Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 部门规模 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 最大时钟频率 (fCLK) | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 启动块 | 命令用户界面 | 通用闪存接口 | 数据轮询 | 数据保留时间-最小值 | 耐久性 | 功能数量 | 端口数量 | 部门数/规模 | 字数代码 | 字数 | 工作模式 | 输出特性 | 页面大小 | 并行/串行 | 编程电压 | 就绪/忙碌 | 串行总线类型 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | 切换位 | 类型 | 最长写入周期时间 (tWC) | 写保护 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | mfrid | Modified On | 是否符合REACH标准 | Country Of Origin | 交付时间 | YTEOL | Source Content uid | 零件包装代码 | 包装说明 | 针数 | ECCN代码 | HTS代码 | |
对比 | S29AL008J70TFI020 | Infineon Technologies AG | 查询价格 | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 20 | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 5 µA | 12 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2065 | 2024-05-17 23:35:47 | compliant | Thailand | [object Object] | 4.25 | ||||||||||||||||
对比 | SST39VF1601C-70-4I-EKE | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2188 | 2024-05-17 23:04:37 | compliant | Thailand | [object Object] | 24.48 | SST39VF1601C-70-4I-EKE | TSOP1 | TSOP-48 | 48 | EAR99 | 8542.32.00.51 | ||||||||
对比 | MX29LV160DBTI-70G | Macronix International Co Ltd | 查询价格 | Yes | Active | 16.7772 Mbit | 16 | 16K,8K,32K,64K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 15 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 4307504 | 2024-05-17 23:15:49 | compliant | Taiwan | [object Object] | 5.66 | TSOP1 | 20 X 12 MM, ROHS COMPLIANT, MO-142, TSOP1-48 | 48 | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||||
对比 | SST39VF1601C-70-4C-B3KE | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | 2188 | 2024-05-17 23:04:37 | compliant | Philippines, Taiwan, Thailand | [object Object] | 24.48 | SST39VF1601C-70-4C-B3KE | BGA | TFBGA-48 | 48 | 3A991.B.1.A | 8542.32.00.51 | |||||||||
对比 | MX29LV800CBTI-70G | Macronix International Co Ltd | 查询价格 | Yes | Yes | Active | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 70 ns | FLASH | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin (Sn) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | 4307504 | 2024-05-17 23:15:49 | unknown | Taiwan | [object Object] | 5.66 | TSOP | TFBGA, TSSOP48,.8,20 | 48 | 3A991.B.1.A | 8542.32.00.51 | ||||||||||||||
对比 | S29AL008J70TFI023 | Infineon Technologies AG | 查询价格 | Yes | Active | 8.3886 Mbit | 16 | 8K,4K,16K,32K | 512KX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | YES | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 12 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2065 | 2024-05-17 23:32:49 | compliant | [object Object] | 4.25 | ||||||||||||||||||||
对比 | SST39VF1601C-70-4C-EKE | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 16.7772 Mbit | 16 | 8K,4K,16K,32K | 1MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 1,2,1,31 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 20 µA | 35 µA | 3.6 V | 2.7 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 70 °C | 260 | TS 16949 | 40 | 48 | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | 2188 | 2024-05-17 23:04:37 | compliant | Thailand | [object Object] | 24.48 | SST39VF1601C-70-4C-EKE | TSOP1 | TSOP-48 | 48 | 3A991.B.1.A | 8542.32.00.51 | |||||||||
对比 | MX29F040CTI-70G | Macronix International Co Ltd | 查询价格 | Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G32 | Not Qualified | e6 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN/BISMUTH (SN/BI) | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | 4307504 | 2024-05-17 23:32:42 | unknown | Taiwan | [object Object] | 5.66 | TSOP1 | TSOP1, TSSOP32,.8,20 | 32 | EAR99 | 8542.32.00.51 | |||||||||||||||||
对比 | S25FL128SAGMFI003 | Infineon Technologies AG | 查询价格 | Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | 2024-05-17 23:32:42 | compliant | Mainland China, Taiwan, Thailand | [object Object] | 9.8 | |||||||||||||||||||||
