconductors | 查询价格 | Yes | Yes | Active | 3 | 260 | 40 | TIN SILVER COPPER | 2245 | 2024-04-20 08:24:34 | compliant | [object Object] | 11.81 | MCIMX6Q5EYM10ADR | Malaysia | 5A992.C | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||||||||||
对比 | SCH3114I-NU | Microchip Technology Inc | 查询价格 | Yes | Active | 256 | LPC | 4 | 4 | 46 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 1 mA | 3.63 V | 2.97 V | INDUSTRIAL | S-PQFP-G128 | Not Qualified | e3 | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | TQFP | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE | Matte Tin (Sn) | GULL WING | 400 µm | QUAD | 1.2 mm | 14 mm | 14 mm | 2188 | 2024-04-20 08:23:01 | compliant | [object Object] | 24.61 | SCH3114I-NU | VTQFP-128 | Thailand | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||
对比 | CY8C29466-24PVXI | Infineon Technologies AG | 查询价格 | Yes | Active | 8 | 24 MHz | 32768 | 2048 | 1024 | M8C | 24 MHz | 24 | YES | 5 V | CMOS | ALSO OPERATES AT 3V SUPPLY | NO | FLASH | 14 mA | 5.25 V | 4.75 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 20 | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | 2065 | 2024-04-02 19:44:23 | compliant | 3.15 | SSOP-28 | ||||||||||||||
对比 | CY8C4124PVI-442 | Infineon Technologies AG | 查询价格 | Yes | Active | 2048 | I2C, I2S, SPI, UART | 24 MHz | 24 | YES | 1.8 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 7.2 mA | 5.5 V | 1.71 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 9.22 | |||||||||||||||||||
对比 | CY8C4124LQI-443T | Infineon Technologies AG | 查询价格 | Yes | Active | 2048 | I2C; SPI; UART | 24 MHz | 34 | YES | 1.8 V | CMOS | NO | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N56 | e4 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 56 | UNSPECIFIED | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 800 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 2065 | 2024-04-02 19:47:32 | compliant | 9.22 | TQFP-44 | |||||||||||||||||||||||
对比 | CY8C4125AZI-PS423 | Infineon Technologies AG | 查询价格 | Yes | Active | YES | 3.3 V | PROGRAMMABLE SoC | CMOS | 5.5 V | 1.8 V | INDUSTRIAL | S-PQFP-G48 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | DUAL | 1.6 mm | 7 mm | 7 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 9.47 | |||||||||||||||||||||||||||
对比 | CY8C4245LQI-483 | Infineon Technologies AG | 查询价格 | Yes | Active | 2048 | I2C; IDE; IRDA; LIN; SPI; UART | 48 MHz | 34 | YES | 3.3 V | MULTIFUNCTION PERIPHERAL | CMOS | NO | 3 | 13.8 mA | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N40 | Not Qualified | e4 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 40 | UNSPECIFIED | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 600 µm | 6 mm | 6 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 9.22 | ||||||||||||||||||
对比 | CY8C4246AZI-M443 | Infineon Technologies AG | 查询价格 | Yes | Active | 4096 | I2C; SPI; UART; IRDA; IDE; LIN | 48 MHz | 38 | YES | MULTIFUNCTION PERIPHERAL | CMOS | NO | 11 | 13.8 mA | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G48 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 7 mm | 7 mm | 2065 | 2024-04-02 20:15:39 | compliant | 6.38 | TQFP-48 | |||||||||||||||||||||
对比 | CY8C4014SXI-420T | Infineon Technologies AG | 查询价格 | Yes | Active | 1024 | I2C | 16 MHz | 5 | YES | 3.3 V | CMOS | NO | 5.5 V | 1.71 V | INDUSTRIAL | R-PDSO-G8 | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.727 mm | 3.8985 mm | 4.889 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 10.13 | SOIC-8 | ||||||||||||||||||||||
