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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 运营商类型 | 数据速率 | 运营商类型(2) | ISDN访问速率 | 功能数量 | 最小输出高电压 | 最大输出低电流 | 最大输出低电压 | 参照点 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | HTS代码 | 零件包装代码 | 针数 | 制造商包装代码 | ECCN代码 | Country Of Origin | YTEOL | 交付时间 | |
对比 | TP3404V | National Semiconductor Corporation | 查询价格 | No | Transferred | 5 V | 144 Mbps | BASIC | 1 | 2.4 V | 1 mA | 400 mV | U | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J28 | e0 | Not Qualified | 2A | 70 °C | 245 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 11.43 mm | 11.43 mm | 4.57 mm | TP3404V | 2216 | 2023-08-01 18:42:03 | PLASTIC, LCC-28 | not_compliant | 8542.39.00.01 | |||||||||||||||
对比 | 82V2108PXG | Integrated Device Technology Inc | 查询价格 | Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG | 2068 | 2023-08-02 10:09:52 | GREEN, PLASTIC, QFP-128 | compliant | 8542.39.00.01 | PQFP | 128 | PXG128 | EAR99 | ||||||||||||||
对比 | DS26518GN+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Transferred | 1.8 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 450 µA | INDUSTRIAL | FRAMER | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | 2164 | 2023-08-05 19:28:13 | 17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, TECSBGA-256 | compliant | 8542.39.00.01 | BGA | 256 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||||||||||
对比 | DS21Q59L+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | 1 | COMMERCIAL | FRAMER | S-PQFP-G100 | e3 | Not Qualified | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2164 | 2023-08-02 13:18:51 | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 | compliant | 8542.39.00.01 | QFP | 100 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||||||||||
对比 | MT9076BB1 | Microsemi Corporation | 查询价格 | Yes | Transferred | 3.3 V | 1 | INDUSTRIAL | FRAMER | S-PQFP-G80 | e3 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2192 | 2023-07-31 17:48:09 | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80 | compliant | 8542.39.00.01 | QFP | 80 | |||||||||||||||||||||||
对比 | MT9076BP1 | Microsemi Corporation | 查询价格 | Yes | Transferred | 3.3 V | CEPT PCM-30/E-1 | T-1(DS1) | 1 | 98 µA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2192 | 2023-08-02 03:46:34 | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | 8542.39.00.01 | LCC | 68 | |||||||||||||||||||
对比 | MT9075BP1 | Microsemi Corporation | 查询价格 | Yes | Yes | Transferred | 5 V | CMOS | CEPT PCM-30/E-1 | 1 | 150 mA | INDUSTRIAL | FRAMER | S-PQCC-J68 | e3 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | 2192 | 2023-08-05 18:56:47 | LEAD FREE, PLASTIC, MS-018AE, LCC-68 | compliant | 8542.39.00.01 | LCC | 68 | ||||||||||||||||||
对比 | TP3404V/NOPB | National Semiconductor Corporation | 查询价格 | Yes | Transferred | 5 V | 144 Mbps | BASIC | 1 | 2.4 V | 1 mA | 400 mV | U | COMMERCIAL | TIME SLOT ASSIGNER | S-PQCC-J28 | e3 | Not Qualified | 3 | 70 °C | 245 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 11.43 mm | 11.43 mm | 4.57 mm | TP3404V/NOPB | 2216 | 2023-08-05 19:14:33 | PLASTIC, LCC-28 | compliant | 8542.39.00.01 | |||||||||||||||
对比 | DS34T108GN+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Transferred | 1.8 V | 1 | 550 µA | INDUSTRIAL | FRAMER | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | 2164 | 2023-08-02 04:55:39 | BGA, BGA484,22X22,40 | compliant | 8542.39.00.01 | BGA | 484 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||||||||||
对比 | DS34S104GN+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Transferred | 1.8 V | 1 | 280 µA | INDUSTRIAL | FRAMER | S-PBGA-B256 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | 2164 | 2023-08-02 00:53:09 | BGA, BGA256,16X16,40 | compliant | 8542.39.00.01 | BGA | 256 | EAR99 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||||||||||
对比 | DS26518GNB1+ | Maxim Integrated Products | 查询价格 | Yes | Transferred | FRAMER | 2164 | 2023-08-19 20:46:10 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||
对比 | PM4358-NGI | Microchip Technology Inc | 查询价格 | Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | 2024-04-20 09:10:17 | BGA, | compliant | 8542.31.00.01 | 5A991.B | [object Object] | |||||||||||||||||||||||||||||
对比 | MT8979APR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 16 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2188 | 2024-04-02 15:22:59 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | ||||||||||||||||||||||||
对比 | 82V2108PXG8 | Renesas Electronics Corporation | 查询价格 | Yes | End Of Life | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG8 | 2354 | 2024-04-20 09:04:54 | PLASTIC, QFP-128 | compliant | 0.47 | [object Object] | |||||||||||||||||||||
对比 | PM4351-RGI | Microchip Technology Inc | 查询价格 | Yes | Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | 2188 | 2024-04-20 09:10:17 | CABGA-81 | compliant | 8542.31.00.01 | 5A991.B | Thailand | 24.9 | [object Object] | |||||||||||||||||||||||||
对比 | DS2154LA2+ | Rochester Electronics LLC | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | COMMERCIAL | FRAMER | S-PQFP-G100 | e3 | COMMERCIAL | 3 | 70 °C | 260 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2178096 | 2016-06-20 18:00:17 | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | unknown | QFP | 100 | ||||||||||||||||||||
对比 | L-TTSI001041BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2022-06-02 12:37:02 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||||||
对比 | TTSI004161BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2022-06-02 12:37:02 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||||||||
对比 | L-TTSI004161BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2022-06-02 12:37:02 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||||||||||
对比 | L-TTSI002081BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2022-06-02 12:37:02 | BGA, | unknown | 8542.39.00.01 |