Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 触点数 | 触点材料 | 端子节距 | 目前评级 | 设备插槽类型 | 制造商序列号 | 使用的设备类型 | 其他特性 | 介电耐压 | JESD-609代码 | 最高工作温度 | 最低工作温度 | 触点的结构 | 联系完成配合 | 联系完成终止 | 触点样式 | 外壳材料 | 插接触点节距 | 安装方式 | PCB接触模式 | PCB触点行间距 | 端接类型 | 主体深度 | 主体宽度 | 主体长度 | mfrid | Modified On | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | YTEOL | 包装说明 | 特征 | |
对比 | 1KIS072-210MG3M | Advanced Interconnections Corp | 查询价格 | Yes | Yes | Active | 72 | BERYLLIUM COPPER/COPPER ALLOY | IC SOCKET | PGA72 | e3 | GOLD OVER NICKEL | Matte Tin (Sn) - with Nickel (Ni) barrier | POLYIMIDE | 1651 | 2024-03-02 19:30:07 | compliant | USA | EAR99 | 8536.69.40.40 | 5.87 | |||||||||||||||||||||
对比 | RSX304-814MG | Advanced Interconnections Corp | 查询价格 | Yes | Yes | Active | 304 | BERYLLIUM COPPER | IC SOCKET | PGA304 | e3 | GOLD OVER NICKEL | Matte Tin (Sn) - with Nickel (Ni) barrier | PLASTIC | 1651 | 2024-03-02 20:06:57 | compliant | USA | EAR99 | 8536.69.40.40 | 5.65 | |||||||||||||||||||||
对比 | RLNB010-04GG | Advanced Interconnections Corp | 查询价格 | Yes | Yes | Active | 10 | BERYLLIUM COPPER | IC SOCKET | SIP10 | UL 94V-0 | e4 | GOLD OVER NICKEL | Gold (Au) - with Nickel (Ni) barrier | LIQUID CRYSTAL POLYMER | 1651 | 2023-10-01 22:56:20 | compliant | USA | EAR99 | 8536.69.40.40 | 7.38 | ROHS COMPLIANT | |||||||||||||||||||
对比 | RLSA011-161M | Advanced Interconnections Corp | 查询价格 | Yes | Obsolete | 22 | BERYLLIUM COPPER | IC SOCKET | DIP22 | e3 | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | LIQUID CRYSTAL POLYMER | 1651 | 2023-08-02 02:37:08 | compliant | EAR99 | 8536.69.40.40 | 0 | ROHS COMPLIANT | ||||||||||||||||||||||
对比 | FS023-40GG | Advanced Interconnections Corp | 查询价格 | Yes | Obsolete | 23 | BE-CU | 2.54 mm | IC SOCKET | PGA23 | e4 | 150 °C | -60 °C | 5X5 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.19 inch | 0.5 inch | 0.5 inch | 1651 | 2023-05-31 21:05:51 | compliant | EAR99 | 8536.69.40.40 | 0 | ||||||||||
对比 | 017-1-040-6-H5STH-LR0 | MPE-Garry GmbH | 查询价格 | Active | 40 | BE-CU | 2.54 mm | 3 A | IC SOCKET | DIP40 | 1400VAC V | 125 °C | -55 °C | AU | TIN | RND PIN-SKT | THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 600 µm | 0.162 inch | 0.697 inch | 2 inch | 71690469 | 2024-04-02 17:56:02 | compliant | EAR99 | 8536.69.40.40 | 7.3 | ||||||||||||
对比 | ICO-422-S-GT | Samtec Inc | 查询价格 | Yes | Yes | Active | 22 | BERYLLIUM COPPER | IC SOCKET | ICO | DIP22 | LOW PROFILE | e3 | GOLD (30) OVER NICKEL (50) | TIN OVER NICKEL (50) | POLYESTER | 2373 | 2024-04-24 09:48:57 | compliant | ROHS COMPLIANT | IC Socket | |||||||||||||||||||||
对比 | PGA-175DH3-USL-TG30 | 3M Interconnect | 查询价格 | Transferred | 175 | IC SOCKET | PGA175 | STANDARD: UL 94V-0 | POLYESTER | 1619 | 2023-08-02 00:17:06 | unknown | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||
对比 | 1-FIS080-01TG | Advanced Interconnections Corp | 查询价格 | No | Active | 80 | BE-CU | 2.54 mm | IC SOCKET | PGA80 | 1.0 OZ. AVG. INSERTION FORCE | e0 | 140 °C | 11X11 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | 1651 | 2024-03-02 20:06:52 | compliant | USA | EAR99 | 8536.69.40.40 | 4.25 | |||||||||
