Cordless Telephone ICs_Cordless Telephone ICs型号_Cordless Telephone ICs参数-datasheet5电子元器件查询网

								Most Relevant		Technical				Compliance			Operating Conditions				Physical											Dimensions			Other
对比	制造商型号	制造商	综合价格	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	Modified On	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	Source Content uid	YTEOL
对比	NJM2292V	New Japan Radio Co Ltd	查询价格		Yes	Yes	Transferred	2.4 V	BIPOLAR	1	2.7 mA	OTHER	CORDLESS TELEPHONE BASEBAND CIRCUIT	R-PDSO-G20	e6	Not Qualified	85 °C	-30 °C			20	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES	TIN BISMUTH	GULL WING	650 µm	DUAL	4.4 mm	6.5 mm	1.45 mm	2236	2022-06-02 12:36:45	SSOP	LSSOP,	20	compliant	8542.39.00.01
对比	TA31136FN(EL)	Toshiba America Electronic Components	查询价格				Active					OTHER	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-PDSO-G16		Not Qualified	85 °C	-30 °C			16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	4.4 mm	5 mm	1.6 mm	2484	2022-10-04 03:14:10	SOIC	LSSOP,	16	unknown	8542.39.00.01	TA31136FN(EL)	2
对比	TA31136FN-TP1	Toshiba America Electronic Components	查询价格				Active					OTHER	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-PDSO-G16		Not Qualified	85 °C	-30 °C			16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	4.4 mm	5 mm	1.6 mm	2484	2022-10-04 03:10:55	SOIC	LSSOP,	16	unknown	8542.39.00.01	TA31136FN-TP1	2
对比	TA31136FN-TP2	Toshiba America Electronic Components	查询价格				Active					OTHER	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-PDSO-G16		Not Qualified	85 °C	-30 °C			16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	4.4 mm	5 mm	1.6 mm	2484	2022-10-04 03:08:46	SOIC	LSSOP,	16	unknown	8542.39.00.01	TA31136FN-TP2	2
对比	TA31136FN(ER)	Toshiba America Electronic Components	查询价格				Active					OTHER	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-PDSO-G16		Not Qualified	85 °C	-30 °C			16	PLASTIC/EPOXY	LSSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	YES		GULL WING	650 µm	DUAL	4.4 mm	5 mm	1.6 mm	2484	2022-10-04 03:13:32	SOIC	LSSOP,	16	unknown	8542.39.00.01	TA31136FN(ER)	2
对比	UA31136-P16-T	Unisonic Technologies Co Ltd	查询价格				Active	2 V		1		OTHER	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G16	e0		85 °C	-30 °C			16	PLASTIC/EPOXY	TSSOP		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	TIN LEAD	GULL WING	650 µm	DUAL	4.4 mm	5.075 mm	1.2 mm	4317462	2022-09-02 01:38:54	TSSOP	TSSOP-16	16	compliant	8542.39.00.01
对比	UA31136-P16-R	Unisonic Technologies Co Ltd	查询价格				Active	2 V		1		OTHER	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G16	e0		85 °C	-30 °C			16	PLASTIC/EPOXY	TSSOP		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	TIN LEAD	GULL WING	650 µm	DUAL	4.4 mm	5.075 mm	1.2 mm	4317462	2022-09-02 01:36:18	TSSOP	TSSOP-16	16	compliant	8542.39.00.01
对比	BU8241FS-E2	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1	8 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified	75 °C	-25 °C	260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	10 mm	1.9 mm	2363	2024-04-02 15:30:51	SSOP	SSOP,	24	compliant	8542.39.00.01
对比	BU8241FS-T1	ROHM Semiconductor	查询价格		Yes	Yes	Active			1			SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified			260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	10 mm	2.01 mm	2363	2016-06-08 18:38:55	SSOP	SSOP-24	24	unknown
对比	BU8244F-T1	ROHM Semiconductor	查询价格		Yes	Yes	Active			1			SUPPORT CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified			260	10	16	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	4.4 mm	10 mm	1.71 mm	2363	2016-06-08 18:38:55	SOIC	SOP-16	16	unknown
对比	BU8244F	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1	8 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G16	e3/e2	Not Qualified	75 °C	-25 °C	260	10	16	PLASTIC/EPOXY	LSOP		RECTANGULAR	SMALL OUTLINE, LOW PROFILE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	4.4 mm	10 mm	1.6 mm	2363	2024-04-02 15:31:53	SOIC	SOP-16	16	compliant	8542.39.00.01
对比	BU8242F	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1	8 mA	COMMERCIAL EXTENDED	CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G20	e3/e2	Not Qualified	75 °C	-25 °C	260	10	20	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	TIN/TIN COPPER	GULL WING	1.27 mm	DUAL	5.4 mm	12.5 mm	1.9 mm	2363	2024-04-02 15:41:32	SOIC	SOP-20	20	compliant	8542.39.00.01
对比	TA31136FG	Toshiba America Electronic Components	查询价格				Active	2 V	BIPOLAR	1	4.6 mA	OTHER	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-PDSO-G16	e2	Not Qualified	85 °C	-30 °C			16	PLASTIC/EPOXY	SSOP	SOP16,.25,40	RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN SILVER	GULL WING	1 mm	DUAL	4.6 mm	8.2 mm	1.9 mm	2484	2024-04-02 16:16:09	SOIC	SSOP, SOP16,.25,40	16	unknown	8542.39.00.01	TA31136FG	2
对比	BU8241FST2	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1	8 mA		CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified			260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING		DUAL				2363	2024-04-02 15:43:44	SSOP	SSOP,	24	compliant	8542.39.00.01
对比	BU8241FSE2	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1		COMMERCIAL EXTENDED	SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified	75 °C	-25 °C	260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	10 mm	2.01 mm	2363	2016-06-08 18:38:55	SSOP	SSOP,	24	unknown
对比	BU8241FST1	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1	8 mA		CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified			260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING		DUAL				2363	2024-04-02 15:45:00	SSOP	SSOP,	24	compliant	8542.39.00.01
对比	BU8241FS-E1	ROHM Semiconductor	查询价格		Yes	Yes	Active			1			SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified			260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	10 mm	2.01 mm	2363	2016-06-08 18:38:55	SSOP	SSOP,	24	compliant
对比	BU8241FSE1	ROHM Semiconductor	查询价格		Yes	Yes	Active	5 V		1	8 mA		CORDLESS TELEPHONE SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified			260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	10 mm	1.9 mm	2363	2024-04-02 15:45:13	SSOP	SSOP-24	24	compliant	8542.39.00.01
对比	TA31136F(EL)	Toshiba America Electronic Components	查询价格				Active					OTHER	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	R-PDSO-G16		Not Qualified	85 °C	-30 °C			16	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES		GULL WING	1 mm	DUAL	4.6 mm	8.2 mm	1.9 mm	2484	2022-10-04 03:14:13	SOIC	SSOP,	16	unknown	8542.39.00.01	TA31136F(EL)	2
对比	BU8241FS-T2	ROHM Semiconductor	查询价格		Yes	Yes	Active			1			SUPPORT CIRCUIT	R-PDSO-G24	e3/e2	Not Qualified			260	10	24	PLASTIC/EPOXY	SSOP		RECTANGULAR	SMALL OUTLINE, SHRINK PITCH	YES	TIN/TIN COPPER	GULL WING	800 µm	DUAL	5.4 mm	10 mm	2.01 mm	2363	2016-06-08 18:38:55	SSOP	SSOP,	24	unknown

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