对比 | S25FL128SAGMFV003 | Infineon Technologies AG | 查询价格 | Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 300 µA | 100 µA | 3.6 V | 2.7 V | CMOS | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | e3 | 3 | 105 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | 2024-05-17 23:32:49 | compliant | [object Object] | 9.8 | |||||||||||||||||||||||||||
对比 | S25FL128SAGMFI000 | Infineon Technologies AG | 查询价格 | Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | 2065 | 2024-05-17 23:35:51 | compliant | Mainland China, Taiwan, Thailand | [object Object] | 9.8 | |||||||||||||||||||||
对比 | MX29GL256FLT2I-90Q | Macronix International Co Ltd | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 100 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 10 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 56 | PLASTIC/EPOXY | TSOP1 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | 4307504 | 2024-05-17 23:15:49 | compliant | Taiwan | [object Object] | 3.83 | TSOP1 | 14 X 20 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-142, TSOP1-56 | 56 | EAR99 | 8542.32.00.51 | ||||||||||||||||||
对比 | MX29F040CQI-70G | Macronix International Co Ltd | 查询价格 | Yes | Yes | Active | 4.1943 Mbit | 8 | 64K | 512KX8 | 5 V | 70 ns | FLASH | YES | YES | 100000 Write/Erase Cycles | 1 | 8 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 5 V | 5 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 14.05 mm | 11.43 mm | 4307504 | 2024-05-17 23:15:49 | compliant | Taiwan | [object Object] | 3.15 | LCC | ROHS COMPLIANT, PLASTIC, MS-016, LCC-32 | 32 | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||||
对比 | S25FL064LABMFI010 | Infineon Technologies AG | 查询价格 | Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | 2024-05-01 20:04:13 | compliant | Mainland China, Taiwan | 6.8 | ||||||||||||||||||||||||||||||||
对比 | IS25LP064A-JBLE | Integrated Silicon Solution Inc | 查询价格 | Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 133 MHz | FLASH | 1 | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 35 µA | 25 µA | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | e3 | 1 | 105 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2070 | 2024-05-17 23:08:00 | compliant | Mainland China, Taiwan | [object Object] | 5.6 | SOP, SOP8,.3 | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
对比 | S25FL064LABMFV013 | Infineon Technologies AG | 查询价格 | Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | 2024-05-17 23:35:51 | compliant | [object Object] | 6.8 | ||||||||||||||||||||||||||||||||
对比 | S25FL128SAGNFI000 | Infineon Technologies AG | 查询价格 | Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | 2024-05-17 23:35:51 | compliant | Taiwan, Thailand | [object Object] | 9.8 | ||||||||||||||||||||||
对比 | S25FL128SAGNFI003 | Infineon Technologies AG | 查询价格 | Yes | Active | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | 2065 | 2024-05-17 23:32:49 | compliant | [object Object] | 9.8 | |||||||||||||||||||||||
对比 | S25FL064LABMFM010 | Infineon Technologies AG | 查询价格 | Yes | Active | 67.1089 Mbit | 8 | 8MX8 | 3 V | 108 MHz | FLASH | IT ALSO HAVE X1 MEMORY WIDTH | 2 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | S-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | 2065 | 2024-05-17 23:32:49 | compliant | [object Object] | 6.8 | |||||||||||||||||||||||||||||||
对比 | MX29GL256FUXFI-11G | Macronix International Co Ltd | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 128K | 16MX16 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 256 | 16000000 | 16.7772 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 10 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B64 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 13 mm | 11 mm | 4307504 | 2024-05-17 23:15:49 | unknown | Taiwan | [object Object] | 4.7 | BGA | LBGA, BGA64,8X8,40 | 64 | EAR99 | 8542.32.00.51 |