Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 其他特性 | 晶体频率 | 破损率 | 功能数量 | 储备 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 最高工作温度 | 最低工作温度 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | HTS代码 | YTEOL | 零件包装代码 | 针数 | |
对比 | MC34017DR2 | NXP Semiconductors | 查询价格 | Active | BIPOLAR | 1 | COMMERCIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G8 | Not Qualified | 60 °C | -20 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MC34017DR2 | 2245 | 2022-06-02 12:37:08 | SOP, | unknown | 8542.39.00.01 | |||||||||||||||
对比 | BL34118(28DIP) | Shanghai Belling Co Ltd | 查询价格 | Contact Manufacturer | 5 V | 8 mA | COMMERCIAL | SPEAKER PHONE CIRCUIT | R-PDIP-T28 | Not Qualified | 60 °C | -20 °C | 28 | PLASTIC/EPOXY | DIP | DIP28(UNSPEC) | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 116152093 | 2023-08-07 14:32:16 | DIP, DIP28(UNSPEC) | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | MC34012-2D | Freescale Semiconductor | 查询价格 | No | Obsolete | BIPOLAR | COMMERCIAL | R-PDSO-G8 | e0 | Not Qualified | 70 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | MC34012-2D | 1999 | 2023-10-04 15:58:35 | SOP, SOP8,.25 | unknown | 0 | |||||||||||||||||
对比 | KA8601 | Samsung Semiconductor | 查询价格 | Obsolete | 1 | TELEPHONE SPEECH CIRCUIT | R-PDIP-T48 | Not Qualified | 48 | PLASTIC/EPOXY | SDIP | RECTANGULAR | IN-LINE, SHRINK PITCH | NO | THROUGH-HOLE | 1.778 mm | DUAL | 15.24 mm | 42.47 mm | 5.08 mm | 2372 | 2022-01-28 16:28:14 | SDIP, | unknown | 8542.39.00.01 | 0 | DIP | 48 | |||||||||||||||||
对比 | AS2531DN | ams | 查询价格 | Obsolete | 5 V | 1:2 | 1 | TELEPHONE MULTIFUNCTION CIRCUIT | S-PQCC-J28 | Not Qualified | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | AS2531DN | 1731037 | 2023-12-04 16:35:08 | QCCJ, | unknown | 8542.39.00.01 | 0 | QLCC | 28 | ||||||||||||||||||
对比 | AS2507P | ams | 查询价格 | Obsolete | 5 V | CMOS | 1 | COMMERCIAL | TELEPHONE MULTIFUNCTION CIRCUIT | R-PDIP-T14 | Not Qualified | 60 °C | -10 °C | 14 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | AS2507P | 1731037 | 2023-12-04 16:34:20 | DIP, | unknown | 8542.39.00.01 | 0 | DIP | 14 | ||||||||||||||
对比 | U3760MB-SD | Temic Semiconductors | 查询价格 | Transferred | 1 | TELEPHONE MULTIFUNCTION CIRCUIT | R-PDIP-T40 | Not Qualified | 40 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 293710942 | 2022-01-29 16:03:45 | SDIP-40 | unknown | ||||||||||||||||||||||||||
对比 | U4082B-AFL | Temic Semiconductors | 查询价格 | Transferred | 5 V | 1 | COMMERCIAL | SPEAKER PHONE CIRCUIT | R-PDSO-G28 | Not Qualified | 60 °C | -20 °C | 28 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | 293710942 | 2022-02-08 00:39:31 | SO-28 | unknown | ||||||||||||||||||||||
对比 | UM91314C | United Microelectronics Corporation | 查询价格 | Obsolete | 2.5 V | 1:2 | 1 | 2 mA | COMMERCIAL | TELEPHONE DIALER CIRCUIT | R-PDIP-T18 | Not Qualified | 70 °C | -20 °C | 18 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | 4317463 | 2023-04-01 19:41:16 | , | unknown | 8542.39.00.01 | 0 | ||||||||||||||||||
