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其他电信集成电路: 44,462 个筛选结果
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数据速率 (50)
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最大增益公差 (5)
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制造商 (50)
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标称供电电压 (50)
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技术 (15)
电信集成电路类型 (16)
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Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
对比 制造商型号 制造商 综合价格
风险等级 是否无铅 是否Rohs认证 生命周期 标称供电电压 技术 最大增益公差 数据速率 电信集成电路类型 滤波器 线性编码 功能数量 电源 最大压摆率 温度等级 JESD-30 代码 JESD-609代码 认证状态 湿度敏感等级 最高工作温度 最低工作温度 峰值回流温度(摄氏度) 筛选级别 处于峰值回流温度下的最长时间 端子数量 封装主体材料 封装代码 封装等效代码 封装形状 封装形式 表面贴装 端子面层 端子形式 端子节距 端子位置 宽度 长度 座面最大高度 IHS 制造商
包装说明
是否符合REACH标准
交付时间
Samacsys Description
HTS代码
零件包装代码
针数
制造商包装代码
ECCN代码
对比
RN4871-I/RM130
Microchip Technology Inc 查询价格
Active 3.3 V TELECOM CIRCUIT 1 INDUSTRIAL R-XXMA-N16 85 °C -40 °C 16 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY YES NO LEAD UNSPECIFIED 9 mm 11.5 mm 2.16 mm MICROCHIP TECHNOLOGY INC , compliant 13 weeks Bluetooth BLE Module, Shielded, Antenna,
对比
RN4871-I/RM128
Microchip Technology Inc 查询价格
Active 3.3 V 10 Mbps TELECOM CIRCUIT 1 INDUSTRIAL R-XXMA-N16 85 °C -40 °C 16 UNSPECIFIED MODULE,16LEAD(UNSPEC) RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD 1.2 mm UNSPECIFIED 9 mm 11.5 mm 2.1 mm MICROCHIP TECHNOLOGY INC , MODULE,16LEAD(UNSPEC) compliant 13 weeks Bluetooth / 802.15.1 Modules Bluetooth 4... more
对比
RN4871-V/RM118
Microchip Technology Inc 查询价格
Active TELECOM CIRCUIT MICROCHIP TECHNOLOGY INC , compliant 12 weeks 8542.39.00.01
对比
RN4870-V/RM118
Microchip Technology Inc 查询价格
Active 3.3 V 10 Mbps TELECOM CIRCUIT 1 COMMERCIAL R-XXMA-N33 70 °C -20 °C 33 UNSPECIFIED MODULE,33LEAD(UNSPEC) RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD 1.1 mm UNSPECIFIED 12 mm 22 mm 2.4 mm MICROCHIP TECHNOLOGY INC , MODULE,33LEAD(UNSPEC) compliant 4 weeks 1 day 8542.39.00.01
对比
RN4870-I/RM130
Microchip Technology Inc 查询价格
Active 3.3 V TELECOM CIRCUIT 1 INDUSTRIAL R-XXMA-N33 85 °C -40 °C TS 16949 33 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY YES NO LEAD UNSPECIFIED 12 mm 22 mm 2.46 mm MICROCHIP TECHNOLOGY INC , compliant 16 weeks
对比
RN4871-I/RM140
Microchip Technology Inc 查询价格
Active 3.3 V TELECOM CIRCUIT 1 INDUSTRIAL R-XXMA-N16 85 °C -40 °C TS 16949 16 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY YES NO LEAD 1.2 mm UNSPECIFIED 9 mm 11.5 mm 2.16 mm MICROCHIP TECHNOLOGY INC , compliant 8 weeks 6 days Bluetooth Modules (802.15.1) Bluetooth L... more
对比
RN4678-V/RM100
Microchip Technology Inc 查询价格
Active 1.9 V 1 Gbps TELECOM CIRCUIT 1 OTHER R-XXMA-N33 70 °C -20 °C TS 16949 33 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY YES NO LEAD UNSPECIFIED 12 mm 22 mm 2.4 mm MICROCHIP TECHNOLOGY INC , compliant 4 weeks 3 days Bluetooth LE 4.2 Module w/Antenna 8542.39.00.01
对比
HTRC11001T/02EE,11
NXP Semiconductors 查询价格
Active 5 V TELECOM CIRCUIT 1 5 V 10 µA INDUSTRIAL R-PDSO-G14 e4 Not Qualified 1 85 °C -40 °C 260 30 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 4 mm 8.75 mm NXP SEMICONDUCTORS SOP, SOP14,.25 compliant HITAG Transponder RFID Reader SOIC14 8542.39.00.01 SOIC 14 SOT108-1
对比
PN5120A0HN1/C1,151
NXP Semiconductors 查询价格
Active 3 V TELECOM CIRCUIT 1 1.8/3.3,2.5/3.3 V OTHER S-PQCC-N32 e4 Not Qualified 1 85 °C -30 °C 260 30 32 PLASTIC/EPOXY HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 5 mm 5 mm 1 mm NXP SEMICONDUCTORS HVQCCN, LCC32,.2SQ,20 compliant 8542.39.00.01 QFN 32 SOT617-1
