Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 数据速率 | 其他特性 | 传真率 | 负电源额定电压 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | HTS代码 | YTEOL | 零件包装代码 | 针数 | Source Content uid | 制造商包装代码 | Country Of Origin | 交付时间 | |
对比 | XR-14412VN | Exar Corporation | 查询价格 | No | Obsolete | 5 V | CMOS | 4.5 µA | INDUSTRIAL | MODEM | R-XDIP-T16 | e0 | Not Qualified | 85 °C | -40 °C | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 1972 | 2023-08-02 00:34:54 | DIP, DIP16,.3 | compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||
对比 | SM144AC-H0-D0-A0-P0 | Conexant Systems Inc | 查询价格 | Obsolete | 5 V | 14 Mbps | FULL DUPLEX | 14.4 kbps | 1 | 80 mA | COMMERCIAL | MODEM-DATA/FAX | R-XDMA-P63 | Not Qualified | 70 °C | 63 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | PIN/PEG | DUAL | 1872 | 2023-05-31 17:23:06 | , | compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||||||
对比 | SMV144ACW-H0-D4-A0-P1 | Conexant Systems Inc | 查询价格 | No | Obsolete | 5 V | 14 Mbps | 14.4 kbps | 1 | 80 mA | COMMERCIAL | MODEM-DATA/FAX/VOICE | R-XDMA-P63 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 63 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | PIN/PEG | DUAL | 1872 | 2023-05-31 17:24:48 | , | compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||||
对比 | RFX96-S23 | Conexant Systems Inc | 查询价格 | No | Obsolete | 5 V | HALF DUPLEX | 9.6 kbps | 1 | COMMERCIAL | MODEM-DATA/FAX/VOICE | R-PQFP-G100 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | GULL WING | QUAD | 1872 | 2022-02-07 15:29:57 | QFP, | compliant | 8542.39.00.01 | 0 | QFP | 100 | ||||||||||||||||||||
对比 | MB86467PFQ | FUJITSU Limited | 查询价格 | No | Obsolete | CMOS | 19 mA | OTHER | MODEM | S-PQFP-G48 | e0 | Not Qualified | 70 °C | -30 °C | 48 | PLASTIC/EPOXY | QFP | QFP48,.7SQ,32 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 2000 | 2024-04-02 15:46:13 | QFP, QFP48,.7SQ,32 | compliant | 8542.39.00.01 | 0 | |||||||||||||||||||||
对比 | SC11055CN | Sierra Semiconductor | 查询价格 | No | Obsolete | 5 V | CMOS | 2 Mbps | 9.6 kbps | 1 | 25 mA | COMMERCIAL | MODEM-DATA/FAX | R-PDIP-T28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 293710933 | 2023-08-02 02:56:24 | unknown | 0 | ||||||||||||||||||||
对比 | RC224ATLF | Conexant Systems Inc | 查询价格 | No | Obsolete | 5 V | CMOS | 32 µA | COMMERCIAL | MODEM | R-PQFP-G100 | e0 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 635 µm | QUAD | 1872 | 2023-08-02 07:01:01 | QFP, QFP100,.7X.9 | compliant | 8542.39.00.01 | 0 | |||||||||||||||||||||
对比 | A5191HRTPG-XTD | onsemi | 查询价格 | Yes | Obsolete | 3.3 V | CMOS | 1 Mbps | 1 | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | 2260 | 2024-04-02 20:25:25 | LCC-28 | compliant | 8542.39.00.01 | 0 | PLCC-28 | 28 | A5191HRTPG-XTD | 776AA | Philippines | [object Object] | ||||||
对比 | SC11015CN | Sierra Semiconductor | 查询价格 | No | Obsolete | 5 V | CMOS | 1 Mbps | -5 V | 1 | COMMERCIAL | MODEM | R-PDIP-T24 | e0 | Not Qualified | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 293710933 | 2023-08-05 19:22:01 | DIP-24 | unknown | 0 | ||||||||||||||||||||