对比 | 1-FS200-29TG | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 200 | BE-CU | 2.54 mm | IC SOCKET | PGA200 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 140 °C | 16X16 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.6 inch | 1.6 inch | 1651 | 2023-05-31 21:08:35 | compliant | EAR99 | 8536.69.40.40 | 0 | ||||||||||
对比 | 1-HCIS225-29GG | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 225 | BE-CU | 2.54 mm | IC SOCKET | PGA225 | 1.0 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 15X15 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.5 inch | 1.5 inch | 1651 | 2023-05-31 21:03:31 | compliant | EAR99 | 8536.69.40.40 | 0 | |||||||||
对比 | 1CS225-354TT | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 225 | BE-CU | 2.54 mm | IC SOCKET | PGA225 | e0 | 140 °C | -60 °C | 15X15 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.5 inch | 1.5 inch | 1651 | 2023-05-31 21:10:35 | compliant | EAR99 | 8536.69.40.40 | 0 | ||||||||||
对比 | 1FIS065-344TT | Advanced Interconnections Corp | 查询价格 | No | Active | 65 | BE-CU | 2.54 mm | IC SOCKET | PGA65 | e0 | 10X10 | SN-PB | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1 inch | 1 inch | 1651 | 2024-03-02 20:26:15 | compliant | USA | EAR99 | 8536.69.40.40 | 4.39 | |||||||||||
对比 | CIS067-354GT | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 67 | BE-CU | 2.54 mm | IC SOCKET | PGA67 | e4 | 140 °C | -60 °C | 11X11 | SN-PB | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.1 inch | 1.1 inch | 1651 | 2023-05-31 21:00:21 | compliant | EAR99 | 8536.69.40.40 | 0 | ||||||||||
对比 | FS044-04GT | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 44 | BE-CU | 2.54 mm | IC SOCKET | PGA44 | e4 | 140 °C | 8X8 | SN-PB ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 0.8 inch | 0.8 inch | 1651 | 2023-05-31 21:11:04 | compliant | EAR99 | 8536.69.40.40 | 0 | |||||||||||
对比 | FS280-01TG | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 280 | BRASS | 2.54 mm | IC SOCKET | PGA280 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 140 °C | 19X19 | NOT APPLICABLE | TIN LEAD OVER NICKEL | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.9 inch | 1.9 inch | 1651 | 2023-12-01 18:15:53 | not_compliant | EAR99 | 8536.69.40.40 | 0 | ||||||||||
对比 | HCS092-49GG | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 92 | BE-CU | 2.54 mm | IC SOCKET | PGA92 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 10X10 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1 inch | 1 inch | 1651 | 2023-05-31 21:11:04 | compliant | EAR99 | 8536.69.40.40 | 0 | |||||||||
对比 | HCS113-49TG | Advanced Interconnections Corp | 查询价格 | No | Obsolete | 113 | BE-CU | 2.54 mm | IC SOCKET | PGA113 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 11X11 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1.1 inch | 1.1 inch | 1651 | 2023-05-31 21:11:03 | compliant | EAR99 | 8536.69.40.40 | 0 | |||||||||
对比 | HIS075-01TT | Advanced Interconnections Corp | 查询价格 | No | Active | 75 | BE-CU | 2.54 mm | IC SOCKET | PGA75 | e0 | 150 °C | -60 °C | 9X9 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 0.9 inch | 0.9 inch | 1651 | 2024-03-02 19:05:48 | compliant | USA | EAR99 | 8536.69.40.40 | 4.25 | |||||||||
对比 | 405-0029-03S-P32-N10 | Andon Electronics | 查询价格 | Contact Manufacturer | IC SOCKET | 4307537 | 2022-09-02 02:05:13 | compliant | EAR99 | 8536.69.40.40 |