Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | HTS代码 | Source Content uid | YTEOL | |
对比 | NJM2292V | New Japan Radio Co Ltd | 查询价格 | Yes | Yes | Transferred | 2.4 V | BIPOLAR | 1 | 2.7 mA | OTHER | CORDLESS TELEPHONE BASEBAND CIRCUIT | R-PDSO-G20 | e6 | Not Qualified | 85 °C | -30 °C | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN BISMUTH | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.45 mm | 2236 | 2022-06-02 12:36:45 | SSOP | LSSOP, | 20 | compliant | 8542.39.00.01 | |||||||
对比 | TA31136FN(EL) | Toshiba America Electronic Components | 查询价格 | Active | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2484 | 2022-10-04 03:14:10 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | TA31136FN(EL) | 2 | |||||||||||||
对比 | TA31136FN-TP1 | Toshiba America Electronic Components | 查询价格 | Active | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2484 | 2022-10-04 03:10:55 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | TA31136FN-TP1 | 2 | |||||||||||||
对比 | TA31136FN-TP2 | Toshiba America Electronic Components | 查询价格 | Active | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2484 | 2022-10-04 03:08:46 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | TA31136FN-TP2 | 2 | |||||||||||||
对比 | TA31136FN(ER) | Toshiba America Electronic Components | 查询价格 | Active | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2484 | 2022-10-04 03:13:32 | SOIC | LSSOP, | 16 | unknown | 8542.39.00.01 | TA31136FN(ER) | 2 | |||||||||||||
对比 | UA31136-P16-T | Unisonic Technologies Co Ltd | 查询价格 | Active | 2 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e0 | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | 4317462 | 2022-09-02 01:38:54 | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | ||||||||||||
对比 | UA31136-P16-R | Unisonic Technologies Co Ltd | 查询价格 | Active | 2 V | 1 | OTHER | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e0 | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | 4317462 | 2022-09-02 01:36:18 | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | ||||||||||||
对比 | BU8241FS-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 1.9 mm | 2363 | 2024-04-02 15:30:51 | SSOP | SSOP, | 24 | compliant | 8542.39.00.01 | ||||||
对比 | BU8241FS-T1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | 2016-06-08 18:38:55 | SSOP | SSOP-24 | 24 | unknown | ||||||||||||
对比 | BU8244F-T1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 10 mm | 1.71 mm | 2363 | 2016-06-08 18:38:55 | SOIC | SOP-16 | 16 | unknown | ||||||||||||
对比 | BU8244F | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 16 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 10 mm | 1.6 mm | 2363 | 2024-04-02 15:31:53 | SOIC | SOP-16 | 16 | compliant | 8542.39.00.01 | ||||||
对比 | BU8242F | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | 8 mA | COMMERCIAL EXTENDED | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G20 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | 2363 | 2024-04-02 15:41:32 | SOIC | SOP-20 | 20 | compliant | 8542.39.00.01 | ||||||
对比 | TA31136FG | Toshiba America Electronic Components | 查询价格 | Active | 2 V | BIPOLAR | 1 | 4.6 mA | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | e2 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | SOP16,.25,40 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN SILVER | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | 2484 | 2024-04-02 16:16:09 | SOIC | SSOP, SOP16,.25,40 | 16 | unknown | 8542.39.00.01 | TA31136FG | 2 | ||||||
对比 | BU8241FST2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | DUAL | 2363 | 2024-04-02 15:43:44 | SSOP | SSOP, | 24 | compliant | 8542.39.00.01 | |||||||||||||
对比 | BU8241FSE2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | COMMERCIAL EXTENDED | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | 2016-06-08 18:38:55 | SSOP | SSOP, | 24 | unknown | ||||||||
对比 | BU8241FST1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | DUAL | 2363 | 2024-04-02 15:45:00 | SSOP | SSOP, | 24 | compliant | 8542.39.00.01 | |||||||||||||
对比 | BU8241FS-E1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | 2016-06-08 18:38:55 | SSOP | SSOP, | 24 | compliant | ||||||||||||
对比 | BU8241FSE1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | 8 mA | CORDLESS TELEPHONE SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 1.9 mm | 2363 | 2024-04-02 15:45:13 | SSOP | SSOP-24 | 24 | compliant | 8542.39.00.01 | |||||||||
对比 | TA31136F(EL) | Toshiba America Electronic Components | 查询价格 | Active | OTHER | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | 2484 | 2022-10-04 03:14:13 | SOIC | SSOP, | 16 | unknown | 8542.39.00.01 | TA31136F(EL) | 2 | |||||||||||||
对比 | BU8241FS-T2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 1 | SUPPORT CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | 2363 | 2016-06-08 18:38:55 | SSOP | SSOP, | 24 | unknown |