对比 | S-7241D2F | ABLIC Inc. | 查询价格 | Obsolete | 5 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | 1.5 mA | COMMERCIAL | TELEPHONE DIALER CIRCUIT | R-PDSO-G28 | Not Qualified | 70 °C | -20 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 8.4 mm | 18.3 mm | 2.5 mm | 2390 | 2022-02-06 09:29:01 | SOP, | unknown | 8542.39.00.01 | 0 | SOIC | 28 | ||||||||||
对比 | SL5002P | Kodenshi Corporation | 查询价格 | Contact Manufacturer | 19 V | 4.2 mA | OTHER | R-PDIP-T8 | Not Qualified | 65 °C | -45 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 4317586 | 2023-08-07 14:22:21 | DIP, DIP8,.3 | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | LR48066 | Sharp Corp | 查询价格 | No | Obsolete | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.7 | 1 | OTHER | TELEPHONE DIALER CIRCUIT | S-PQFP-G36 | e0 | Not Qualified | 60 °C | -30 °C | 36 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 10 mm | 10 mm | 1.75 mm | 293710932 | 2022-01-28 11:08:53 | QFP-36 | unknown | 0 | ||||||||||||
对比 | AK2608A | Asahi Kasei Microsystems Corporation | 查询价格 | Obsolete | 5 V | 1 | TELEPHONE DIALER CIRCUIT | R-PQFP-G80 | Not Qualified | 80 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | GULL WING | QUAD | 1677 | 2022-02-08 13:22:18 | QFP, | unknown | 8542.39.00.01 | 0 | QFP | 80 | ||||||||||||||||||||
对比 | MC34011AFN | Motorola Mobility LLC | 查询价格 | No | Obsolete | 5 V | BIPOLAR | 1 | COMMERCIAL | TELEPHONE MULTIFUNCTION CIRCUIT | S-PQCC-J44 | e0 | Not Qualified | 60 °C | -20 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.57 mm | 2141108 | 2023-08-02 05:00:25 | QCCJ, LDCC44,.7SQ | unknown | 8542.39.00.01 | 0 | LCC | 44 | ||||||||
对比 | UM9559E | United Microelectronics Corporation | 查询价格 | Transferred | 4317463 | 2022-02-07 20:24:51 | , | unknown | |||||||||||||||||||||||||||||||||||||
对比 | MA552DP | Microsemi Corporation | 查询价格 | Transferred | 2192 | 2022-02-09 13:12:41 | , | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
对比 | SL5001P | Kodenshi Sensing | 查询价格 | Contact Manufacturer | 19 V | 4.2 mA | OTHER | R-PDIP-T8 | Not Qualified | 65 °C | -45 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 1774 | 2023-08-07 14:31:21 | DIP, DIP8,.3 | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | TP5615N/B+ | National Semiconductor Corporation | 查询价格 | No | Obsolete | CMOS | REPERTORY | 150 µA | OTHER | R-PDIP-T18 | e0 | Not Qualified | 70 °C | -30 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | TP5615N/B+ | 2216 | 2023-08-07 14:33:17 | DIP, DIP18,.3 | unknown | 8542.39.00.01 | 0 | |||||||||||||
对比 | SM8224BM | Nippon Precision Circuits Inc | 查询价格 | No | Transferred | 5 V | CMOS | 8 mA | OTHER | R-PDSO-G20 | e0 | Not Qualified | 85 °C | -20 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | 166795753 | 2023-08-07 14:20:03 | SSOP, SSOP20,.3 | unknown | 8542.39.00.01 | |||||||||||||||
对比 | HT9305AT | Holtek Semiconductor Inc | 查询价格 | No | Active | CMOS | 3.58 MHz | 2 mA | COMMERCIAL | R-PDIP-T20 | e0 | Not Qualified | 70 °C | -20 °C | 20 | PLASTIC/EPOXY | DIP | DIP20(UNSPEC) | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | DUAL | 2037 | 2023-08-02 10:48:14 | DIP, DIP20(UNSPEC) | unknown | 8542.39.00.01 | 2 |