对比
HTRC11001T/03EE,11
NXP Semiconductors 查询价格
Active 5 V TELECOM CIRCUIT 1 5 V 10 µA INDUSTRIAL R-PDSO-G14 e4 Not Qualified 1 85 °C -40 °C 260 30 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 4 mm 8.75 mm NXP SEMICONDUCTORS SOP, SOP14,.25 compliant HITAG reader chip 8542.39.00.01 SOIC 14 SOT108-1
对比
PN5120A0HN1/C1,118
NXP Semiconductors 查询价格
Active 3 V TELECOM CIRCUIT 1 1.8/3.3,2.5/3.3 V OTHER S-PQCC-N32 e4 Not Qualified 1 85 °C -30 °C 260 30 32 PLASTIC/EPOXY HVQCCN LCC32,.2SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 5 mm 5 mm 1 mm NXP SEMICONDUCTORS HVQCCN, LCC32,.2SQ,20 compliant 8542.39.00.01 QFN 32 SOT617-1
对比
ATA8403C-6AQY-66
Microchip Technology Inc 查询价格
Active 3 V TELECOM CIRCUIT 1 OTHER S-PDSO-G8 85 °C -55 °C 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 3 mm 3 mm 1.05 mm MICROCHIP TECHNOLOGY INC TSSOP, compliant 18 weeks 8542.39.00.01
对比
RN4871U-V/RM118
Microchip Technology Inc 查询价格
Active TELECOM CIRCUIT MICROCHIP TECHNOLOGY INC , compliant 12 weeks Bluetooth / 802.15.1 Modules BT 4.2 BLE Module UnShielded 6x8mm 8542.39.00.01
对比
IS1871SF-202
Microchip Technology Inc 查询价格
Active 3 V TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N32 85 °C -40 °C TS 16949 32 UNSPECIFIED HVQCCN LCC32,.16SQ,16 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 400 µm QUAD 4 mm 4 mm 900 µm MICROCHIP TECHNOLOGY INC HVQCCN, LCC32,.16SQ,16 compliant 8542.39.00.01
对比
CYW4343WKUBGT
Cypress Semiconductor 查询价格
Active 1.2 V TELECOM CIRCUIT 1 OTHER R-PBGA-B74 70 °C -30 °C 74 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 400 µm BOTTOM 2.87 mm 4.87 mm 550 µm CYPRESS SEMICONDUCTOR CORP VFBGA, compliant RF Microcontrollers - MCU WICED WiFi/Bluetooth Combos 8542.31.00.01 5A992.C
对比
RN4020-V/RMBEC133
Microchip Technology Inc 查询价格
Active 3.3 V TELECOM CIRCUIT 1 OTHER R-XXMA-N24 85 °C -30 °C TS 16949 24 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY YES NO LEAD UNSPECIFIED 11.5 mm 19.5 mm 2.3 mm MICROCHIP TECHNOLOGY INC MODULE-24 compliant 10 weeks
对比
AD73311ARSZ-REEL
Analog Devices Inc 查询价格
No Yes Active 3 V CMOS 1 dB TELECOM CIRCUIT YES 16-BIT 1 3/5 V INDUSTRIAL R-PDSO-G20 e3 Not Qualified 1 85 °C -40 °C 260 40 20 PLASTIC/EPOXY SSOP SSOP20,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 5.3 mm 7.2 mm 2 mm ANALOG DEVICES INC SSOP, SSOP20,.3 compliant 8542.39.00.01 SSOP 20 RS-20 EAR99
对比
MCP2122-E/SN
Microchip Technology Inc 查询价格
Yes Yes Active 5 V CMOS TELECOM CIRCUIT 1 2/5 V 1 µA AUTOMOTIVE R-PDSO-G8 e3 Not Qualified 3 125 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 3.91 mm 4.9 mm 1.75 mm MICROCHIP TECHNOLOGY INC SOP, SOP8,.25 compliant 7 weeks 8-pin IrDA encoder/decoder 8542.39.00.01 SOIC 8 EAR99
对比
MCP2122T-E/SN
Microchip Technology Inc 查询价格
Yes Yes Active 5 V CMOS TELECOM CIRCUIT 1 2/5 V 1 µA AUTOMOTIVE R-PDSO-G8 e3 Not Qualified 1 125 °C -40 °C 260 40 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) - annealed GULL WING 1.27 mm DUAL 3.91 mm 4.9 mm 1.75 mm MICROCHIP TECHNOLOGY INC 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 compliant 10 weeks 8542.39.00.01 SOIC 8 EAR99
对比
MRF24J40-I/ML
Microchip Technology Inc 查询价格
Yes Yes Active 3.3 V TELECOM CIRCUIT 1 3.3 V INDUSTRIAL S-PQCC-N40 e3 Not Qualified 1 85 °C -40 °C 260 40 40 PLASTIC/EPOXY HVQCCN LCC40,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 6 mm 6 mm 1 mm MICROCHIP TECHNOLOGY INC 6 X 6 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-40 compliant 12 weeks 2.4 Ghz IEEE/ZigBee transceiver 8542.31.00.01 QFN 40
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