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H5AN8G6NAFR-UHC

厂商名称: SK Hynix

H5AN8G6NAFR-UHC元件分类: 存储器

H5AN8G6NAFR-UHC英文描述:
DDR DRAM, 512MX16, CMOS, PBGA96

H5AN8G6NAFR-UHC相关的参考设计

  • 参数列表
  • 在这购买
H5AN8G6NAFR-UHC功能数量 1
H5AN8G6NAFR-UHC端子数量 96
H5AN8G6NAFR-UHC最小工作温度 0.0  Cel
H5AN8G6NAFR-UHC最大工作温度 85.0  Cel
H5AN8G6NAFR-UHC额定供电电压 1.2  V
H5AN8G6NAFR-UHC最小供电/工作电压 1.14  V
H5AN8G6NAFR-UHC最大供电/工作电压 1.26  V
H5AN8G6NAFR-UHC加工封装描述 FBGA-96
H5AN8G6NAFR-UHCreach_compliant Yes
H5AN8G6NAFR-UHC状态 Active
H5AN8G6NAFR-UHC存取方式 MULTI BANK PAGE BURST
H5AN8G6NAFR-UHCjesd_30_code R-PBGA-B96
H5AN8G6NAFR-UHC存储密度 8.589934592E9  bit
H5AN8G6NAFR-UHC内存IC类型 DDR DRAM
H5AN8G6NAFR-UHC内存宽度 16
H5AN8G6NAFR-UHC端口数 1
H5AN8G6NAFR-UHC位数 5.36870912E8  words
H5AN8G6NAFR-UHC位数 512M
H5AN8G6NAFR-UHC操作模式 SYNCHRONOUS
H5AN8G6NAFR-UHC组织 512MX16
H5AN8G6NAFR-UHC包装材料 PLASTIC/EPOXY
H5AN8G6NAFR-UHCpackage_code TFBGA
H5AN8G6NAFR-UHC包装形状 RECTANGULAR
H5AN8G6NAFR-UHC包装尺寸 GRID ARRAY, THIN PROFILE, FINE PITCH
H5AN8G6NAFR-UHCseated_height_max 1.2  mm
H5AN8G6NAFR-UHC表面贴装 YES
H5AN8G6NAFR-UHC工艺 CMOS
H5AN8G6NAFR-UHC温度等级 OTHER
H5AN8G6NAFR-UHC端子形式 BALL
H5AN8G6NAFR-UHC端子间距 0.8  mm
H5AN8G6NAFR-UHC端子位置 BOTTOM
H5AN8G6NAFR-UHClength 13.0  mm
H5AN8G6NAFR-UHCwidth 7.5  mm
H5AN8G6NAFR-UHCadditional_feature AUTO/SELF REFRESH

目前在售H5AN8G6NAFR-UHC的授权分销商:

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