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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | HTS代码 | YTEOL | Source Content uid | ECCN代码 | 交付时间 | 制造商包装代码 | Country Of Origin | Date Of Intro | |
对比 | AD7002AS | Rochester Electronics LLC | 查询价格 | No | No | Active | 5 V | CMOS | 1 | INDUSTRIAL | BASEBAND CIRCUIT | S-PQFP-G44 | e0 | COMMERCIAL | NOT SPECIFIED | 85 °C | -40 °C | 220 | 30 | 44 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 2.45 mm | 2178096 | 2016-06-20 18:00:17 | QFP | QFP, | 44 | unknown | ||||||||||||
对比 | MAX9982ETP+TD | Maxim Integrated Products | 查询价格 | Yes | Obsolete | 5 V | BICMOS | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N20 | e3 | 1 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | 2164 | 2022-08-02 13:52:10 | 5 X 5 MM, 0.80 MM HEIGHT, MO-220, QFN-20 | compliant | 8542.39.00.01 | 0 | ||||||||||||||||
对比 | RFFM6904 | RF Micro Devices Inc | 查询价格 | Transferred | RF AND BASEBAND CIRCUIT | 2355 | 2022-01-29 06:43:48 | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||||||
对比 | AWB7125P8 | ANADIGICS Inc | 查询价格 | Yes | Transferred | 4.2 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XDMA-N14 | 4 | 85 °C | -40 °C | 14 | UNSPECIFIED | SQUARE | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.07 mm | DUAL | 7 mm | 7 mm | 1.46 mm | 1740 | 2023-07-31 17:33:58 | ROHS COMPLIANT, PACKAGE-14 | unknown | 8542.39.00.01 | |||||||||||||||||||||
对比 | MC13159DTB | Motorola Mobility LLC | 查询价格 | No | Obsolete | 3 V | BIPOLAR | 1 | 7.5 mA | OTHER | RF AND BASEBAND CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.2 mm | 2141108 | 2022-02-06 11:33:32 | TSSOP | TSSOP, | 16 | unknown | 8542.39.00.01 | 0 | |||||||||||||
对比 | MC13159DTB | Motorola Semiconductor Products | 查询价格 | No | Obsolete | 3 V | BIPOLAR | 1 | 7.5 mA | OTHER | RF AND BASEBAND CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.2 mm | 207895312 | 2022-02-06 11:33:32 | TSSOP, | unknown | 8542.39.00.01 | 0 | |||||||||||||||
对比 | MD7IC2250NR1 | Freescale Semiconductor | 查询价格 | No | Yes | Transferred | 28 V | 1 | RF AND BASEBAND CIRCUIT | R-PDFM-T14 | e3 | Not Qualified | 3 | 260 | 40 | 14 | PLASTIC/EPOXY | RECTANGULAR | FLANGE MOUNT | NO | Matte Tin (Sn) | THROUGH-HOLE | DUAL | 1999 | 2023-07-31 18:40:53 | TO-272 | ROHS COMPLIANT, PLASTIC, TO-272, 14 PIN | 14 | not_compliant | 8542.33.00.01 | MD7IC2250NR1 | EAR99 | ||||||||||||||||||
对比 | MAX2388ETC+ | Maxim Integrated Products | 查询价格 | Yes | Obsolete | 2.7 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N12 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 800 µm | 2164 | 2023-01-04 01:58:41 | QFN | VQCCN, | 12 | compliant | 8542.39.00.01 | 0 | 5A991 | [object Object] | ||||||||||
对比 | TQM613017 | TriQuint Semiconductor | 查询价格 | Transferred | 3.4 V | 1 | RF AND BASEBAND CIRCUIT | R-XQMA-N22 | Not Qualified | 22 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1 mm | QUAD | 5 mm | 8 mm | 1.62 mm | 2490 | 2022-02-08 02:31:56 | QMA | , | 22 | unknown | 8542.39.00.01 | |||||||||||||||||||||||
对比 | AWT6635P9 | ANADIGICS Inc | 查询价格 | Yes | Transferred | 3.4 V | 1 | RF AND BASEBAND CIRCUIT | S-XDMA-N10 | 3 | 10 | UNSPECIFIED | SQUARE | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 600 µm | DUAL | 3 mm | 3 mm | 1.13 mm | 1740 | 2022-01-29 20:42:51 | , | unknown | 8542.39.00.01 | ||||||||||||||||||||||||
