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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 (Vsup) | 表面贴装 | 电源 | 最大输出频率 | 模拟集成电路 - 其他类型 | 技术 | 其他特性 | 功能数量 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 长度 | 座面最大高度 | 宽度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | Source Content uid | YTEOL | Date Of Intro | Country Of Origin | |
对比 | ECLPGM-30 | Engineered Components Co | 查询价格 | Contact Manufacturer | NO | ECL | 1 | R-XDIP-P6 | Not Qualified | 6 | UNSPECIFIED | QIP | RECTANGULAR | IN-LINE | PIN/PEG | 2.54 mm | DUAL | 20.32 mm | 6.604 mm | 7.62 mm | 4317212 | 2022-02-08 13:41:35 | DIP | QIP, | 16/6 | unknown | EAR99 | 8542.39.00.01 | |||||||||||||||||||||||||
对比 | XNE555CU | NXP Semiconductors | 查询价格 | Obsolete | 5 V | YES | SQUARE | BIPOLAR | 1 | 16 V | 4.5 V | X-XUUC-N | Not Qualified | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | NO LEAD | UPPER | 2245 | 2022-01-29 21:03:50 | DIE | DIE, | unknown | EAR99 | 8542.39.00.01 | XNE555CU | 0 | |||||||||||||||||||||||||
对比 | ICL8038AMJD/883B | Intersil Corporation | 查询价格 | No | Obsolete | NO | 100 MHz | WAVEFORM GENERATION | BIPOLAR | 1 | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 1 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 2074 | 2023-08-02 07:11:53 | DIP, DIP14,.3 | not_compliant | EAR99 | 8542.39.00.01 | ICL8038AMJD/883B | 0 | ||||||||||||||||||
对比 | UM82C54 | Unicorn Microelectronics Corp | 查询价格 | Obsolete | 166795965 | 2022-06-02 16:00:31 | , | unknown | EAR99 | 8542.39.00.01 | 0 | ||||||||||||||||||||||||||||||||||||||||||
对比 | FGSWG-TTL-9F | Engineered Components Co | 查询价格 | Contact Manufacturer | 5 V | NO | 9 GHz | SQUARE | HYBRID | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-XDMA-P5 | Not Qualified | 70 °C | 5 | UNSPECIFIED | QIP | RECTANGULAR | MICROELECTRONIC ASSEMBLY | PIN/PEG | 2.54 mm | DUAL | 20.32 mm | 7.62 mm | 4317212 | 2022-02-07 02:55:26 | DMA | QIP, | 14 | unknown | EAR99 | 8542.39.00.01 | |||||||||||||||||||
对比 | FSWG-TTL-11J | Engineered Components Co | 查询价格 | Contact Manufacturer | 5 V | YES | 11 GHz | SQUARE | HYBRID | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-XDMA-J4 | Not Qualified | 70 °C | 4 | UNSPECIFIED | SOJ | RECTANGULAR | MICROELECTRONIC ASSEMBLY | J BEND | 2.54 mm | DUAL | 10.795 mm | 4317212 | 2022-01-29 17:05:26 | DMA | SOJ, | 14/4 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||||
对比 | 5962-895030SGA | Texas Instruments | 查询价格 | Obsolete | Not Qualified | 2477 | 2024-03-02 23:00:59 | , | unknown | EAR99 | 8542.39.00.01 | 5962-895030SGA | 0 | ||||||||||||||||||||||||||||||||||||||||
对比 | HA17555-E | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Obsolete | 5 V | NO | PULSE; RECTANGULAR | BIPOLAR | 1 | 16 V | 4.5 V | COMMERCIAL EXTENDED | R-PDIP-T8 | Not Qualified | e4 | 1 | 75 °C | -20 °C | 8 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NICKEL PALLADIUM GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 9.6 mm | 5.06 mm | 7.62 mm | 2354 | 2023-07-17 22:09:06 | DIP | DIP, | 8 | compliant | EAR99 | 8542.39.00.01 | HA17555-E | 0 | 1997-08-01 | ||||||||||
对比 | MDFDFMM-TTL-40T | Engineered Components Co | 查询价格 | Obsolete | 5 V | YES | 40 GHz | SQUARE | HYBRID | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-PDSO-L4 | Not Qualified | 70 °C | 4 | PLASTIC/EPOXY | SOL | RECTANGULAR | SMALL OUTLINE | L BEND | 2.54 mm | DUAL | 12.7 mm | 7.239 mm | 10.795 mm | 4317212 | 2022-02-06 02:21:23 | SOIC | SOL, | 8/4 | unknown | EAR99 | 8542.39.00.01 | 0 | |||||||||||||||||
对比 | SE555CFE/883B | Philips Semiconductors | 查询价格 | No | Obsolete | NO | BIPOLAR | MILITARY | R-XDIP-T8 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 8 | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 166795790 | 2023-08-02 09:34:09 | DIP, DIP8,.3 | unknown | EAR99 | 8542.39.00.01 | 0 | ||||||||||||||||||||||