对比 | DS2245M-24 | Dallas Semiconductor | 查询价格 | Transferred | 5 V | 2 Mbps | FULL DUPLEX | 1 | 75 mA | COMMERCIAL | MODEM | R-XSMA-N30 | Not Qualified | 70 °C | 30 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | SINGLE | 285649165 | 2023-05-31 18:23:10 | unknown | ||||||||||||||||||||||||||||
对比 | SSI73K322-22IC | Silicon Systems Inc | 查询价格 | No | Obsolete | 12 V | CMOS | 25 mA | INDUSTRIAL | MODEM | R-XDIP-T22 | e0 | Not Qualified | 85 °C | -40 °C | 22 | CERAMIC | DIP | DIP22,.4 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 1624028 | 2023-08-07 14:33:21 | DIP, DIP22,.4 | unknown | 8542.39.00.01 | 0 | ||||||||||||||||||||
对比 | AMIS30585AGA | AMI Semiconductor | 查询价格 | Transferred | 3.3 V | 1 Mbps | 1 | OTHER | MODEM | S-PQCC-J28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | 293710869 | 2023-05-31 21:33:14 | GREEN, PLASTIC, LCC-28 | unknown | |||||||||||||||||||||||||||
对比 | SM96AC-H2-D0-A0-P1 | Conexant Systems Inc | 查询价格 | Obsolete | 5 V | 9 Mbps | FULL DUPLEX | 9.6 kbps | 1 | 110 mA | COMMERCIAL | MODEM-DATA/FAX | R-XDMA-P63 | Not Qualified | 70 °C | 63 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | PIN/PEG | DUAL | 1872 | 2023-05-31 17:28:51 | , | compliant | 8542.39.00.01 | 0 | ||||||||||||||||||||||||
对比 | CX93011-22Z | Synaptics Incorporated | 查询价格 | Yes | Obsolete | 3.3 V | 2 Mbps | 1 | COMMERCIAL | MODEM | S-XQCC-N20 | e3 | Not Qualified | 70 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 800 µm | QUAD | 6 mm | 6 mm | 900 µm | 223327797 | 2023-10-01 22:38:00 | HVQCCN, | compliant | 8542.39.00.01 | 0 | |||||||||||||||||||
对比 | SI2457-C-FSR | Skyworks Solutions Inc | 查询价格 | Yes | Active | 3.3 V | 56 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G16 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | 2408 | 2023-08-05 19:27:56 | ROHS COMPLIANT, SOIC-16 | compliant | 2 | ||||||||||||||||||||
对比 | 12197-503-XTP | AMI Semiconductor | 查询价格 | No | Transferred | 3.3 V | CMOS | 1 Mbps | 1 | INDUSTRIAL | MODEM | S-PQFP-G32 | e0 | Not Qualified | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | 293710869 | 2023-05-31 21:12:39 | LQFP-32 | unknown | |||||||||||||||||||
对比 | UA212ATQC | National Semiconductor Corporation | 查询价格 | No | Obsolete | CMOS | COMMERCIAL | MODEM | S-PQCC-J28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 2216 | 2023-08-07 14:15:10 | compliant | 8542.39.00.01 | 0 | UA212ATQC | |||||||||||||||||||||||
对比 | UA212ATQC | Texas Instruments | 查询价格 | No | Obsolete | CMOS | COMMERCIAL | MODEM | S-PQCC-J28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 2477 | 2023-08-07 14:15:10 | QCCJ, LDCC28,.5SQ | unknown | 8542.39.00.01 | 0 | UA212ATQC | ||||||||||||||||||||||
对比 | CMX878E1 | CML Microcircuits Plc | 查询价格 | Yes | Yes | Obsolete | 3.3 V | 2 Mbps | 1 | 5.5 µA | INDUSTRIAL | MODEM | R-PDSO-G28 | e3 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | 4317157 | 2023-08-01 18:28:41 | TSSOP, TSSOP28,.25 | compliant | 8542.39.00.01 | 0 | SSOP | 28 | |||||||||||
对比 | CL-MD1224-11VC-A | Cirrus Logic | 查询价格 | No | Active | 5 V | 50 mA | COMMERCIAL | S-PQFP-G100 | e0 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | QFP | TQFP100,.63SQ | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 1850 | 2023-08-02 07:23:42 | compliant | 8542.39.00.01 | 2 |