Digital Transmission Support_Digital Transmission Support型号_Digital Transmission Support参数-datasheet5电子元器件查询网

								Most Relevant				Technical					Compliance			Operating Conditions					Physical											Dimensions			Other
对比	制造商型号	制造商	综合价格	风险等级	是否无铅	是否Rohs认证	生命周期	标称供电电压	技术	运营商类型	数据速率	运营商类型（2）	功能数量	最大压摆率	温度等级	电信集成电路类型	JESD-30 代码	JESD-609代码	认证状态	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	宽度	长度	座面最大高度	mfrid	Modified On	零件包装代码	包装说明	针数	是否符合REACH标准	HTS代码	YTEOL	ECCN代码	交付时间
对比	T5691IP	Exar Corporation	查询价格			No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	INDUSTRIAL	ELASTIC BUFFER	R-PDIP-T24	e0	Not Qualified		85 °C	-40 °C			24	PLASTIC/EPOXY	DIP	DIP24,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL				1972	2023-08-01 23:16:19	DIP	DIP, DIP24,.3	24	unknown	8542.39.00.01	0
对比	LXP2176PE	Level One	查询价格			No	Transferred	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	INDUSTRIAL	ELASTIC BUFFER	S-PQCC-J28	e0	Not Qualified		85 °C	-40 °C			28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD				4317302	2023-08-02 01:05:10		QCCJ, LDCC28,.5SQ		unknown	8542.39.00.01
对比	DS2175	Maxim Integrated Products	查询价格			No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps		1	16 µA	COMMERCIAL	ELASTIC BUFFER	R-PDIP-T16	e0	Not Qualified	1	70 °C				16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.175 mm	4.572 mm	2164	2024-04-02 15:59:55		0.300 INCH, DIP-16		compliant		0
对比	DS2176N	Dallas Semiconductor	查询价格			No	Transferred	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	INDUSTRIAL	ELASTIC BUFFER	R-PDIP-T24	e0	Not Qualified		85 °C	-40 °C			24	PLASTIC/EPOXY	DIP	DIP24,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	31.877 mm	4.699 mm	285649165	2023-08-02 09:56:21		0.300 INCH, DIP-24		unknown
对比	DS2175+	Maxim Integrated Products	查询价格		Yes	Yes	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps		1	16 µA	COMMERCIAL	ELASTIC BUFFER	R-PDIP-T16	e3	Not Qualified	1	70 °C		260	30	16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	MATTE TIN	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.175 mm	4.572 mm	2164	2024-04-02 16:05:26	DIP	0.300 INCH, DIP-16	16	compliant	8473.30.11.40	0	EAR99	[object Object]
对比	XR-T5691CJ	Exar Corporation	查询价格			No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	COMMERCIAL	ELASTIC BUFFER	S-PQCC-J28	e0	Not Qualified		70 °C				28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	11.5062 mm	11.5062 mm	4.57 mm	1972	2023-08-02 09:28:29	QLCC	QCCJ, LDCC28,.5SQ	28	unknown	8542.39.00.01	0
对比	DS2176Q	Dallas Semiconductor	查询价格			No	Transferred	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	COMMERCIAL	ELASTIC BUFFER	S-PQCC-J28	e0	Not Qualified		70 °C				28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	Tin/Lead (Sn/Pb)	J BEND	1.27 mm	QUAD	11.5062 mm	11.5062 mm	4.57 mm	285649165	2023-08-05 18:47:27		PLASTIC, LCC-28		unknown
对比	LXP2175NC	Level One	查询价格			No	Transferred	5 V	CMOS				1		COMMERCIAL	ELASTIC BUFFER	R-PDIP-T16	e0	Not Qualified		70 °C				16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL				4317302	2023-08-01 19:38:12		DIP, DIP16,.3		unknown	8542.39.00.01
对比	DS2176Q/T&R	Maxim Integrated Products	查询价格		No	No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	COMMERCIAL	ELASTIC BUFFER	S-PQCC-J28	e0	Not Qualified	1	70 °C				28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	11.505 mm	11.505 mm	4.57 mm	2164	2024-04-02 15:57:04	QLCC	PLASTIC, LCC-28	28	compliant	8542.39.00.01	0		[object Object]
对比	DS2175	Dallas Semiconductor	查询价格			No	Transferred	5 V	CMOS				1	16 mA	COMMERCIAL	ELASTIC BUFFER	R-PDIP-T16	e0	Not Qualified		70 °C				16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	Tin/Lead (Sn/Pb)	THROUGH-HOLE	2.54 mm	DUAL				285649165	2023-08-01 23:34:37		0.300 INCH, DIP-16		unknown