对比 | MR8254 | Intel Corporation | 查询价格 | No | Obsolete | 5 V | YES | MOS | MILITARY | S-XQCC-N28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 2071 | 2023-08-01 21:02:23 | QCCN, LCC28,.45SQ | compliant | 0 | |||||||||||||||||||||||
对比 | Z8430BC6 | SGS-Ates Componenti Electronici SPA | 查询价格 | No | Obsolete | 5 V | YES | MOS | INDUSTRIAL | S-PQCC-J44 | Not Qualified | e0 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 166795854 | 2023-08-01 18:27:39 | QCCJ, LDCC44,.7SQ | unknown | EAR99 | 8542.39.00.01 | 0 | ||||||||||||||||||||||
对比 | MDFSWGM-TTL-20F | Engineered Components Co | 查询价格 | Contact Manufacturer | 5 V | NO | 20 GHz | SQUARE | HYBRID | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-XDMA-P4 | Not Qualified | 70 °C | 4 | UNSPECIFIED | QIP | RECTANGULAR | MICROELECTRONIC ASSEMBLY | PIN/PEG | 2.54 mm | DUAL | 12.7 mm | 7.62 mm | 4317212 | 2022-01-28 11:27:12 | DMA | QIP, | 8/4 | unknown | EAR99 | 8542.39.00.01 | |||||||||||||||||||
对比 | DLO31F-10 | Data Delay Devices Inc | 查询价格 | Yes | Yes | Active | 5 V | NO | 10.2 GHz | SQUARE | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-XDIP-T5 | Not Qualified | e3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 5 | UNSPECIFIED | DIP | RECTANGULAR | IN-LINE | Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 7.747 mm | 7.62 mm | 4307509 | 2019-06-17 01:35:33 | DIP | LOW PROFILE, DIP-14/5 | 14/5 | compliant | ||||||||||||||||
对比 | CHT-555-CDIL8-T | Cissoid S A | 查询价格 | Contact Manufacturer | 5 V | NO | 4.2 GHz | WAVEFORM GENERATION | 1 | 5.5 V | 4.5 V | R-CDIP-T8 | NOT SPECIFIED | NOT SPECIFIED | 8 | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 13.2 mm | 3.4 mm | 7.62 mm | 4317155 | 2022-09-01 22:14:07 | DIP, DIP8,.3 | unknown | EAR99 | 8542.39.00.01 | |||||||||||||||||||||
对比 | MC68230L8 | Freescale Semiconductor | 查询价格 | No | Obsolete | 5 V | NO | 5 V | MOS | COMMERCIAL | R-XDIP-T48 | Not Qualified | e0 | 70 °C | 48 | CERAMIC | DIP | DIP48,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 1999 | 2023-10-04 15:58:12 | DIP, DIP48,.6 | unknown | MC68230L8 | 0 | |||||||||||||||||||||||
对比 | SSGSWG-LVQ-2.5G | Engineered Components Co | 查询价格 | Contact Manufacturer | 3 V | YES | 2.5 GHz | SQUARE | HYBRID | 1 | 3.6 V | 2.7 V | INDUSTRIAL | R-XDMA-G5 | Not Qualified | 85 °C | -40 °C | 5 | UNSPECIFIED | SOP | RECTANGULAR | MICROELECTRONIC ASSEMBLY | GULL WING | 2.54 mm | DUAL | 8.255 mm | 9.525 mm | 4317212 | 2022-01-27 02:28:23 | DMA | SOP, | 5 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||||||||
对比 | LFFSWG-TTL-45G | Engineered Components Co | 查询价格 | Obsolete | 5 V | YES | 45 MHz | SQUARE | 1 | 5.25 V | 4.75 V | COMMERCIAL | R-PDSO-G4 | Not Qualified | 70 °C | 4 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | GULL WING | 2.54 mm | DUAL | 10.795 mm | 4317212 | 2022-01-27 12:51:29 | SOIC | SOP, | 14/4 | unknown | EAR99 | 8542.39.00.01 | 0 | ||||||||||||||||||||
对比 | TS555MD | STMicroelectronics | 查询价格 | Yes | Obsolete | 3 V | YES | 2 GHz | PULSE; RECTANGULAR | CMOS | IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY | 1 | 16 V | 2 V | MILITARY | R-PDSO-G8 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | 2443 | 2023-08-02 04:59:14 | SOIC | SOP, SOP8,.25 | 8 | compliant | EAR99 | 8542.39.00.01 | TS555MD | 0 | |||||||||
对比 | TTMC14541BALD | Twilight Technology Inc | 查询价格 | No | Active | NO | CMOS | MILITARY | R-XDIP-T14 | 125 °C | -55 °C | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | 4317460 | 2024-01-01 23:49:51 | DIP, DIP14,.3 | unknown | EAR99 | 8542.39.00.01 | 5.8 | USA |