对比 | CY8C4014SXI-421T | Infineon Technologies AG | 查询价格 | Yes | Active | 1024 | I2C | 16 MHz | 13 | YES | 3.3 V | CMOS | NO | 5.5 V | 1.71 V | INDUSTRIAL | R-PDSO-G16 | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | GULL WING | 1.27 mm | DUAL | 1.727 mm | 3.8985 mm | 9.893 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 10.13 | SOIC-16 | ||||||||||||||||||||||
对比 | CY8C5868LTI-LP039 | Infineon Technologies AG | 查询价格 | Yes | Active | 32768 | I2C; USB; PS/2 | 33 MHz | 48 | YES | 1.8 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N68 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1 mm | 8 mm | 8 mm | 2065 | 2024-04-02 20:25:52 | compliant | 8.89 | QFN-68 | |||||||||||||||||||||
对比 | CY8C5888LTQ-LP097 | Infineon Technologies AG | 查询价格 | Yes | Active | 32768 | I2C; I2S, LIN; PS/2; SPI, USB | 33 MHz | 38 | YES | 3.3 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-XQCC-N68 | Not Qualified | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 68 | UNSPECIFIED | HVQCCN | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1 mm | 8 mm | 8 mm | 2065 | 2024-04-02 20:33:49 | compliant | 8.89 | QFN-68 | |||||||||||||||||||||
对比 | CY8C5868AXI-LP032 | Infineon Technologies AG | 查询价格 | Yes | Active | 32768 | I2C; USB; PS/2 | 33 MHz | 72 | YES | 1.8 V | CMOS | YES | 5.5 V | 1.71 V | INDUSTRIAL | S-PQFP-G100 | Not Qualified | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 2065 | 2024-04-02 18:27:28 | compliant | 8.89 | TQFP-100 | |||||||||||||||||||||
对比 | CY8C5868AXI-LP035 | Infineon Technologies AG | 查询价格 | Yes | Active | 65536 | I2C; USB; PS/2 | 33 MHz | 72 | YES | 1.8 V | MULTIFUNCTION PERIPHERAL | CMOS | YES | 25.5 µA | 5.5 V | 1.71 V | S-PQFP-G100 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 2065 | 2024-04-02 18:28:59 | compliant | 8.89 | TQFP-100 | ||||||||||||||||||||||
对比 | CY8C4145AZI-PS423 | Infineon Technologies AG | 查询价格 | Yes | Active | YES | 3.3 V | PROGRAMMABLE SoC | CMOS | 5.5 V | 1.8 V | S-PQFP-G48 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Pure Tin (Sn) | GULL WING | 500 µm | DUAL | 1.6 mm | 7 mm | 7 mm | 2065 | 2024-04-20 09:22:43 | compliant | [object Object] | 9.47 | ||||||||||||||||||||||||||||
对比 | MCIMX6S5DVM10AD | NXP Semiconductors | 查询价格 | Yes | Active | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 95 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | 2245 | 2024-04-20 08:56:30 | compliant | [object Object] | 11.81 | MCIMX6S5DVM10AD | MABGA-624 | Mainland China | 5A992.C | 8542.31.00.01 | |||||||||||||||||||||||
对比 | MCIMX6Q5EYM10AD | NXP Semiconductors | 查询价格 | Yes | Active | YES | SoC | CMOS | 24MHZ NOMINAL FREQ AVAILABLE | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 105 °C | -20 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | 2245 | 2024-04-20 08:24:34 | compliant | [object Object] | 11.81 | MCIMX6Q5EYM10AD | FCBGA-624 | Malaysia | 5A992.C | 8542.31.00.01 | ||||||||||||||||||||||
对比 | MCIMX6S5EVM10AD | NXP Semiconductors | 查询价格 | Yes | Active | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 105 °C | -20 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | 2245 | 2024-04-20 08:56:30 | compliant | [object Object] | 11.81 | MCIMX6S5EVM10AD | MABGA-624 | Mainland China | 5A992.C | 8542.31.00.01 |