对比	DS2175SN+	Rochester Electronics LLC	查询价格		Yes	Yes	Active	5 V	CMOS				1		INDUSTRIAL	ELASTIC BUFFER	R-PDSO-G16	e3	COMMERCIAL	1	85 °C	-40 °C	260	NOT SPECIFIED	16	PLASTIC/EPOXY	SOP		RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	10.3 mm	2.65 mm	2178096	2016-06-20 18:00:17	SOIC	SOP,	16	unknown
对比	DS2175S	Maxim Integrated Products	查询价格			No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps		1	16 µA	COMMERCIAL	ELASTIC BUFFER	R-PDSO-G16	e0	Not Qualified	1	70 °C				16	PLASTIC/EPOXY	SOP	SOP16,.4	RECTANGULAR	SMALL OUTLINE	YES	TIN LEAD	GULL WING	1.27 mm	DUAL	7.5 mm	10.3 mm	2.65 mm	2164	2024-04-02 16:00:53		0.300 INCH, SOIC-16		not_compliant		0
对比	DS2175N	Rochester Electronics LLC	查询价格		No	No	Active	5 V	CMOS				1		INDUSTRIAL	ELASTIC BUFFER	R-PDIP-T16	e0	COMMERCIAL	1	85 °C	-40 °C	240	20	16	PLASTIC/EPOXY	DIP		RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	19.175 mm	4.572 mm	2178096	2016-06-20 18:00:17	DIP	DIP,	16	unknown
对比	DS2176+	Maxim Integrated Products	查询价格		Yes	Yes	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	COMMERCIAL	ELASTIC BUFFER	R-PDIP-T24	e3	Not Qualified	1	70 °C		260	30	24	PLASTIC/EPOXY	DIP	DIP24,.3	RECTANGULAR	IN-LINE	NO	MATTE TIN	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm	30.545 mm	4.572 mm	2164	2024-04-02 16:02:26	DIP	0.300 INCH, DIP-24	24	compliant	8542.39.00.01	0	EAR99	[object Object]
对比	DS2176QN	Maxim Integrated Products	查询价格		No	No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps	T-1(DS1)	1	10 mA	INDUSTRIAL	ELASTIC BUFFER	S-PQCC-J28	e0	Not Qualified	1	85 °C	-40 °C			28	PLASTIC/EPOXY	QCCJ	LDCC28,.5SQ	SQUARE	CHIP CARRIER	YES	TIN LEAD	J BEND	1.27 mm	QUAD	11.505 mm	11.505 mm	4.57 mm	2164	2024-04-02 15:54:47	QLCC	PLASTIC, LCC-28	28	compliant	8542.39.00.01	0	EAR99	[object Object]
对比	DS2175SN	Dallas Semiconductor	查询价格			No	Transferred	5 V	CMOS				1	16 µA	INDUSTRIAL	ELASTIC BUFFER	R-PDSO-G16	e0	Not Qualified		85 °C	-40 °C			16	PLASTIC/EPOXY	SOP	SOP16,.4	RECTANGULAR	SMALL OUTLINE	YES	Tin/Lead (Sn/Pb)	GULL WING	1.27 mm	DUAL	7.5 mm	10.3 mm	2.65 mm	285649165	2023-08-01 22:31:01		0.300 INCH, SOIC-16		unknown
对比	LXP2175SE	Intel Corporation	查询价格		No	No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps		1		INDUSTRIAL	ELASTIC BUFFER	R-PDSO-G16	e0	Not Qualified		85 °C	-40 °C			16	PLASTIC/EPOXY	SOP	SOP16,.4	RECTANGULAR	SMALL OUTLINE	YES	TIN LEAD	GULL WING	1.27 mm	DUAL	7.5 mm	10.3 mm	2.65 mm	2071	2024-04-02 17:56:26	SOIC	SOP, SOP16,.4	16	compliant	8542.39.00.01	0
对比	DS2175S+T&R	Maxim Integrated Products	查询价格		Yes	Yes	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps		1	16 µA	COMMERCIAL	ELASTIC BUFFER	R-PDSO-G16	e3	Not Qualified	1	70 °C		260	30	16	PLASTIC/EPOXY	SOP	SOP16,.4	RECTANGULAR	SMALL OUTLINE	YES	MATTE TIN	GULL WING	1.27 mm	DUAL	7.5 mm	10.3 mm	2.65 mm	2164	2024-04-02 16:01:53	SOIC	0.300 INCH, SOIC-16	16	compliant	8542.32.00.71	0	EAR99	[object Object]
对比	LXP2175NC	Intel Corporation	查询价格		No	No	Obsolete	5 V	CMOS	CEPT PCM-30/E-1	2.048 Gbps		1		COMMERCIAL	ELASTIC BUFFER	R-PDIP-T16	e0	Not Qualified		70 °C				16	PLASTIC/EPOXY	DIP	DIP16,.3	RECTANGULAR	IN-LINE	NO	TIN LEAD	THROUGH-HOLE	2.54 mm	DUAL	7.62 mm		5.84 mm	2071	2024-04-02 17:50:04	DIP	DIP, DIP16,.3	16	compliant	8542.39.00.01	0
对比	DS2175S	Dallas Semiconductor	查询价格			No	Transferred	5 V	CMOS				1	16 mA	COMMERCIAL	ELASTIC BUFFER	R-PDSO-G16	e0	Not Qualified		70 °C				16	PLASTIC/EPOXY	SOP	SOP16,.4	RECTANGULAR	SMALL OUTLINE	YES	Tin/Lead (Sn/Pb)	GULL WING	1.27 mm	DUAL	7.5 mm	10.3 mm	2.65 mm	285649165	2024-01-10 15:00:09		0.300 INCH, SOIC-16		unknown

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