对比 | MAX2021ETX+ | Analog Devices Inc | 查询价格 | Yes | Active | 5 V | BICMOS | 1 | 315 µA | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N36 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 800 µm | 1742 | 2024-04-02 16:05:01 | 36-LFCSP-6X6X0.75 | 6 X 6 MM, ROHS COMPLIANT, TQFN-36 | 36 | compliant | 8.5 | MAX2021ETX+ | 36-LFCSP-6X6X0.75 | Japan, Mainland China, Malaysia, Philipp... more | 2006-04-05 | ||||||
对比 | TQM7M4014 | TriQuint Semiconductor | 查询价格 | Transferred | 3.5 V | 1 | BASEBAND CIRCUIT | R-XQMA-N20 | Not Qualified | 20 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | QUAD | 2490 | 2023-08-05 19:03:22 | QMA | 10 X 7 MM, 1.40 MM HEIGHT, MODULE-20 | 20 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||
对比 | TRF6903PTR | Texas Instruments | 查询价格 | Yes | Yes | Obsolete | 2.7 V | CMOS | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQFP-G48 | e4 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | LFQFP | QFP48,.35SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | 2477 | 2023-10-01 23:26:06 | QFP | LFQFP, QFP48,.35SQ,20 | 48 | compliant | 8542.39.00.01 | 0 | TRF6903PTR | EAR99 | Taiwan | ||||||
对比 | ALM-2506-TR2G | Avago Technologies | 查询价格 | Obsolete | 2.85 V | 1 | RF AND BASEBAND CIRCUIT | S-PDSO-N6 | Not Qualified | 6 | PLASTIC/EPOXY | HTSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | YES | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 1.2 mm | 1778 | 2022-06-02 12:36:51 | SOIC | HTSON, | 6 | unknown | 8542.33.00.01 | 0 | EAR99 | ||||||||||||||||||||
对比 | TRF371135IRGZR | Texas Instruments | 查询价格 | Yes | Yes | Active | 5 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PQCC-N48 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | 2477 | 2024-04-21 00:01:12 | QFN | 7 X 7 MM, GREEN, PLASTIC, VQFN-48 | 48 | compliant | 8542.39.00.01 | 15 | TRF371135IRGZR | EAR99 | ||||||||
对比 | ACMD-7410-BLK | Avago Technologies | 查询价格 | Yes | Yes | Obsolete | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | R-XXMA-N9 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 9 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | GOLD | NO LEAD | UNSPECIFIED | 950 µm | 1778 | 2022-08-02 16:32:14 | MODULE | , | 9 | compliant | 8542.39.00.01 | 0 | EAR99 | |||||||||||||||||
对比 | T2803-PLSW | Atmel Corporation | 查询价格 | Yes | Yes | Obsolete | 3 V | 1 | COMMERCIAL | RF AND BASEBAND CIRCUIT | S-XQCC-N48 | e3 | Not Qualified | 2 | 60 °C | -10 °C | 260 | 48 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | 1773 | 2022-08-02 15:45:44 | QFN | HVQCCN, | 48 | compliant | 8542.39.00.01 | 0 | ||||||||||||
对比 | HMC6000LP711E | Hittite Microwave Corp | 查询价格 | Yes | Transferred | 2.7 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | R-PQCC-N60 | e3 | 3 | 85 °C | -40 °C | 60 | PLASTIC/EPOXY | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 6.995 mm | 10.995 mm | 850 µm | 2035 | 2022-01-27 21:16:40 | HVQCCN, | compliant | 8542.39.00.01 | 5A991.B | |||||||||||||||||
对比 | ADF4360-1BCP | Rochester Electronics LLC | 查询价格 | No | No | Active | 3.3 V | 1 | INDUSTRIAL | BASEBAND CIRCUIT | S-XQCC-N24 | e0 | COMMERCIAL | 3 | 85 °C | -40 °C | 240 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN LEAD | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | 2178096 | 2016-06-20 18:00:17 | QFN | HVQCCN, | 24 | unknown | |||||||||||||
对比 | MAX4003EBL+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Obsolete | 3 V | 1 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | S-PBGA-B8 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1.52 mm | 1.52 mm | 670 µm | 2164 | 2023-01-04 02:05:35 | BGA | VFBGA, | 8 | compliant | 8542.39.00.01 | 0 | EAR99 |